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51results about How to "Density" patented technology

Ceramic composite material forming method and ceramic composite material

The invention provides a ceramic composite material forming method and a ceramic composite material, and relates to the technical field of ceramic composite material forming. According to the forming method, fiber is soaked into a sizing agent in advance, weaving is directly performed with the sizing agent, the sizing agent is continuously pouring into gaps formed between fiber during weaving, a prefab formed by weaving does not need soaking, and drying and sintering are directly performed, so that the ceramic composite material can be obtained. The forming method cancels a required process of repeatedly soaking the prefab in the traditional forming technology, greatly reduces the workload, shortens the production period, further reduces the operation cost, and improves the defects of complex forming technology, high cost and long production period in the traditional forming technology; the ceramic composite material prepared through the forming method can easily meet the required density. The invention further provides a ceramic composite material. The ceramic composite material has good density.
Owner:湖南飞航材料科技有限公司

Optical device, detection apparatus, electronic apparatus, and method for producing optical device

An optical device includes: a substrate having a dielectric layer and a plurality of metal particles; and an organic molecular layer formed by self-assembly on at least either the surface of the dielectric layer or the surfaces of the metal particles. In the organic molecular layer, a first organic molecule and a second organic molecule are alternately arranged in a first direction, and the chain length of an organic group of the first organic molecule and the chain length of an organic group of the second organic molecule are different from each other.
Owner:SEIKO EPSON CORP

Film substrate, fabrication method thereof, and image display substrate

In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.
Owner:PANASONIC CORP

Eucalyptus bark artificial sound-insulation fibreboard and manufacture method thereof

The invention relates to an eucalyptus bark artificial sound-insulation fibreboard and a manufacture method thereof. The eucalyptus bark artificial sound-insulation fibreboard belongs to veneers made of particles or fibers and characterized by being formed by using eucalyptus bark fibers as raw materials and comprising the steps of adhering and thermally pressing. The invention provides an eucalyptus bark artificial sound-insulation fibreboard with small density, strong strength, good sound-insulation effect and lower cost and the manufacture method thereof. Scraps generated by an eucalyptus bark wood-processing device are utilized, which saves the resources, protects the environment, improves the strength of the artificial sound-insulation fibreboard, optimizes the sound-insulation and heat-insulation effects and decreases the production cost. The prepared eucalyptus bark artificial sound-insulation fibreboard with the thickness of 15mm reaches the following technical indexes: the density is larger than or equal to 450 kg / m<3>, the static bending strength parallel to grain is larger than or equal to 30 MPa, the static bending strength perpendicular to grain is larger than or equal to 20 MPa, the elasticity modulus parallel to grain is larger than or equal to 4000 MPa, the elasticity modulus perpendicular to grain is larger than or equal to 3000 MPa, and the formaldehyde release amount accords with the Eo standard. The invention is suitable for sound-insulation and heat-insulation doors, windows and wall interlayers of civilian constructions, office spaces, theatres and hotels.
Owner:SHANDONG XINGANG ENTERPRISE GRP CO LTD

Semiconductor device and method of manufacturing the same

A semiconductor device includes a wiring board, a semiconductor chip mounted on the wiring board, the semiconductor chip including a bump formation surface, a plurality of first bumps provided within a first region of the bump formation surface, the first bumps being arranged in a first area density, a plurality of second bumps provided within a second region of the bump formation surface, the second bumps being arranged in a second area density, and a plurality of third bumps arranged between the first region and the second region of the bump formation surface in a two-dimensional array. The plurality of third bumps are arranged in a third area density being higher than the second area density and being lower than the first area density.
Owner:RENESAS ELECTRONICS CORP

Method for controlling the amount of dampening solution in a printing unit of a printing press

A method for controlling an amount of dampening solution in a printing unit of a printing press using a computer and a measuring device, includes setting an amount of dampening solution in the printing unit based on data of a current print job, reducing the amount of dampening solution towards a smearing threshold with the computer, recording color measurement values with the measuring device in at least one full tone area with low area coverage and in at least one halftone area with high area coverage on a printing material of the current print job, and stopping the reduction of the amount of dampening solution with the computer when a dot gain of the halftone in areas with high area coverage increases significantly and a density of the full tone in areas with low area coverage increases significantly.
Owner:HEIDELBERGER DRUCKMASHINEN AG
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