267results about How to "Stress resistant" patented technology

Resilient surgical meshes that, in some aspects, can be compressed or otherwise configured, for minimally invasive delivery in the intervertebral discs are provided. According to one or more embodiments, the surgical mesh can be robust, fatigue resistant, stable and capable of withstanding the dynamic environment generic to intervertebral discs.

Methods and systems for stacking multiple chips with high speed serialiser / deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser / deserialiser blocks, using the TSVs.

A flat IC tag contains memory means capable of data storage and transmission means capable of data transmission. The IC tag has on a surface thereof an unvulcanized rubber having identical properties to the unvulcanized rubber used for an article to which the IC tag is mounted. The opposite surface of the IC tag is mounted to the article before vulcanization. The article is vulcanized in this state to mount the IC tag to the article. Hence, the IC tag is not damaged if attached to tires and other articles in harsh operating environment.

A computer printer compatible index tabs assembly that includes a carrier sheet recognizable by any of a wide variety of computer compatible printing devices. The carrier sheet includes a plurality of self-adhesively secured tabs each formed from a resilient, durable thin film. The self-adhesive is formulated to either permanently or releasably adhere to a peripheral edge of a sheet of material which is to be tagged, labeled or indexed. After printing, the index tab is transferred from the carrier sheet and positioned with the self-adhesive securing the index tab to the sheet of material and with the indicia projecting outwardly from the edge for convenient display.

A self-bonding coating composition for the production of electrical steel sheets cores comprising A) 100 parts per weight of at least one epoxy resin based on bisphenol-A-type and / or bisphenol-F-type, 100% of solids, B) 0.1 to 200 parts per weight of nano particles having an average radius ranging from 2 to 600 nm, C) 0 to 25 parts per weight of at least one curing agent selected from the group consisting of dicyandiamide, blocked isocyanate and Lewis acid or selected from the group consisting of phenolic resin, carboxylic acid, anhydride and Lewis acid, 100% of solids, D) 0.1 to 10 parts per weight of at least one additive, and E) 50 to 200 parts per weight of water or at least one organic solvent, ensuring increased re-softening temperatures as well as excellent bonding strength, corrosion resistance and electrical insulation of the coating.

A mold-concrete composite crossbeam includes a H-steel composed of upper and lower flanges and a web connecting them; a concrete member formed in a length direction of the H-steel to expose the upper flange out but bury the lower flange and the web partially; deck plate supports installed to both upper side edges of the concrete member to support a deck plate placed thereon; a reinforcing steel bar installed around the H-steel; a mold including a bottom detachably coupled to a lower end surface of the concrete member, and sidewalls formed in parallel to both sides of the bottom and detachably coupled to both end sides of the concrete member; a lateral reinforcing member coupled across both sidewalls; a side reinforcing member installed to an outer side of the sidewalls in a length direction; and bottom reinforcing members installed across a lower surface of the bottom.

When letters are written with a ballpoint pen, pen pressure is greater than or equal to 10 MPa. The IC tag embedded in the paper base material is required to withstand such pen pressure. An integrated circuit including a functional circuit which transmits and receive, performs arithmetic of, and stores information is thinned, and also, when the integrated circuit and a structural body provided with an antenna or a wiring are attached, a second structural body formed of ceramics or the like is also attached to at the same time. When the second structural body formed of ceramics or the like is used, resistance to pressing pressure or bending stress applied externally can be realized. Further, a part of passive elements included in the integrated circuit can be transferred to the second structural body, which leads to reduction in area of the semiconductor device.

The invention discloses a fiber reinforced magnesium oxychloride red mud plate and a preparation method, and belongs to the utilization technology of waste material-red mud produced in alumina industry. The plate mainly comprises a solid blending material and brine, wherein the weight ratio of the brine is 15-30%, and the solid blending material comprises the following components by weight ratio: 30-70% of red mud, MgO of 25-60 % and 5-10% of reinforcing fiber; and 0.5-5% of modifier is added into the brine. The wet red mud, the magnesium oxide, the reinforcing fiber and the brine added with the modifier are subjected to extrusion molding by roller pressure after being uniformly mixed, naturally harden after solidification, and form a standard material or profile after shear processing. The plate is of a high-strength solidification plate with high content of red mud, has the advantages of fireproof, waterproof and anti-static performances, heat and noise insulation, strong pressure resistance, good fracture resistance, good corrosion resistance and the like, is widely used in construction, decoration and other industries, and can digest a lot of red mud to truly turn waste into wealth.