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1785results about How to "Increase surface tension" patented technology

Coating process for microfluidic sample arrays

InactiveUS20060105453A1Minimizes average amount of errorSerious errorSequential/parallel process reactionsLaboratory glasswaresEngineeringFixed position
A differentially coated device for conducting a plurality of nano-volume specified reactions, the device comprising a platen having at least one exterior surface modified to a specified physicochemical property, a plurality of nano-volume channels, each nano-volume channel having at least one interior surface in communication with the at least one exterior surface that is selectively coated with an optionally dissolvable coating agent physisorbed to at least one interior surface, wherein the optionally dissolvable coating agent comprises a coating agent and a first component for the plurality of specified reactions. Methods for preparing and using such devices are also provided, as well as a method of registering a location of a dispenser array in relation to a microfluidic array. A first one of the dispenser array and the microfluidic array is movable in relation to the frame, and the other of the first one of the dispenser array and the microfluidic array is fixed relative to the frame. Quantities related to a vector displacement from the alignment position to a fixed position on the one of the dispenser array and the microfluidic array is determined. The quantities thus determined are used to guide positioning of the dispenser array relative to the microfluidic array.
Owner:LIFE TECH CORP

Ceramic material for 3D light curing formation printing and preparation method of ceramic element

The invention relates to a ceramic material for 3D light curing formation printing and a preparation method of a ceramic element. The ceramic material is prepared from 30 to 70 vol percent of ceramicpowder and 30 to 70 vol percent of photosensitive resin premixed liquid, wherein the photosensitive resin premixed liquid is prepared from 37 to 50 weight percent of oligomers, 30 to 60 weight percentof reactive diluents, 0.1 to 5 weight percent of photoinitiators, 1 to 5 weight percent of dispersing agents, 0.1 to 0.6 weight percent of ultraviolet blocking agents, 0 to 0.05 weight percent of polymerization inhibitors, 1 to 4 weight percent of anti-foaming agents, 0.5 to 2.35 weight percent of anti-settling agents and 0.3 to 3 weight percent of leveling agents. In the degreasing and sinteringpost-treatment work procedures, specific parameters are used, so that a sintering element can reach good sintering density and mechanical performance. By optimizing the composition and the proportionof light curing ceramic resin, and selecting the excellent dispersing agent combination and the reasonable consumption, the ceramic powder can be better dispersed in the resin; the problems that theexisting light curing ceramic resin has poor flowability and low formation precision, and that a finally prepared ceramic product can easily generate cracks or deformation, and the like are solved.
Owner:西安点云生物科技有限公司

Barrier material comprising a thermoplastic and a compatible cyclodextrin derivative

A barrier film composition can comprise a thermoplastic web comprising a thermoplastic polymer and a dispersed cyclodextrin composition having substituents that compatibilize the cyclodextrin in the film. The thermoplastic / cyclodextrin film obtains substantial barrier properties from the interaction between the substituted cyclodextrin in the film material with a permeant. The substituents on the cyclodextrin molecule causes the cyclodextrin to be dispersible and stable in the film material resulting in an extrudable thermoplastic. Such materials can be used as a single layer film material, a multilayer film material which can be coated or uncoated and can be used in structural materials wherein the thermoplastic is of substantial thickness resulting in structural stiffness. The cooperation between the cyclodextrin and the thermoplastic polymer provides barrier properties to a web wherein a permeant can be complexed or entrapped by the cyclodextrin compound and held within the film preventing the permeant from passing through the film into the interior of a film, an enclosure or container. The permeant can comprise a variety of well known materials such as moisture, aliphatic or aromatic hydrocarbons, monomer materials, off flavors, toxic compounds etc.
Owner:CELLRESIN TECH

Microelectronic assemblies having very fine pitch stacking

A microelectronic assembly includes two or more microelectronic packages stacked at a fine pitch, which is finer than the pitch that is possible when using solder balls for making the joint. Each stackable package desirably includes a substrate having pins projecting from one surface of the substrate and solder balls projecting from the other surface of the substrate. Each stackable package may have one or more die attached to one or more of the surfaces of the substrate. In certain embodiments, die may be attached to both surfaces of the substrate. The dies may be electrically interconnected with the substrate using wire bonds, flip chip bonding, leads and/or stud bumping. The die may be encapsulated in an encapsulated material, under-filled or glob topped. In certain preferred embodiments, the combination of the conductive post height and ball height is equal to or greater than the height of the encapsulated or molded chip structure. The combination of the conductive post height and the ball height must be at least equal to the height of the encapsulated chip structure so that the conductive elements are able to span the gap between layers of the assembly. After the tips of the conductive pads are in contact with the solder masses, the solder masses are reflowed to form a permanent electrical interconnection between the stacked microelectronic packages. During reflow, the reflowed solder will wick up around the conductive posts to form elongated solder columns. In addition, when the solder is reflowed, surface tension pulls the opposing layers of the assembly toward one another and provides a self-centering action for the conductive posts.
Owner:TESSERA INC

Semiconductor device and manufacturing method thereof and method for writing memory element

An object is to provide a higher-performance and higher-reliability memory device and a semiconductor device provided with the memory device at low cost and with high yield. A semiconductor device of the invention has a memory element including an insulating layer and an organic compound layer between first and second conductive layers. When melting, an organic compound of the organic compound layer aggregates due to surface tension of the organic compound. By applying a voltage to the first and second conductive layers, writing to the memory element is carried out.
Owner:SEMICON ENERGY LAB CO LTD

Coatings for glass reinforced faced gypsum board

A coating method for gypsum board having a surface gypsum layer in which a polymer additive has been entrained including forming a gypsum board including the polymer additive entrained in a surface layer, application of a preferably acrylic primary coating, curing and drying the gypsum board, passing the gypsum board through a first roll coater wherein a second fluid coating is deposited over the primary layer of the dried, coated gypsum board in which the polymer additive has been entrained, the coating then being dried and cured, wherein the coating material of the primary coating forms a chemical bond with the polymer additive entrained in the surface layer of the gypsum board and the polymer of the primary coating forms a chemical bond with the second fluid coating. A coating material which can form copolymer bonds with the second coating is then deposited on the second coating and then dried and cured, resulting in coated gypsum board having a low surface tension surface that is essentially impermeable to water and vapor or moisture penetration.
Owner:BPB LTD
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