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261results about How to "Stable reliability" patented technology

Method for establishing D2D multicast communication and allocating wireless source thereof in IMT-A system

A method for establishing D2D multicast communication and allocating wireless source thereof in the IMT-A system is used for the data communicating service based on local sharing in the system. The multimedia multicast technology is introduced into the D2D technology for solving the high-speed data sharing request of one mobile terminal on multiple mobile terminals to realize the eNB-assisted D2MD communication under the IMT-A honeycomb network. The method comprises a control signaling interactive progress of the eNB and the D2MD group in the communication establishing process and a wireless source allocating progress of the eNB for the D2MD group. The method for establishing the D2D multicast communication and allocating wireless source thereof in the IMT-A system has the advantages of reducing the eNB load under the IMT-A, and greatly improving the spectral efficiency and throughput capacity of a cell as the D2MD can reuse the spectral source under the premise of not affecting the communication of honeycomb users. The wireless source allocating progress of the eNB for the D2MD comprises three steps of mode selecting, spectrum allocating and power controlling. The method aims at the applying requests of the D2MD users, ensures the QOS (quality of service) of all users as much as possible, is simple in operation, clear in algorithmic logic and low in complexity, and has better promoting and applying prospects.
Owner:BEIJING UNIV OF POSTS & TELECOMM

Piezoelectric-static compound micro machine vibration energy collector and manufacture method thereof

The invention relates to a piezoelectric-static composite micro machine vibration energy collector and a manufacture method of the collector, and relates to an energy collecting device. The piezoelectric-static composite micro machine vibration energy collector comprises a chip main body and a chip external circuit, wherein the chip main body is of a three-layer laminated structure, and the chip main body comprises an upper glass piece device, an SOI (Silicon On Insulator) piece device, a lower glass piece device, a piezoelectric ceramic wafer device, a piezoelectric ceramic wafer electrode and a variable capacitance plate electrode. The chip external circuit is provided with a rectification circuit, a filter capacitor, a first switch, a second switch and an energy storage capacitor, or is provided with a rectification circuit, a filter capacitor, a first switch, a second switch and an energy storage capacitor and a variable capacitance plate starting power supply. The manufacture method comprises the following steps of: manufacturing the lower glass piece device; manufacturing the SOI piece device; manufacturing the upper glass piece device; assembling; and connecting the chip external circuit. According to the collector and the manufacture method, the process is simple, the defects of poorer device stability and performance and the like caused by,manufacturing a PZT (Piezoelectric Transducer) by using the traditional sol gel can be overcome, and wide band and high efficiency collection of energy can be realized.
Owner:XIAMEN UNIV +1

Plastering gypsum and preparation method thereof

ActiveCN105130354AImprove cohesionImprove crack toughnessPlasticizerToughness
The invention provides plastering gypsum which includes, by weight, 40-60 parts of building gypsum, 32-55 parts of quartz sand, 5-20 parts of heavy calcium powder, 0.35-1.50 parts of a tackifier, 0.05-0.50 parts of a water retention agent, 0.02-0.08 parts of a set retarder, 0.10-0.50 parts of a plasticizer, 1.0-10.0 parts of an anti-cracking agent and 0.0-5.0 parts of a light-weight filling material, wherein the anti-cracking agent includes 80-95 wt% of heavy calcium powder and the balanced being aramid fiber. The plastering gypsum is added with the anti-cracking agent, so that the plastering gypsum is improved in anti-crack toughness. In addition, the plastering gypsum is also added with the light-weight filling material, which can dissipate shrinkage stress generated by volume reduction of the plastering gypsum due to moisture volatilization, thereby further ensuring a leveling layer of the plastering gypsum to be free of cracking. The invention also provides a preparation method of the plastering gypsum.
Owner:MEICHAO GROUP

