32results about How to "Stable joint strength" patented technology

A connector lock structure includes a first connector housing, a second connector housing which is fitted to the first connector housing, a flexible lock member which is frontwardly extended from the first connector housing along a connector fitting direction and which has an engagement portion provided at an end portion thereof, a latch member which is provided on the second connector housing and which is engaged with the engagement portion, an operating arm which upwardly protrudes from the end portion of the lock member and rearwardly extends and which has a operation portion provided at a rear end portion thereof, and a fulcrum projection which is provided on at least one of an outer wall face of the lock member and a bottom surface of the operating arm facing the outer wall face.

The invention provides a manufacturing method of an electronic device package, an electronic device package and an oscillator, capable of bonding an insulator base substrate and an insulator cover substrate together via a metal film by anodic bonding in a stable manner. The electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other surface conduct with each other; aligning and superimposing the cover substrate and the base substrate; and bonding the base substrate and the cover substrate together via the metal film by anodic bonding by bringing a negative electrode plate into contact with the base substrate on an entire surface opposite to a surface bonded to the cover substrate, bringing a positive electrode plate into contact with the cover substrate on an entire surface opposite to a surface bonded to the base substrate, and applying a voltage between the positive and negative electrode plates. The base substrate and the cover substrates can be thus bonded together via the metal film by anodic bonding in a stable manner.

The present invention addresses the problem of the inability to form a uniform metal film due to weak adhesion of a deposition metal film making it impossible to obtain a uniform adhesive force, or due to partial aggregation of metal nanoparticles resulting in a decrease in the adsorption force of some of the metal nanoparticles with respect to a primer layer, and provides a metal film laminate structure in which metal nanoparticles of a catalyst layer are surrounded by a primer layer of which one end is bonded to a plating deposition layer. The metal film laminate structure of the present invention has a cross sectional structure in which three layers, namely a primer layer, a catalyst layer, and a plating deposition layer, are laminated on a base material, characterized in that the primer layer is a resin layer with a glass transition temperature (Tg) of 40 to 430DEG C, and the catalyst layer comprises a group of metal nanoparticles arranged in a planar fashion on the primer layer, wherein the group of metal nanoparticles comprises a metal of group IB or group VIIIB in the periodic table, and wherein the metal nanoparticles are surrounded by the primer layer, of which one end isbonded to the plating deposition layer.

A helmet (1) with a visor formed by integrally joining the preliminarily injection-molded visor (5) to a cap body (3), wherein an opening end edge part (9) formed on the cap body is joined to the outer side of a joining wall part (17) formed on the visor (5), and the joining wall part (17) is held by the opening end edge part (9) and a tongue-shaped part (31) formed on the inside of the cap body (3). The joined faces of the visor (5) and the cap body (3) are joined to each other by fusing, an intruding engagement part intruded in a through hole (22) formed in the joining wall part (17) is formed at the opening end edge part of the cap body (3), and the joined parts of the visor and the cap body are formed in annular shapes.