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448 results about "Coating deposition" patented technology

Thermal barrier coating ceramic structure

A multilayered ceramic topcoat of a thermal barrier coating system is useful for high temperature corrosive applications such as hot section components in gas turbine engines. The ceramic topcoat includes at least two layers, each having generally columnar grain microstructures with different grain orientation directions. A preferred method of producing the multilayered ceramic topcoat includes positioning a superalloy substrate at a first angled orientation relative to a ceramic vapor cloud in an electron beam physical vapor deposition apparatus for a time sufficient to grow a first ceramic layer. The substrate is then reoriented to a second, different angled orientation for a time sufficient to grow a second ceramic layer. The ceramic layers exhibit columnar microstructures having respective grain orientation directions which are related to the first and second substrate orientations. For uniformly coating a complex contoured surface such as a turbine blade airfoil, the blade can be rotated during coating deposition at each angled orientation. Alternatively, the article may be continuously reoriented according to a predetermined speed cycle to produce generally arcuate, sinusoidal, helical, or other columnar grain microstructures.
Owner:MARIJNISSEN GILLION HERMAN +4

Use of multiple masks to control uniformity in coating deposition

The uniformity of individual layers of multiple coating materials deposited on a substrate in a vacuum deposition process (such as for manufacturing mirrors for use in ring laser gyroscopes) is improved by an apparatus and method that include changing the masks placed in front of the substrate upon which the coating materials are to be deposited. Separate masks are tuned for each particular coating material to compensate for the unique plume shape of the material, and provide a uniform deposition of that particular coating material. Each mask is positioned in front of the substrate when the material for which the mask has been tuned is being deposited. The masks are changed when the coating material is changed, without venting the chamber.
Owner:NORTHROP GRUMMAN SYST CORP

Thermal Deposition Surface Treatment Method, System and Product

A process for treating a workpiece, said process comprising the steps of: (c) altering the temperature of a workpiece surface wherein at least one condition selected from the group of: thermal treatment rate, relative motion between the surface and said thermal treatment rate, coolant flow rate onto said surface, heating flow rate onto said surface and the relative speed between the heating means or the cooling means and the surface is controllable; (d) simultaneously measuring temperatures at a plurality of locations over the surface of the workpiece; (c) determining an average temperature of the temperatures measured in step (b); (d) comparing the average temperature to a preselected minimum temperature and a preselected maximum temperature for the workpiece; and (e) automatically adjusting at least one of the controllable conditions if said average temperature is not between the preselected minimum temperature and the preselected maximum temperature for the workpiece. A system for performing a thermal treatment process and the resulting product are also provided. Standard deviations of all temperature readings and controlling the relative motion speed between the thermal coating deposition head and the workpiece provide another improvement for obtaining temperature uniformity over the workpiece surface.
Owner:AIR PROD & CHEM INC

Base material motion type device and method for preparing nano coating through plasma discharge

The invention discloses a base material motion type device and method for preparing a nano coating through plasma discharge, and belongs to the technical field of plasmas. The device comprises electrodes, a vacuum exhaust device, a gas pipeline and a base material fixing device; and the method comprises the following steps that the base material fixing device can do motions in the space formed by the electrodes under the driving of a moving mechanism, and monomer steam is introduced into a reaction chamber to carry out plasma chemical vapor deposition, wherein the deposition process comprises a pretreatment stage and a coating stage, the plasma discharge mode in the pretreatment stage is high-power continuous discharge and the plasma discharge mode in the coating stage is small-power continuous discharge. In the preparation process of the coating, the movement characteristic of the base material and the plasma discharge energy are combined and linked; the base material does motions while the plasma discharge occurs, so that the coating deposition efficiency is improved, and the uniformity and compactness of the thickness of the coating are improved; and the coating prepared by the method has the characteristics of being waterproof, moisture-proof, and anti-fungus, and has acid solvent resistance, alkaline solvent resistance, acid salt mist resistance, alkaline salt mist resistance and the like.
Owner:JIANGSU FAVORED NANOTECHNOLOGY CO LTD

Atomic plasma deposited coatings for drug release

Nanophase single or multiple layer time release coatings over drugs attached to metal surfaces are described. The coatings are deposited over a drug attached to a porous metal substrate using an atomic plasma deposition procedure. Porosity of the substrate and the number of APD deposited layers controls drug release when the attached drug is exposed to an aqueous medium.
Owner:NANOSURFACE TECH