High-frequency power amplification module and radio communication device

In a high frequency power amplifier module of a multi-stage structure in which a plurality of heterojunction bipolar transistors (npn-type HBTs) are cascade-connected, a protection circuit in which a plurality of pn junction diodes are connected in series is connected between the collector and emitter of each HBT. The p-side is connected to the collector side, and the n-side is connected to the emitter side. A protection circuit in which pn junction diodes of the number equal to or smaller than that of the pn junction diodes are connected in series is connected between the base and the emitter. The p-side is connected to the base side, and the n-side is connected to the emitter side. With the configuration, in the case where an overvoltage is applied across the collector and emitter due to a fluctuation in load on the antenna side, the collector terminal is clamped by an ON-state voltage of the protection circuits, so that the HBT can be prevented from being destroyed. Since the similar protection circuit is assembled between the base and emitter, even when the operator touches the module at the time of manufacturing the high frequency power amplifier module, the HBT can be prevented from being destroyed by the clamping effect of the protection circuit between the base and emitter and the protection circuit between the collector and emitter. Thus, an improved manufacturing yield of the high frequency power amplifier module and a wireless communication apparatus can be achieved, and destruction caused by fluctuation in load impedance of the wireless communication apparatus can be prevented.
Owner:RENESAS ELECTRONICS CORP

Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film

Disclosed is a method for producing a metal particle dispersion wherein a metal compound is reduced by using carbodihydrazide represented by the formula (1) below or a polybasic acid polyhydrazide represented by the formula (2) below (wherein R represents an n-valent polybasic acid residue) in a liquid medium. By reducing the metal compound in the presence of a compound having a function preventing discoloration of the metal, there can be obtained a metal particle dispersion having excellent discoloration preventing properties. Metal particles produced by such methods have a uniform particle diameter and are excellent in dispersion stability. By using a conductive resin composition or conductive ink containing a metal particle dispersion obtained by such production methods, there can be formed a conductive coating film, such as a conductive circuit or an electromagnetic shielding layer, having good characteristics.
Owner:TOYO INK SC HOLD CO LTD

Expanded vitrified micro-bead fireproof thermal-insulation board and preparation method thereof

The invention relates to an expanded vitrified micro-bead fireproof thermal-insulation board and a preparation method thereof, belonging to the field of construction materials. In the invention, inorganic expanded vitrified micro-beads, which are used as main raw materials, are combined with an organic binder, molded in a die and sintered, so that the expanded vitrified micro-beads are bound to form a compact single-layer board; and meanwhile, in the sintering process, the content of organic matters in the thermal-insulation board is greatly reduced to further enhance the fire resistance of the fireproof thermal-insulation board, thereby obtaining the fireproof thermal-insulation board with favorable comprehensive properties. The preparation technique of the expanded vitrified micro-bead fireproof thermal-insulation board is simple; and the expanded vitrified micro-bead fireproof thermal-insulation board has the advantages of low coefficient of thermal conductivity, high strength, excellent fire resistance, low water absorptivity, favorable thermal insulation effect, long service life and low volume weight, and can not deform or deteriorate when being used for a long time, therebybeing a green, economical and environment-friendly fireproof thermal-insulation material.
Owner:WUHAN TEXTILE UNIV

Self-aligned spatial filter

A spatial filter is made by forming a structure comprising a focusing element and an opaque surface, the opaque surface being disposed remotely from the focusing element in substantially the same plane as a focal plane of the focusing element; and by forming a pinhole in the opaque surface at or adjacent to a focal point of the focusing element by transmitting a substantially collimated laser beam through the focusing element so that a point optimally corresponding to the focal point is identified on the opaque surface and imperfection of the focusing element, if any, is reflected on the shape and position of the pinhole so formed.
Owner:INTEGRATED PLASMONICS CORP

Environment-friendly method for preparing water-soluble grapheme at normal temperature

