The invention discloses a
heat pipe and a manufacturing method of the
heat pipe. The
heat pipe and the manufacturing method of the heat
pipe can achieve cooling of electronic devices and a device. According to the heat
pipe, a
pipe shell is arranged on the outermost portion, a steam chamber is formed in the innermost portion, the steam chamber is divided into an
evaporation segment, a
thermal insulation segment and a condensation segment in the axial direction of the steam chamber, the
thermal insulation segment is arranged in the middle, the
evaporation segment and the condensation segment are arranged at the two ends respectively, a cylindrical capillary liquid absorption core layer formed by a multi-hole foamy
copper liquid absorption core is closely attached to the inner wall of the pipe shell, holes in the multi-hole foamy
copper liquid absorption core are different in hole
diameter, a silk screen supporting frame is closely attached to the inner wall of the capillary liquid absorption core layer, the steam chamber is filled with a
metal oxide water-based
nanofluid working medium, the volume of the
nanofluid working medium is 40% to 60% that of the
evaporation segment, and
metal oxide is aluminum
oxide or
copper oxide or
silicon dioxide. According to the heat pipe and the manufacturing method of the heat pipe,
nanofluid and multi-hole foamy copper are combined in the heat pipe, and the
heat transfer efficiency of the heat pipe is improved.