The invention discloses a
palladium removing and
copper extracting method for
copper-based
palladium plating electronic scraps. The method comprises the steps that the
copper-based
palladium plating electronic scraps and a dedplating solution composed of a compounding agent, an
oxidizing agent, a rate-accelerating additive and the like are mixed according to the proportion of 1:3-1:10, and react for 1-6 h at the temperature of 10-100 DEG C, a palladium plating layer is removed, and most of a copper base is kept;
iron powder,
zinc powder, cooper plates and the like which enter the deplating solution and are used for palladium are replaced, so that palladium is enriched again; palladium enriched objects are dissolved for liquid preparing, and palladium is separated through an extraction method; palladium strip liquor is refined to obtain palladium
powder, the recover rate of palladium is 99%, and the purity of palladium is 99.95%-99.9%; little
iron powder,
zinc powder and the like which enter the deplating solution and are used for copper are deeply replaced to obtain active copper powder, and the active copper powder can replace
iron powder,
zinc powder and the like to be used as a replacement agent used for selectively replacing palladium in the deplating solution; and the copper base is subjected to
smelting and
ingot casting, raw copper is obtained and sold, the recover rate of copper is 95%, and the purity of copper is 98%. The method has the beneficial effects that the palladium deplating efficiency is high, damage to the copper base is small, palladium and copper are high in
recovery rate, the method is simple and feasible, the amount of adopted
reagent is low, production cost is low, and energy saving and environment friendliness are achieved.