The invention relates to a method for preparing water-soluble grapheme at the normal temperature, which relates to a grapheme preparation method. The method for preparing water-soluble grapheme at the normal temperature aims to overcome the defects that the traditional method for preparing grapheme has the disadvantages of high reaction temperature, is poisonous in the reaction process, is harmful to the environment and is not suitable for large-scale production, and also solve the problems of the dispersibility and the water solubility of the traditional grapheme. The method comprises the following steps: taking graphite powder, concentrated sulfuric acid, sodium nitrate, potassium permanganate and deionized water as raw materials to prepare graphene oxide; adding the graphene oxide into sodium hydroxide solution; processing the sodium hydroxide solution added with the graphene oxide through ultrasonic under the vacuum condition; then stirring the sodium hydroxide solution added with the graphene oxide with magnetic force for 24-60 hours; and drying sedimentary resultants in a vacuum drying chamber so as to obtain the water-soluble grapheme after the resultants are washed and filtered. The method disclosed by the invention has the advantages of low process cost, environmental protection and no pollution, and can be used for large-scale protection. The solubility of the prepared grapheme is 1.5-2.0mg / ml, and the prepared grapheme can be stably dispersed in the water without generating sediments within 4-6 months. The graphene prepared with the method disclosed by the invention can be used in the fields of biological medicine, energy, electron and the like.
Owner:HARBIN INST OF TECH

Alloy-type bonding wire with composite plating on surface

The invention relates to an alloy-type bonding wire with a composite plating on the surface, which comprises a silver alloy core material and a plating on the surface of the silver alloy core material, wherein the silver alloy core material mainly comprises silver. The invention is characterized in that trace metals for improving ductility are added to the silver alloy core material mainly comprising silver; the silver alloy core material is subjected to monocrystal melting stretching to obtain a silver alloy rod; the silver alloy rod is subjected to crude stretching, intermediate stretching and surface cleaning to obtain a silver alloy core wire; composite electroplating is carried out on the surface of the silver alloy core wire; and the silver alloy core wire is subjected to ultrafine stretching to obtain the alloy-type bonding wire with a composite plating on the surface. The alloy-type bonding wire can have favorable final plastic deformation capability without intermediate annealing in the subsequent ultrafine stretching process; the elongation percentage of the alloy-type bonding wire is at least 12% after the alloy-type bonding wire is subjected to dynamic on-line annealing under inert gas protection; the properties of the alloy-type bonding wire are similar to those of the bonding alloy wire; and only high-purity nitrogen is needed for ball burning protection in the packaging and bonding process. When the alloy-type bonding wire is used for packaging instead of a bonding metal wire, the device has stable reliability, which does not have obvious difference as compared with the bonding metal wire. The cost of the product can be controlled at about 15 yuan / hectometer, and thus, the invention has the advantage of high cost performance.
Owner:SICHUAN WINNER SPECIAL ELECTRONICS MATERIALS

Method for laser welding one or more workpieces of hardenable steel in a butt joint

A method for laser welding of one or more workpieces made from press hardenable steel, in a butt joint, in which the workpiece or the workpieces have a thickness of at least 1.8 mm and / or a jump in thickness of at least 0.4 mm arises at the butt joint including supplying filler wire into a molten bath generated by a laser beam. In order to ensure that the weld seam can reliably harden into a martensitic structure during the hot forming (press hardening), the filler wire contains at least one alloy element from the group of manganese, chromium, molybdenum, silicon and nickel, wherein the at least one alloy element is present in the filler wire with a mass proportion that is larger by 0.1% by weight than the mass proportion of the element in the press hardenable steel of the workpiece or the workpieces.
Owner:WISCO TAILORED BLANKS

