35results about How to "Good electrical conduction" patented technology

To provide functional paste with etching activity and good electrical properties. Functional paste comprising a metal powder, an etching agent, a binder and an organic solvent.

The invention discloses a USB3.1 (universal serial bus) connector socket with a full-automatic manufacturing process and an assembly manufacturing method for the USB3.1 connector socket. The connector socket comprises an SMT (surface mount technology) terminal module, a DIP (double in-line package) terminal module, a separator module, an upper EMI (electro-magnetic interference) sheet, a lower EMI sheet and a shielding case; the SMT terminal module, the DIP terminal module and the separator module are superposed vertically; the SMT terminal module, the DIP terminal module and the separator module are assembled and positioned by buckling the upper EMI sheet and the lower EMI sheet to form an inner core whole, and then, the shielding case covers the inner core whole to form the connector socket product. The USB3.1 connector socket is simple in structure and skillful and reasonable in design; the full-automatic manufacturing process of the whole connector socket product is effectively realized, so that the production efficiency is greatly increased; the processing quality is easy to control in the manufacturing process of the connector socket, so that the product quality and the product yield are improved; moreover, through a special structural design of the upper EMI sheet, the lower EMI sheet and the separator of the USB3.1 connector socket, not only is steady assembly and positioning ensured but also good electrical conduction is ensured; the anti-EMI effect of the USB3.1 connector socket is better than that of a connector in the traditional technology.

The invention relates to a high-precision etching transfer method for micro-nano structure patterns on a curved substrate. Using methods such as vacuum thermal evaporation and magnetron sputtering deposition, a layer of conductive film is prepared on the surface of curved substrates made of quartz, silicon, etc., and then through glue coating, photolithography, direct writing, wet etching or dry etching The patterned conductive film consistent with the microstructure pattern is prepared by etching and other processes, and then the conductive film layer around the curved substrate is connected to the lower electrode of the sample stage by using the metal shell and conductive tape to ensure good conductive contact and form an equipotential body. Reactive ion etching is then performed. The method can ensure that the potential of the etching area on the curved substrate is consistent, so that the exposed area of ​​the entire curved substrate is uniformly etched, and the area covered by the metal conductive film is protected. The patterned metal thin film in the invention is not only a mask but also an electrode, which solves the problem of uneven etching transmission of micro-nano structure patterns on curved substrates of dielectric materials such as quartz and silicon.

The invention particularly relates to a switch and is used to improve the structure at the contact part used for turning on and off in a switch to reduce current in each contact point and total contact resistance. The problem of poor contact at the pin joint position of a pin joint contact rod and a supporting part in the conventional switch is solved by arranging an additional elastic metal plate on the pin joint contact rod. Due to the contact part arranged on a rotary contact device at the position of a forward / reverse conversion mechanism, the total contact area is increased, current in each contact point is further reduced, and the total contact resistance and heat generation between the rotary contact device at the position of the forward / reverse conversion mechanism and an internalinput and an external output are reduced.

The embodiment of the present application relates to battery pole pieces and battery cells. A battery pole piece according to an embodiment includes: a pole piece body having a length direction and a width direction perpendicular to the length direction; and a plurality of tabs connected to the pole piece body, each of the plurality of tabs having a width The width in the direction, and the length in the length direction; wherein, the width or length of each tab is different. The battery pole piece and the battery cell provided by the embodiment of the present application can reduce the weight of the battery while improving the safety performance of the battery, and ensure that each tab in the battery pole piece can be electrically conducted well with the outside world.

The invention provides an electrode for plasma emergence. In the electrode for plasma emergence set opposed to a base plate and composed by matal base and conductor plate without broken danger of conductor plate, ensuring combination state with good uniformity between electric conduction of matal base and conductor plate and heat conduction in surface. The electrode is composed by following material: dipping metal such as Si in base metal formed by porous multiple ceramics such as silicon carbide, having metal base compound material of junction surface at least opposed to whole processed surface of the base plate; a conductor plate such as CVD-silicon carbide formed by resist plasma material melting connecting on junction surface of the metal base compound material via metal. In this condition, dipping metal in the base metal, melting connecting the conductor plate on the metal base compound material via the metal.

The invention discloses an environment-friendly electrode silver slurry of zinc oxide varistor suitable for two soldering technologies and a preparation method of the electrode silver slurry. The silver slurry is composed of 60-80% silver powder, 1-5% of metal oxide, 2-5% of leadless glass powder and 10-37% of organic carriers by weight. The preparation method comprises the steps that the leadless glass powder is prepared by that raw materials are mixed well, placed in a platinum crucible and melt, and the melt material is removed and dried to obtain the leadless glass powder; the organic carriers are prepared by adding an organic solvent into a stainless steel container, adding organic resin, carrying out heating, and carrying out cooling and adding a surfactant after the resin is completely dissolved; and the silver slurry is prepared by mixing the silver powder, the metal oxide, the leadless glass powder and the organic carriers, and stirring and grinding the mixture in a vacuum manner. The preparation method is simple and suitable for both the reflow soldering and immersed soldering technologies, the solderability and the soldering resistance are high, the silver slurry can be used to prepare common type as well as lightning protection type varistor, the adhesion force, the conductivity and the electrical performance are high, and the performance completely reach the using requirements.

The invention discloses electrocondution slurry and a preparation method and application of the electrocondution slurry. The slurry comprises, by mass percent, 30-40% of silver-graphene composite materials, 30-48% of organic resin, 5-10% of cross-linking agents and 12-26% of thinning agents. The method that the silver-graphene composite materials are prepared are as follows: graphite oxide and organic silver are added to a mixed system formed by organic solvents and deionized water, and ultrasonic dispersion is carried out on the mixture; hydrazine hydrate is dripped to the mixed system while the mixed system is stirred; after stirring is carried out for 20-30 min at room temperature, the temperature rises to 60-70 DEG C, reaction is conducted for 2-3 h, the mixture is cooled to be at the room temperature, filtered and rinsed by the deionized water, vacuum drying is carried out on the mixture, and the silver-graphene composite materials are obtained. The electrocondution slurry can meet the demands of photovoltaic devices for the electrical property under low silver content conditions and is suitable for flexible substrates, good in temperature and moisture resistance and excellent in filament printing performance, adhesive force of the electrocondution slurry and substrate ITO materials is high, and production cost of the slurry is remarkably reduced.