Upper electrode uncovering structure and semiconductor processing equipment
A technology for processing equipment and electrodes, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., and can solve problems such as radio frequency leakage, affecting process results, and poor conduction between the upper electrode and the chamber
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[0038] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0039] see figure 1 and figure 2 , a semiconductor processing equipment 200, the semiconductor processing equipment 200 includes a chamber 210, an upper electrode 220 located at the top of the chamber 210, a lower electrode (not shown in the figure) located at the bottom of the chamber 210, and an opening structure 100. An inductive coil (not shown) is provided between the upper electrode 220 and the top of the chamber 210; the inductive coil is connected to the bottom of the upper electrode 220, and rises and falls together with the upper electrode 220 when the cover is opened, or is connected to the chamber. 210 top. The cover opening structure 100 include...
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