Gear press-mounting fixture

The invention relates to the field of machining, in particular to a gear press-mounting fixture having a tooth space central position requirement. The gear press-mounting fixture solves the problem that assembly type gears are complex in press-mounting. The gear press-mounting fixture comprises a base, the base is fixed on a machine tool, a first elastic stretchy positioning rod which is symmetrical with the axis of the base is arranged on the lower portion of the outer circumferential face of the base, a second elastic stretchy positioning rod which is symmetrical with the axis of the base is arranged on the upper portion of the outer circumferential face of the base, a guide mandrel is arranged on the axis of the base, a pressure head which is located above the base is sleeved on the guide mandrel, the front end of the first elastic stretchy positioning rod is a tapered round head, and the front end of the second elastic stretchy positioning rod is a duckbilled structure. The gear press-mounting fixture is reasonable and reliable in structure and design, gears can be mounted in a pressing mode accurately, requirements for angles of tooth spaces are guaranteed, machining difficulty is lowered, input cost is low, and good economical benefits are obtained. Further, the gear press-mounting fixture has the advantages of being simple in structure, good in manufacturability, reliable, stable, and convenient and fast in operation.
Owner:CHINA NAT HEAVY DUTY TRUCK GROUP DATONG GEARCO

Power supply circuit for the wall mounted electronic switch

This is a disclosure of a power supply circuit for wall-mounted electronic switches. The disclosed invention is about a power supply circuit for driving circuit inside the wall-mounted electronic switches, which can supply sufficient current demanded by these switch circuits. Recently the functions of wall-mounted electronic switches are being diversified from lamp switching to security, watch, remote control, room temperature control, etc. and the amount of current required inside the switch circuits is increased up to tens of mA. This requires a competitive power supply circuit that can supply a high current. In addition, a space-saving characteristic is also required because the space of a wall-mounted switch is narrow. The invented power supply circuit for electronic switches saves space, supplies a high current, and enhances competitiveness in price and quality, and consequently it makes a considerable contribution to the competitiveness of wall-mounted electronic switches.
Owner:HAGA ELECTRONICS CO LTD

Method for encoding and modulating physical frame signaling channel in NGB-W system

The invention discloses a method for encoding and modulating a physical frame signaling channel in an NGB-W system. The method comprises the following steps of: adding CRC (cyclic redundancy code) bits to physical frame signaling and scrambling the physical frame signaling; mapping the scrambled physical frame signaling into BCH (Broadcast Channel) code information bits; performing forward error correction coding to the BCH code information bits by BCH coding and LDPC (Low Density Parity Check) coding cascade methods; generating physical frame signaling check bits and forming physical frame signaling coding blocks; performing constellation mapping to the physical frame signaling coding blocks to generate BICM (Bit Interleaved Coded Modulation) blocks. The method is characterized in that a forward error correction coding solution with a reasonable structure and parameters, and LDPC codes including a QC-Raptor-Like structure and approaching a Claude Elwood Shannon threshold are adopted, and bit mapping of information with the changeable signaling length, code rate control and coding block generation can be supported; the physical frame signaling with the changeable length can be protected so that the transmission reliability of the physical frame signaling is relatively steady along with the change of the signaling length.
Owner:SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI

Serial bus bridging method and serial bus system

The invention discloses a serial bus bridging method and a serial bus system. The method comprises the steps that when a master controller accesses a serial peripheral interface host device, a CPLD detects a CS signal and a CLK signal of the serial peripheral interface host device; when it is detected that the CS signal is valid, the CPLD sends an IRQ interrupt signal to the master controller to drive the master controller to write to-be-sent data into a transmitter register; the to-be-sent data is sent to the serial peripheral interface host device piece by piece every time a rising edge is detected; after sending of the to-be-sent data is completed, an IRQ interrupt signal is sent to the master controller to drive the master controller to write a next piece of to-be-sent data into the transmitter register; and the steps are repeated till it is detected that the CS signal is invalid. According to the serial bus bridging method and the serial bus system, communication between host devices is realized through CPLD switchover, transmission efficiency is high, and reliability is stable.
Owner:GENEW TECH

Eight-way server backboard and double pinch plate interconnection system design method

