34results about How to "Strong signal transmission ability" patented technology

The invention discloses a printed circuit board. The printed circuit board comprises a first layer and a second layer, wherein the first layer is provided with a pair of differential signal lines; the second layer comprises a cross groove; with respect to the two differential signal lines, the widths of the portions which are not positioned above the cross groove are less than those of the portions which are positioned above the cross groove; and with respect to the two differential signal lines, the space between the portions which are not positioned above the cross groove are greater than that between the portions which are positioned above the cross groove. The printed circuit board avoids the discontinuity of impedance by increasing the line widths of the portions of the differential signal lines positioned above the cross groove, so the signal transmission capacity of the differential signal lines positioned above the cross groove can be improved well.

A low-cost system for wireless, bi-directional transformation of electric signals over a capacitive interface between a host unit and a guest unit is provided. The system allows a high impedance in the circuitry of the guest unit to obtain a good signal transfer ability in conditions of poor dieelectric materials, poor conductivity in the contact pads and relatively large gaps between the contact pads. The capacitive interface comprises a respective first (A1; B1), second (A2; B2) and third (A3; B3) conductive area in the host and guest units (10,40). The first conductive area (A1) of the host unit is connected to a self-tuning frequency generating resonant circuit (16) in the host unit (10) for obtaining high gain of signals transmitted to the guest unit (40). The second and third conductive areas (A2, A3) of the host unit are connected to an impedance circuit (30) in the host unit for receiving signals from the guest unit. The first and second conductive areas (B1, B2) of the guest unit are further connected to an impedance circuit (44) in the guest unit for receiving signals from the host unit. In a preferred embodiment, the first and third conductive areas (B1, B3) of the guest unit are also galvanically interconnected.

The invention relates to the electric connector technical field and relates to a flat cable connecting terminal and a manufacturing method thereof. The wiring end of the terminal is provided with an electric conduction fixing connection portion; the electric conduction fixing connection portion is connected with a flat cable and is in electric conduction with the flat cable; a reinforcing wire connection portion extends out from the electric conduction fixing connection portion towards the extension direction of the flat cable; the reinforcing wire connection portion is fixedly connected with the flat cable; and the reinforcing wire connection portion and the terminal are fabricated integrally. A material belt is pierced, so that the terminals can be molded in the material belt in a split manner; the wiring ends of adjacent terminals on the material belt are molded in a batched manner; when the wiring end of a certain terminal is molded, the adjacent terminal of the terminal moves away, so that the wiring end of the terminal can be thinned, punched and molded; and the wiring ends of the terminals are molded alternately, so that rows of flat cable connecting terminals can be obtained through shaping. The manufacturing method is simple. The reinforcing wire connecting portion is additionally adopted and is fixedly connected with the flat cable, and therefore, the strength of the connection of the flat cable and the connecting terminal can be improved, the excellent signal transmission capacity of the flat cable can be ensured, and the service life of the flat cable can be prolonged.

The present invention relates to the technical field of wire materials and particularly relates to a wire component and an electronic device. The wire component includes a conductive member transmission wire and a conductive adhesive, the conductive member is provided with a strip-shaped slot, and the transmission wire is embedded in the slot. The transmission wire includes a base material covering an opening of the slot, a signal wire located in the base material and first and second ground wires disposed on two sides of the base material, the first ground wire is exposed outside the openingof the slot, the first ground wire is electrically and fixedly connected to the conductive member, and the second ground wire is fixedly connected to a bottom of the slot through the conductive adhesive. The electronic device includes the above wire component, and the conductive member of the wire component is a metal frame of the electronic device. The wire component and the electronic device ofthe present invention have the advantages of small volume and good signal transmission performance.

