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60results about How to "Avoid light absorption" patented technology

LED

InactiveCN1564333AUniform distribution of working current densityImprove efficiencySemiconductor devicesElectrical conductorEngineering
Quadreple epitaxial layer composed of first material layer, luminous layer and second material layer is formed on a semiconductor base plate. A euphotic base plate is fixed on surface of the second martial layer. With semiconductor base plate being removed, isolation groove and first extend groove are made under undersurface of first material to penetrate the first material layer and extend to part of volume of second material layer at least. First extend electrode is setup inside first extend groove. The first extend electrode is possible to connect with first electrode positioned at partial surface of the first material layer. Thus, the first electrode is located in nearly same level position to second electrode, which is on surface of other part of the first martial layer in order to carry out next processing easily. The invention increases luminescence are of PN interface, raises luminescence brightness and service life.
Owner:OPTO TECH

Preparation method of high-luminance V-shaped polarized doped deep ultraviolet LED

The invention provides a preparation method of a high-luminance V-shaped polarized doped deep ultraviolet LED. The prepared deep ultraviolet LED structure comprises a substrate, an AlN buffer layer, astress relief layer, an N type AlGaN layer, an AlGaN / AlGaN multi-quantum-well active region and a P type AlGaN layer with V-shaped gradually changed Al components. By virtue of the P type AlGaN layerwith the V-shaped gradually changed Al components, the light emitting efficiency is improved; meanwhile, by adopting the V-shaped gradually changed structure to replace a P type AlGaN electron barrier layer, a P type AlGaN contact layer and a P type P-GaN layer, the light extracting efficiency is improved; and by virtue of the structure, the hole concentration of the P type layer is greatly improved, light absorption of the P type contact layer is avoided fundamentally, the manufacturing process is simple, and industrial production can be realized.
Owner:迪优未来科技(清远)有限公司

Method for cutting light emitting diode chip through deep etching

The invention provides a method for cutting a light emitting diode chip through deep etching. The method comprises the following steps: firstly, forming a light emitting element comprising a plurality of light emitting units on the surface of a semiconductor substrate; then fabricating a protecting layer with etching windows formed at the connections between each of the light emitting units; etching from each of the etching windows to form sliver channels; next, filling each of the sliver channels with insulation material and thinning the semiconductor substrate from back until exposing the insulation material; and finally making a back coating, removing the insulation material in each of the sliver channel, and expanding the film to obtain independent light emitting units. According to the invention, by adopting the method of forming the sliver channels through deep etching, the cut grooves are deep into the sapphire substrate, thus avoiding laser cutting processing step, avoiding the problem of light absorption caused by laser ablation, and increasing light outgoing efficiency; and the deep etching depth is equivalent to the final thickness of the chip, and separated chip grains can be obtained by removing the filled SiO2, thus reducing sliver operation, avoiding broken sides and broken corners in the slivers, and increasing the yield.
Owner:施科特光电材料(昆山)有限公司

Solar cell and photovoltaic module

PendingCN112201701AAvoid light absorptionRealize the effect of double-sided passivation contactPhotovoltaic energy generationSemiconductor devicesEngineeringSolar cell
The invention provides a solar cell and a photovoltaic module, and relates to the field of solar cells. The solar cell comprises: a semiconductor substrate, wherein the semiconductor substrate comprises a first surface and a second surface which are oppositely arranged; a first dielectric layer located on the first surface; a first N+ doped layer positioned on the surface of the first dielectric layer; a first passivation layer and/or a first anti-reflection layer located on the surface of the first N+ doped layer; a first electrode positioned on the surface of the first passivation layer and/or the first anti-reflection layer; a second dielectric layer located on the second surface; a first P+ doped layer positioned on the surface of the second dielectric layer; a second passivation layerand/or a second anti-reflection layer located on the surface of the first P+ doped layer; and a second electrode positioned on the surface of the second passivation layer and/or the second anti-reflection layer. According to the invention, the limitation that the passivation contact structure needs to be mutually balanced between transverse transmission and polycrystalline silicon film light absorption when applied to the front surface of the battery can be relieved, and the short-circuit current of the battery is improved while high open-circuit voltage is achieved.
Owner:ZHEJIANG JINKO SOLAR CO LTD +1

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device includes a semiconductor layer stacked on a substrate, a stripe-shaped ridge formed on a surface of the semiconductor layer, and electrode formed on an upper surface of the ridge and a protective film disposed on each side of the ridge. The electrode includes a flat portion having a flat surface substantially parallel to the upper surface of the ridge and sloped portions on both sides of the flat portion with each of the sloped portions having a sloped surface that is sloped with respect to the upper surface of the ridge. The protective film covers a region from a side surface of the ridge to the sloped surface of the sloped portion of the electrode.
Owner:NICHIA CORP

