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Nano metal fluid with high heat-transfer performance

A nano-metal, high heat transfer technology, applied in the field of cooling fluid working medium, can solve the problems of easy deposition of nano-fluid coolant, poor cooling performance of metal fluid, high price, etc., to increase price, strong heat transfer capacity, and reduce costs Effect

Active Publication Date: 2007-05-02
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problems existing in the prior art, the present invention provides a nano-metal fluid with high heat transfer performance, which solves the problem that the current metal fluid used as the cooling medium is too expensive, and the metal fluid with low price has poor cooling performance. When ordinary fluid is used as fast reactor coolant, it is easy to cause leakage, and the existing nanofluid coolant is prone to deposition problems

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0031] The nano-metal fluid provided by the invention uses liquid metal as a solvent, and the liquid metals at normal temperature or low temperature that can be selected include: mercury, melting point-38.72°C; gallium, melting point 29.8°C; gallium-indium series alloys (such as 62.5%Ga , 21.5% In, 16% Sn), melting point 10.7°C; and other low melting point metals at medium or low temperature, including lead, 327.5°C, bismuth, 271.4°C, tin, 232.0°C; chromium, 321.1°C; this nano metal The liquid solvent in the fluid includes alloys formed by one or more of the above metals, and alloys formed by the above metals and other metals. Liquid metals at high and medium temperatures include alkali metal series or their alloys, as well as alloys formed with other metals.

[0032] The metal nanoparticles used in the nano-metal fluid of the present invention include ordinary metal particles such as copper, aluminum, iron, etc. with a diameter ranging from 1 to 900 nm, and also include preci...

Embodiment 2

[0035] In addition to the above-mentioned metal nanoparticles, the solute of the nano-metal fluid of the present invention can also use particles of transition element materials such as boron, silicon, germanium, arsenic, etc. with a diameter in the range of 1 to 900 nm. And liquid metal solvent is identical with embodiment 1.

Embodiment 3

[0037] In addition to the metal nanoparticles and transition element material particles described above, the solute of the nano-metal fluid of the present invention can also use a material with a diameter in the range of 1 to 900 nm and a diameter in the range of 1 to 900 nm with high thermal conductivity. Carbon nanotubes, graphite material particles as part of the fluid.

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Abstract

This invention provides a high heat transfer performance liquid nano-metal. It relates to cooling fluid working medium, and especially it can be used under high rush density condition which need high intensity cooling fluid working medium for heat exchanging and cooling, such as computer array and reactor. The solvent of this invention is liquid metal, and the soluble of this invention is nanometer particle. This invention solve the problem of high price of present metal liquid cooling working medium and the limited performance of common metal liquid, leaking out easily taken place using common liquid and easy forming sediment of present nanometer cooling agent.

Description

technical field [0001] The invention relates to a cooling fluid working medium for ultra-high power density radiators, in particular to a cooling fluid working fluid suitable for high heat flux conditions such as computer chips and reactors, which require high-intensity heat exchange and cooling environments . Background technique [0002] As we all know, the current heat dissipation of computer chips mainly uses forced air convection to cool heat-generating devices, but the heat dissipation of this method is limited. Therefore, people are gradually trying to use water cooling or other organic liquids to realize heat dissipation; the proposal of low melting point liquid metal chip heat dissipation technology (Liu Jing, Zhou Yixin, a heat dissipation device for chip heat dissipation, authorization number: 02257291.0), and liquid cooling way forward a big step forward. In this method, the heat dissipation working fluid is a metal whose thermal conductivity is much higher tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/12H01L23/34H05K7/20G06F1/20
Inventor 马坤全刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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