The present invention discloses an eight-way server backboard and double pinch plate interconnection system design method, and relates to the technical field of server board design. The method is characterized in that: by using a middle backboard and two UPI pinch plates, computing boards of two 4s systems are interconnected into an 8S system by the multi-physical layer partitioning based on NUMA;the middle backboard is located at the front of the computing board, is interconnected with the two computing boards for interaction of the UPI signal, the Misc signal, the timing signal, and the management signal, and is respectively connected with the two CPUs at the front end of the two computing boards through the connector of the middle backboard, so that interconnection between the CPUs atthe front end of the two computing boards is realized; and the two UPI pinch plates are respectively arranged behind the two computing boards, interacts the UPI signal, the Misc signal, and the timingsignal with the computing boards, and is respectively connected with the two CPUs at the back end of the two computing boards through the connector of the UPI pinch plates, so that interconnection between the CPUs at the back end of the two computing boards is realized.
Owner:ZHENGZHOU YUNHAI INFORMATION TECH CO LTD

Heat pipe cooling system and power equipment

The present invention discloses a heat pipe cooling system, which comprises a first pipeline (10) and a second pipeline (20). The first pipeline (10) comprises a first steam pipe (12), a first liquid pipe (14) and an evaporation section (16) connected between the first steam pipe (12) and the first liquid pipe (14). The second pipeline (20) comprises a second steam pipe (22), a second liquid pipe (24) and a heat exchanger (26) connected between the second steam pipe (22) and the second liquid pipe (24). Two pairs of quick connectors (30) are respectively connected between the first steam pipe (12) and the second steam pipe (22), and between the first liquid pipe (14) and the second liquid pipe (24). In this way, the first pipeline (10) and the second pipeline (20) are combined to form a loop heat pipe. The loop heat pipe comprises a valve (40) for vacuum pumping and an interface (42). A refrigerant is arranged inside the loop heat pipe. The evaporation section (16) is internally provided with a capillary structure so as to provide a capillary pumping force for driving the refrigerant to circulate in the loop heat pipe. The heat pipe cooling system of the present invention is high in heat transfer efficiency, good in reliability, and free of working medium leakage risk. The present invention also provides power equipment.
Owner:XFUSION DIGITAL TECH CO LTD

High bandwidth high speed analog-to-digital converter batch production testing device based on crystal oscillator and method thereof

The invention belongs to the integrated circuit technology field and discloses a device of using a crystal oscillator to realize a high bandwidth high speed analog-to-digital converter batch production test in automatic test equipment. The device comprises the automatic test equipment 1 and a test support plate 3 which comprises a tested analog-to-digital converter chip 12, crystal oscillators 6, filters 7, a transformer 8, a relay 9, a crystal oscillator 10 and a filter circuit 11. The crystal oscillators 6 connect with the filters 7 respectively, and connect with the relay 9, the transformer 8, and the tested analog-to-digital converter chip 12 sequentially. The crystal oscillator 10 connects with the tested analog-to-digital converter chip 12. The device also comprises a metal spring needle set 2, one end of the metal spring needle set 2 connects with a test support plate 3, and the other end of the metal spring needle set 2 connects with the automatic test equipment 1. One end of the filter circuit 11 connects with the tested analog-to-digital converter chip 12, and the other end of the filter circuit 11 connects with the automatic test equipment 1 through the metal spring needle set 2. According to the device and the method in the invention, by utilizing excellent performance of the crystal oscillator, a stable, reliable ADC test capable of batch production is realized, and the device and the method are very suitable for mass production.
Owner:上海捷策创电子科技有限公司

Clothes treating apparatus with heat pump cycle

InactiveCN105625006AAvoid loopsPrevent the upper right direction from risingOther washing machinesOther drying apparatusWorking fluidEngineering
A clothes treating apparatus that includes a heat pump cycle and a dehumidifying device is provided herein. The clothes treating apparatus may include a case and a drum installed within the case and configured to accommodate an item for drying. A circulation duct may be provided to form an air circulation flow channel that allows air to circulate through the drum. The heat pump cycle may include an evaporator and a condenser disposed to be spaced apart from one another within the circulation duct, the heat pump cycle being configured to absorb heat of air released from the drum through the evaporator and transmit the absorbed heat to air introduced to the drum through the condenser, by using a working fluid that circulates by way of the evaporator and the condenser. Moreover, the dehumidification device may be provided to dehumidify air passing through the evaporator in the circulation duct.
Owner:LG ELECTRONICS INC