Damage-free sculptured coating deposition

We disclose a method of applying a sculptured layer of material on a semiconductor feature surface using ion deposition sputtering, wherein a surface onto which the sculptured layer is applied is protected to resist erosion and contamination by impacting ions of a depositing layer, said method comprising the steps of: a) applying a first portion of a sculptured layer with sufficiently low substrate bias that a surface onto which said sculptured layer is applied is not eroded away or contaminated in an amount which is harmful to said semiconductor device performance or longevity; and b) applying a subsequent portion of said sculptured layer with sufficiently high substrate bias to sculpture a shape from said the first portion, while depositing additional layer material. The method is particularly applicable to the sculpturing of barrier layers, wetting layers, and conductive layers upon semiconductor feature surfaces and is especially helpful when the conductive layer is copper. In the application of a barrier layer, a first portion of barrier layer material is deposited on the substrate surface using standard sputtering techniques or using an ion deposition plasma, but in combination with sufficiently low substrate bias voltage (including at no applied substrate voltage) that the surfaces impacted by ions are not sputtered in an amount which is harmful to device performance or longevity. Subsequently, a second portion of barrier material is applied using ion deposition sputtering at increased substrate bias voltage which causes resputtering (sculpturing) of the first portion of barrier layer material, while enabling a more anisotropic deposition of newly depositing material. A conductive material, and particularly a copper seed layer applied to the feature may be accomplished using the same sculpturing technique as that described above with reference to the barrier layer.
Owner:APPLIED MATERIALS INC

Coatings for glass reinforced faced gypsum board

A coating method for gypsum board having a surface gypsum layer in which a polymer additive has been entrained including forming a gypsum board including the polymer additive entrained in a surface layer, application of a preferably acrylic primary coating, curing and drying the gypsum board, passing the gypsum board through a first roll coater wherein a second fluid coating is deposited over the primary layer of the dried, coated gypsum board in which the polymer additive has been entrained, the coating then being dried and cured, wherein the coating material of the primary coating forms a chemical bond with the polymer additive entrained in the surface layer of the gypsum board and the polymer of the primary coating forms a chemical bond with the second fluid coating. A coating material which can form copolymer bonds with the second coating is then deposited on the second coating and then dried and cured, resulting in coated gypsum board having a low surface tension surface that is essentially impermeable to water and vapor or moisture penetration.
Owner:BPB LTD

Process for inhibiting SRZ formation and coating system therefor

A process for reducing the incidence of a secondary reaction zone (SRZ) in alloys prone to SRZ formation, particularly superalloys that have a high refractory element content. The process finds use with articles having a wall region that defines external and internal surfaces on the exterior and within the article, respectively. Diffusion coatings are formed on the internal and external surfaces of the article, with at least the diffusion coating on the external surface comprising an additive layer and a diffusion zone that is beneath the additive layer and extends into the wall region. The additive layer and at least a portion of the diffusion zone of the external diffusion coating is then removed to define an exposed surface region on the exterior of the article. An overlay coating is then deposited on the exposed surface region.
Owner:GENERAL ELECTRIC CO

Apparatus and methods to form a patterned coating on an OLED substrate

An apparatus for applying a patterned coating to an OLED substrate in a continuous roll-to-roll vapor based deposition process is provided comprising a vapor deposition source, a processing drum, a drive roller, and a shadow mask wherein the shadow mask comprises a mask line feature that selectively prevents deposition of the coating onto the substrate. Also presented is a method for applying the coating.
Owner:GENERAL ELECTRIC CO

Continuous in-line manufacturing process for high speed coating deposition via a kinetic spray process

An improved kinetic spray system and a method for using the same in a high speed manufacturing environment are disclosed. The improved kinetic spray nozzle system comprises: a gas / powder exchange chamber connected to a first end of a powder / gas conditioning chamber having a length along a longitudinal axis of equal to or greater than 20 millimeters; a converging diverging supersonic nozzle, the supersonic nozzle having a converging section separated from a diverging section by a throat, the diverging section comprising a first portion and a second portion, with the first portion having a cross-sectional area that increases along a length of the first portion and with the second portion having a substantially constant cross-sectional area along a length of the second portion; and the converging section connected to a second end of the powder / gas conditioning chamber opposite the first end. The method includes: use of the disclosed nozzle system with the addition of hard particles that permit maximum enhancement of particle temperature while not permitting clogging of the nozzle; use of controlled particle feed rates to match the desired very high traverse speeds; and use of pre-heating of the substrate to clean it an to enhance particle bonding. With the disclosed nozzle system coupled with the disclosed methods one can apply kinetic spray coatings at traverse speeds of over 200 centimeters per second with a deposition efficiency of over 80 percent.
Owner:F W GARTNER THERMAL SPRAYING
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