This invention relates to an electric connector and an assembling method, in which, the connector is composed of a signal module and a metal sleeving wrapping on them, the signal module includes a central terminal, metal tube and a plastic body with a collecting cavity formed on the front, the central terminal has a connecting part extending to back of the body, an end-to-end part extending into the collecting cavity, the metal tube is inbuit in the plastic body and its end-to-end part extends to the collecting cavity of the body. The assembling process includes ejection and formation and assembling the shell, the first step is to put the central terminal, metal shell and the body to injection moulding and second is to sleeve the metal sleeving on the signal module.

The invention discloses an electrical connector for electrically connecting a chip module, comprising: a circuit board, a plurality of conductive pads are arranged on the upper surface, a plurality of terminals, the terminals have a welding part, the The welding part is laser welded to the conductive pad, so that the welding part and the conductive pad are melted to form a molten pool, and a solder paste is provided around the molten pool, and the solder paste connects the soldered part to the conductive pad. The conductive gasket is welded, and the material of the welding part and the material of the conductive gasket are fused together by laser, so the strength of the welding part welded to the conductive gasket is very stable. When the chip module is pressed down During the terminal, the welding part will not be separated from the conductive pad, so as to ensure a good electrical connection between the electrical connector and the circuit board, and solder paste is provided around the molten pool, which increases the contact between the welding part and the conductive pad The area reduces the electrical impedance during signal transmission, thereby providing good signal transmission performance between the chip module and the circuit board.

The invention relates to a multilayer PCB circuit board, and the total layer number is an even number which is not smaller than 8. The multilayer PCB circuit board comprises a base board, and the base board comprises a first power supply layer and a first grounding layer which are vertically arranged; multiple second grounding layers and multiple second power supply layers are sequentially distributed on the upper surface of the first power supply layer from bottom to top in a staggered mode, and multiple third power supply layers and multiple third grounding layers are sequentially distributed on the lower surface of the first grounding layer from top to bottom in a staggered mode; a signal layer is arranged between the first power supply layer and the second grounding layer adjacent to the first power supply layer, between each second grounding layer and the corresponding second power supply layer adjacent to the second grounding layer, between the first grounding layer and the third power supply layer adjacent to the first grounding layer, between each third power supply layer and the corresponding third grounding layer adjacent to the third power supply layer, on the upper surface of the uppermost layer and on the lower surface of the lowermost layer. The multilayer PCB circuit board is reasonable in design, excellent in electromagnetic compatibility and high in anti-electromagnetic interference and signal transmission capacity, all the properties are more balanced, and the properties of electronic products are greatly promoted.

A method for forming an SRAM unit, comprising: forming: first, second, third, fourth, fifth, and sixth fins; a first grid across the first, second, and third fins; across the first, second The second gate of the fin, the first and second fins between the first and second gates are the first drain; the third gate across the fourth, fifth and sixth fins is across the fifth, The fourth gate of six fins, the fifth and sixth fins between the third and fourth gates are the second drain; the fifth source and third drain of the third fins on both sides of the first gate ; the sixth source and the fourth drain of the fourth fin on both sides of the third gate; forming an interlayer dielectric layer; the first patterning forms a first trench, across the first and second fins of the first drain part, the third fin of the third drain; the second patterning forms a second trench, across the fifth and sixth fins of the second drain, and the fourth fin of the fourth drain; in the first trench The groove forms the first metal layer, and the second groove forms the second metal layer. SRAM cells are realized technologically.

The invention provides a touch electrode structure, a touch substrate and a preparation method thereof, a display panel, and a display device, belonging to the field of touch technology, which can at least partly solve the uneven signal at different positions of the touch electrode in the existing touch substrate The problem. The touch electrode structure of the present invention includes: a touch electrode made of transparent conductive material; a signal line corresponding to the touch electrode, at least one insulating layer is arranged between the signal line and the touch electrode; A conductive structure, the auxiliary conductive structure is connected to the touch electrode at multiple positions; and a first insulating layer is provided between the auxiliary conductive structure and the signal line, and the touch sensor is connected to the first via hole in the first insulating layer. The signal line corresponding to the electrode is connected.