66results about How to "Improve density distribution" patented technology

Disclosed are a vertical GaN light emitting diode and a method for manufacturing the same. The vertical GaN light emitting diode comprises a first conductive GaN clad layer with an upper surface provided with a first contact formed thereon, an active layer formed on a lower surface of the first conductive GaN clad layer, a second conductive GaN clad layer formed on a lower surface of the active layer, a conductive adhesive layer formed on the second conductive GaN clad layer, and a conductive substrate, with a lower surface provided with a second contact formed thereon, formed on a lower surface of the conductive adhesive layer. The method for manufacturing the vertical GaN light emitting diodes comprises the step of removing the sapphire substrate from the light emitting structure so as to prevent the damages on a GaN single crystal plane of the structure.

The invention discloses a bi-directional powder pressing forming device capable of demoulding automatically. An upper mould frame is connected with a lower mould frame through guide columns; and the lower mould frame is fixed on the base board. An upper mould stamping is connected with an upper mould connecting rod which is connected with a first hydraulic cylinder. A lower mould stamping is fixed on the lower mould frame. Female moulds are mounted on the corresponding guide columns through four holes on two sides. Springs are sleeved on the corresponding guide columns of the lower faces of the females moulds and the upper face of the lower mould frame. The female moulds can float on the springs, and each is provided with a heating bar and a thermoelectric couple internally. One ends of four ejection rods are fixed on an ejection rod fixing plate, and the other ends of the ejection rods penetrate the upper mould frame and is located above the female mould. The ejection rod fixing plate is connected with a second hydraulic cylinder. By the aid of the spring floating female mould and the ejection rod structure, bi-directional pressing and automatic demoulding are achieved accurately, density distribution of a workpiece is improved, and production speed is increased. With a multi-punch and multiple-moulding-chamber structure, multiple workpieces can be produced by pressing at one time, mass production can be realized, and device utilization rate and working efficiency are increased.

An array substrate is provided, including a substrate, wherein the substrate is provided with a plurality of electrodes and a plurality of first signal lines, each of the electrodes being correspondingly connected with a first signal line. In some examples, the first signal lines extend in the same direction. In some examples, at least two of the plurality of first signal lines are located in different layers of an insulating spacer from each other. In some examples, orthographic projections on the substrate of at least two of the first signal lines in the different layers at least partially overlap. Accordingly, a light field display device comprising the array substrate is also provided. The array substrate can reduce a light-emitting point size and increase a density distribution of light-emitting points.

Disclosed is a system and method for using visible light communication (“VLC”) to perform indoor position location. Through use of a system and method configured as set forth herein, the position of any appropriately marked person or item may be found indoors using data interconnected modules that communicate with one another via RF and visible light. A mobile receiver in the form of a tag or badge attached to the person or item to be tracked receives a VLC signal from a plurality of lighting modules, and transmits back to a processor the data it received so that the processor is able determine the tag's or badge's physical position with respect to the individual network modules.