Light-emitting assembly

The invention discloses a light-emitting assembly, at least comprising a light-emitting laminated layer, a first transparent conductive oxide layer located below the light-emitting laminated layer, a transparent insulation barrier layer located below the first transparent conductive oxide layer, a second transparent conductive oxide layer located below the transparent insulation barrier layer, and a metal reflection layer located below the second transparent conductive oxide layer, wherein the metal reflection layer and the second transparent conductive oxide layer form an omni-directional reflector (ODR), and ohm contact is formed by the first transparent conductive oxide layer and the light-emitting laminated layer so as to increase the light-emitting efficiency of the light-emitting assembly.
Owner:EPISTAR CORP

A LED manufactured on the SiC substrate

The provided LED prepared on SiC substrate comprises: from top to bottom, a p-type AlInGaN layer with an anode, a luminous layer, a n-type AlInGaN layer with a cathode, and the clear transparent SiC monocrystal substrate with background carrier concentration less than 1X1016 / cm3 and resistivity over 103Omega. cm. this invention improves LED luminous efficiency, and fit to prepare heavy-power device.
Owner:SHANDONG UNIV

LED (Light-Emitting Diode) plane light source and method for increasing light guiding efficiency thereof

The invention relates to an LED (Light-Emitting Diode) plane light source and a method for increasing the light guiding efficiency thereof, belonging to the technical field of light sensing engineering application. The LED plane light source is characterized in that a light reflection layer is arranged between the side of a light guiding plate and a PCB (Printed Circuit Board), a light outlet is prearranged at a position on the light reflection layer corresponding to LED light sources, and the PCB, the light reflection layer and the light guiding plate clings to each other in sequence; and the LED light sources respectively arranged at two opposite sides of the light guiding plate are arranged in ways of mutual cross and ectopic complementation. One side of each of the LED light sources is additionally provided with the light reflection layer on which the light outlet is prearranged, thus the light reflection at the side of the light guiding plate is avoided, light emitted by an LED is directly led out through the light outlet by the light guiding plate, and the light incidence efficiency is increased; the LED light sources are arranged in ways of mutual cross and ectopic complementation, thus, the condition that the LED absorbs the light from the opposite LED per se is avoided, and the light guiding efficiency is increased; and on the basis of ensuring same brightness, the consumption of the LEDs can be reduced and the lost can be lowered.
Owner:PUHUAN OPTOELECTRONICS TECH SHANGHAI

Rare earth niobium tantalate fluorescent powder with adjustable luminous chroma, preparation method and application thereof

The invention relates to rare earth niobium tantalate fluorescent powder with adjustable luminous chroma, a preparation method and application of the rare earth niobium tantalate fluorescent powder. The fluorescent powder is niobate and tantalate which are activated by Eu3+, and the molecular formula of the fluorescent powder is R(1-z)EuzCaM3O10, wherein M is at least one of Nb and Ta, R is at least one of La3+, Sm3+, Gd3+, Lu3+ and Y3+, z is the molar percentage of Eu3+ doping amount, and z is greater than 0.0001 and less or equal to 1.0. The preparation method comprises the following steps of: weighing raw materials according to the proportion; porphyrizing and uniformly mixing the raw materials, and pre-sintering at a temperature of 300-1,000 DEG C; cooling, taking out the mixture and grinding; and calcining in an air atmosphere at a temperature of 1,200-1,500 DEG C. Along with the increase of the molar percentage of Eu3+ doping amount, the chroma of the fluorescent powder can be changed from blue green to white and then red. The fluorescent powder can be applied to various illumination display and photoluminescence chroma adjustment taking ultraviolet light or near-ultraviolet light as an excitation source.
Owner:扬州科丰高新产业投资开发集团有限公司

Semi-reflecting and semi-transmitting glass and preparation method thereof

ActiveCN104527165AHardness advantageHas semi-reflective and semi-transparent propertiesLaminationLamination apparatusRefractive indexPost-Procedure
The invention discloses semi-reflecting and semi-transmitting glass with the advantages of high hardness, acid and alkali corrosion resistance, alkali liquor ultrasound resistance, scratch resistance and high post-procedure machinability. The reflectivity of the semi-reflecting and semi-transmitting glass refers to any reflectivity in a range from 18 percent to 75 percent. The semi-reflecting and semi-transmitting glass comprises a glass substrate, a first low-refractive index layer, a first high-refractive index layer, a second low-refractive index layer, a second high-refractive index layer, a third low-refractive index layer, a third high-refractive index layer and a fourth high-hardness refractive index layer which are sequentially laminated with one another, wherein the first low-refractive index layer is made of SiO2; the first high-refractive index layer is made of Nb2O5; the second low-refractive index layer is made of SiO2; the second high-refractive index layer is made of Nb2O5; and the third low-refractive index layer is made of SiO2. The hardness of the semi-reflecting and semi-transmitting glass can be 7H, and the semi-reflecting and semi-transmitting glass has the advantages of acid and alkali corrosion resistance, alkali liquor ultrasound resistance, scratch resistance and high post-procedure machinability. The invention also discloses a method for preparing the semi-reflecting and semi-transmitting glass.
Owner:YICHANG NANBO DISPLAY
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