32results about How to "Stable joint strength" patented technology

A connector lock structure includes a first connector housing, a second connector housing which is fitted to the first connector housing, a flexible lock member which is frontwardly extended from the first connector housing along a connector fitting direction and which has an engagement portion provided at an end portion thereof, a latch member which is provided on the second connector housing and which is engaged with the engagement portion, an operating arm which upwardly protrudes from the end portion of the lock member and rearwardly extends and which has a operation portion provided at a rear end portion thereof, and a fulcrum projection which is provided on at least one of an outer wall face of the lock member and a bottom surface of the operating arm facing the outer wall face.

The invention provides a manufacturing method of an electronic device package, an electronic device package and an oscillator, capable of bonding an insulator base substrate and an insulator cover substrate together via a metal film by anodic bonding in a stable manner. The electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other surface conduct with each other; aligning and superimposing the cover substrate and the base substrate; and bonding the base substrate and the cover substrate together via the metal film by anodic bonding by bringing a negative electrode plate into contact with the base substrate on an entire surface opposite to a surface bonded to the cover substrate, bringing a positive electrode plate into contact with the cover substrate on an entire surface opposite to a surface bonded to the base substrate, and applying a voltage between the positive and negative electrode plates. The base substrate and the cover substrates can be thus bonded together via the metal film by anodic bonding in a stable manner.

The present invention addresses the problem of the inability to form a uniform metal film due to weak adhesion of a deposition metal film making it impossible to obtain a uniform adhesive force, or due to partial aggregation of metal nanoparticles resulting in a decrease in the adsorption force of some of the metal nanoparticles with respect to a primer layer, and provides a metal film laminate structure in which metal nanoparticles of a catalyst layer are surrounded by a primer layer of which one end is bonded to a plating deposition layer. The metal film laminate structure of the present invention has a cross sectional structure in which three layers, namely a primer layer, a catalyst layer, and a plating deposition layer, are laminated on a base material, characterized in that the primer layer is a resin layer with a glass transition temperature (Tg) of 40 to 430DEG C, and the catalyst layer comprises a group of metal nanoparticles arranged in a planar fashion on the primer layer, wherein the group of metal nanoparticles comprises a metal of group IB or group VIIIB in the periodic table, and wherein the metal nanoparticles are surrounded by the primer layer, of which one end isbonded to the plating deposition layer.

A helmet (1) with a visor formed by integrally joining the preliminarily injection-molded visor (5) to a cap body (3), wherein an opening end edge part (9) formed on the cap body is joined to the outer side of a joining wall part (17) formed on the visor (5), and the joining wall part (17) is held by the opening end edge part (9) and a tongue-shaped part (31) formed on the inside of the cap body (3). The joined faces of the visor (5) and the cap body (3) are joined to each other by fusing, an intruding engagement part intruded in a through hole (22) formed in the joining wall part (17) is formed at the opening end edge part of the cap body (3), and the joined parts of the visor and the cap body are formed in annular shapes.

A welded portion shape of a cross-section perpendicular to the shaped steel longitudinal direction is set to satisfy a>0 mm, b>0 mm, c≥0.14 Tw, d≥0 mm, e≥0 mm, a+d≤2 mm and b+e≤2 mm; where a is a front melting width of the web material (on the laser beam irradiation side), b is a rear melting width of the web material (on the laser beam non-irradiation side), c is a maximum weld penetration depth, in a plate pressure direction, into the flange material, d is a front melting width of the flange material (on the laser beam irradiation side), e is a rear melting width of the flange material (on the laser beam non-irradiation side), and Tw is the plate thickness of the web material.

The invention relates to a fixing structure of fiber cover to integrate the cover fiber as non-woven cover and the resin molded product, which will not generate surface defects as convex-concave on the surface of resin molded product, and it can reduce the processing time and simplifying the processing device. Wherein, the decoration (10) on the side of luggage case is processed by melting the fiber cover as non-woven cover (30) and the inner surface of decoration (20). It uses the sharp convex rib (52) on the processing surface (51) of ultrasonic horn (50) to form the melting part (4) of non-woven cover (3) on the plane melting surface (41) to inserted into the V-shape groove (42) inside the resin molded product. The invention can simply inserted the fiber of non-woven cover (30) into resin molded product (20) to generate fixing effect and form the V-shape groove (42) of resin molded product in short time to improve the operation availability and appearance.

A laminate structure of metal coating is laminated on a base material, and includes a primer layer, a catalyst layer and a plating deposited layer. The primer layer is a resin layer with a glass transition temperature (Tg) of 40 to 430° C. The catalyst layer is a metal nanoparticle group arranged in a plane on the primer layer, wherein the metal nanoparticle group is a metal in Group 11 or Groups 8, 9 and 10 in a periodic table, and the metal nanoparticles are surrounded by the primer layer. Ends of the metal nanoparticles are attached to the plating deposited layer.

[Issues to be Solved] To provide an aluminum ribbon for ultrasonic bonding, is able to realize the high bonding strength and is able to maintain defined level of bonding strength, during several ten thousand bonding cycles. [Means to be Solved] An aluminum ribbon for ultrasonic bonding is consisted aluminum metal or aluminum based alloy, the purity of aluminum is more than 99.99 wt %, and total amount of organic carbon non-ionic surfactant less than 500 molecular weight vaporized and adhered is 100-1,000 μg / m2 on the mirror finished bright surface of aluminum ribbon.

PROBLEM TO BE SOLVED: To improve second bondability as well as prevent breakage of a chip in ball bonding and improve looping property in a copper fine wire for ball bonding.SOLUTION: An ultra thin layer of copper not containing platinum due to segregation is formed in a process of forming a single wire by continuous casting from a molten copper platinum alloy containing high purity copper (Cu), 0.1 to 2.0 mass% of platinum (Pt), 1 to 10 mass ppm of sulfur (S), 10 to 150 mass of oxygen (O) and if necessary 1 to 5 mass ppm of phosphorus (P) as nonmetallic elements, and is oxidized in the air atmosphere to form an oxide film having 6 to 2 nm on a wire surface layer after wire drawing. Uniform oxide film improves second bondability as a bonding wire having a Vickers hardness of 77 to 105 Hv, prevents aluminum splash by preventing dynamic strength at ball bonding by a matrix additive element, and maintains static strength without generating leaning.

The present invention provides a welding technique for multi-electrode submerged arc welding that is stable even if a small-diameter wire is used with a first electrode, in particular if welding is being carried out under welding conditions where the wire feed speed increases or if there is considerable kinked winding, even after correction, with a flux cored wire. A welding torch for a first electrode for multi-electrode submerged arc welding and a method for multi-electrode submerged arc welding using the same are characterized by comprising a means for insulating, from an electrode wire, atubular electric conductor that is arranged between a power supply chip and a connecting part of a power supply cable.

Provided is a boot mounting method for a constant velocity universal joint in which a boot end portion is mounted and fixed to a mating member made of metal. After the boot end portion is fitted over a receiving surface being a radially outer surface of the mating member, a high-frequency induction heating coil having a ring shape is fitted over the boot end portion. Only a top portion of the receiving surface of the mating member is heated by high-frequency induction through application of a high-frequency current to the high-frequency induction heating coil. With this action, a mounting surface being a radially inner surface of the boot end portion and the receiving surface being the radially outer surface of the mating member are integrally joined to each other.