Recovery process of valuable components in waste thick film

Abstract

The invention discloses a recovery process of valuable components in a waste thick film. The recovery process comprises the steps of disassembling a thick film circuit, specifically, the waste thick film circuit is disassembled from a product by a mechanical disassembling method; soaking and separating, specifically, the disassembled thick film circuit is soaked in an acidic medium to separate a metal plate from a thick film ceramic material in the thick film circuit, and a material after separating and removing the metal plate is filtered to obtain an insoluble electronic waste; performing ball milling and sorting, specifically, after the electronic waste is dried, the ball milling is carried out by using a ball mill, and ball-milled powder is separated by hydraulically power and gravityin a gravity mixer to separate the valuable components; and performing acid washing and impurity removal, specifically, the valuable components are recovered after acid treatment. According to the recovery process, a high-temperature alkali fusion method is replaced with a wet method, and the valuable components of the waste thick film are subjected to recycling treatment.

Description

technical field [0001] The invention relates to the technical field of material recovery and recycling, in particular to a process for recovering valuable metals from waste thick-film circuit boards. Background technique [0002] Thick film circuits are developed in response to the miniaturization requirements of electronic products. Thick film circuits are the product of the combination of electronic circuit design technology and thick film process technology. Thick-film circuits are widely used in communication, military, automobile, instrument, computer, industry and other fields. There are a wide variety of products with different structures, which realize the miniaturization, combination and modularization of products. [0003] With the rapid development of science and technology at home and abroad, the rapid development of national defense equipment has greatly promoted the development of hybrid thick film integrated circuits. Today, hybrid thick film integrated circu...

AI Technical Summary

Problems solved by technology

With the acceleration of the upgrading of electrical products and electronic products, more and more waste electrical and electronic products are produced. If the waste thick film circuits contained in these products are not recycled and reused, it will not only lead to the waste of resources Great waste, but also lead to serious pollution of the environment

At present, the recovery of valuable components in thick film circuits mainly adopts high-temperature alkali fusion method. For example, the recovery of ruthenium dioxide is mainly carried out at 700 degrees with molten caustic soda, which consumes a lot of energy, costs high, and the recovery operation is highly dangerous.