3D (Three-Dimensional) face recognition method

The invention relates to a 3D (Three-Dimensional) face recognition method. A face position correction method of positioning eyes in a face gray level image is adopted by the method, and the method is used for quickly and effectively correcting single face gray level image visible to double eyes and accurately determining pupil positions of the double eyes in the correction result to realize quick positioning according to the human eye gray level change characteristics, human eye geometric shape characteristics and axisymmetric characteristics of the double eyes; and in a characteristic extraction and recognition process, a principal component analysis face image recognition method of BP (Back-Propagation) neural network is adopted, the method is used for extracting face characteristics (vectors) from the face image through a non-linear principal component analysis neural network and recognizing the face image on the BP neural network, thereby improving the recognition efficiency, and the method is reliable in effectiveness and stability.
Owner:SUZHOU FUFENG TECH

Thin film transistor and organic light emitting display device using the same

ActiveUS20110108830A1Enhance reliabilityHigh difference of electronegativityTransistorSolid-state devicesOxide semiconductorAtomic radius
There is provided a thin film transistor exhibiting stable reliability and electrical characteristics by forming an active layer by adding material having a large difference of electronegativity from oxygen like Hf and an atomic radius similar to that of Zn or SN to an oxide semiconductor made of ZnSnO to adjust concentration of carrier and to enhance reliability of the oxide semiconductor, and an organic light emitting display device having the same.
Owner:SAMSUNG DISPLAY CO LTD

Novel method for accelerating aging and impurity removal of white spirit by immobilized enzyme

The invention discloses a novel method for accelerating aging and impurity removal of white spirit by immobilized enzyme. The method comprises the following steps: dissolving fermented mother starter of the white spirit in water to extract filtrate; directly filtering the fermented mother starter which is cultured in liquid state; adding triple 95 percent alcohol into the filtrate to keep standing; removing supernatant fluid; carrying out gel embedding on the obtained precipitate solution; dissolving agar by boiling water; adding enzyme solution with 50 to 80 percent of the gel solution into a water bath at a temperature of between 55 and 58 DEG C to obtain gel enzyme solution; mixing a rice hull taking as a carrier with the gel enzyme solution; drying enzyme to immobilize the enzyme on the carrier at a temperature of between 30 and 40 DEG C; and placing the rice hull in a column jacket or a vessel to lead the white spirit to be contacted with the immobilized enzyme, thereby aging the white spirit. The immobilization of the gel enzyme solution can be manufactured easily with simple operation, stable and reliable effect, so that the aging period of white spirit aging is shortened, the manufacturing efficiency is improved, and the manufacturing cost is reduced.
Owner:杨迪

Packaging substrate as well as manufacturing method and packaging structure thereof

The invention relates to a packaging substrate as well as a manufacturing method and a packaging structure thereof, providing a substrate body. At least one surface of the substrate body is provided with multiple electric contact pads and lines; insulating layers for covering are formed on the electric contact pads, the lines and the surface of the substrate body; the thickness of the insulating layer is less than the thickness of the electric contact pad; multiple insulating layer open pores correspondingly exposed out of each electric contact pad are formed; a first metal lug is formed on the upper surface exposed out of each electric contact pad so as to be beneficial to the easy control of the welding flux quantity and further beneficial to packaging of thin intervals; a welding preventing layer is not required to be formed on the substrate; and the electric contact pads and the lines are not required to carry out a coursing and manufacturing process so as to maintain a good shape, thus the substrate has good yield and reliability.
Owner:UNIMICRON TECH CORP
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