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303results about How to "Damage is caused" patented technology

Flexible Circuit Electrode Array with Wire or Film Support

The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
Owner:CORTIGENT INC +1

System and method for laser lipolysis

A device and related method for the removal of subcutaneous adipose layers comprises a laser source; an optical fiber for conveying a laser beam emitted by the laser source; and a hollow cannula for guiding the fiber to the subcutaneous treatment area. The cannula has a curved portion at its distal end, where the curved portion can be shaped to roughly conform to the contour of the patient's body structure. In this way, laser energy from the fiber, applied to the adipose layers, is generally directed away from the lower dermis of the patient, minimizing the risk of non-reversible damage to the dermis, including skin necrosis. In another embodiment, the optical fiber is a side-firing fiber that directs the laser energy away from the dermis. In other embodiments, a radiation detector, such as a thermal or optical sensor, monitors the temperature at the surface of the skin above the treatment area to warn the operator of harmful temperatures in the lower dermis. In another embodiment, a temperature sensitive material is applied to the surface of the skin above the treatment area to warn of harmful dermal temperatures. In another embodiment, a cooling mechanism cools the surface of the skin above the treatment area to prevent damage to the dermis.
Owner:EL EN SPA

Integrated circuit wafer packaging system and method

InactiveUS20050269241A1Eliminate any forceEliminate and seriously minimize motionInternal framesSemiconductor/solid-state device manufacturingQuality assuranceIntegrated circuit
A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and / or eliminate wafer damage from breakage, scratches and / or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance / Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.
Owner:CONVEY INC
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