The invention relates to an LED (Light Emitting Diode) surface patch type encapsulating structure based on a silicon base plate, which comprises the silicon base plate, an LED chip, a circular ring convex wall and a lens, wherein the upper surface of the silicon base plate is a plane structure, an oxidation layer is covered on the upper surface of the silicon base plate, a metal electrode layer is arranged on the upper surface of the oxidation layer, the upper surface of the metal electrode layer is provided with metal convex points, a through hole penetrating through the silicon base plate is arranged below the metal electrode layer, an insulation layer covers the inner wall of the through hole and the partial lower surface of the silicon base plate, a metal connecting layer covers the surface of the insulation layer in the through hole, two electric conducting metal welding discs are respectively arranged at the lower surface of the silicon base plate and are insulated from the silicon base plate, a heat conducting metal welding disc is arranged at the lower surface of the silicon base plate, the LED chip is inversely arranged on the silicon base plate, and the LED chip and the metal electrode layer in the LED chip are isolated from the outside through the circular ring convex wall and the lens. The encapsulating structure has the advantages of good heat radiation effect and small size, also has high reliability because of no gold thread encapsulation, realizes the wafer level mass production encapsulation and hereby reduces the encapsulation cost.