Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Aluminum ribbon for ultrasonic bonding

A technology of ultrasonic welding and aluminum strip, applied in thin material processing, semiconductor devices, electrical components, etc., can solve problems such as difficult bonding, fracture of aluminum strip, balance damage of welding conditions, etc.

Inactive Publication Date: 2012-07-04
TANAKA DENSHI KOGYO KK
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Like the welded band disclosed in Patent Document 2, even if the tops of a plurality of protrusions that are in contact with the surface to be joined are formed, when one place is welded and the oxide film on a microscopic part is destroyed and plastic flow begins, the overall welding condition The balance is broken, and it cannot be engaged under the same conditions tens of thousands of times
[0014] In this way, in the conventional method of changing the shape of the welded strip, it is difficult to join the same microscopic part under the same conditions tens of thousands of times, and it is impossible to obtain a stable weld with high joint strength.
[0015] However, in ultrasonic welding using the above-mentioned welding tape, when joining is performed by drawing a line arc from the first point to the second point, there is a problem that the mirror-finished aluminum strip breaks when the line arc is formed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aluminum ribbon for ultrasonic bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0060] Next, examples of the present invention will be described.

[0061] The alloy composition shown in Table 1 (Although aluminum (Al) with a purity of 99.999% by mass was used as the raw material for preparation, the same result was obtained for aluminum (Al) with a purity of 99.99% by mass.) and a welding wire with a specified wire diameter was used to produce As a hair material, Examples 1-20 and Comparative Examples 1-5 of the welding tape shown in Table 1 were prepared. These welded strips were obtained by performing a one-stage heat treatment rolling process using a rolling device (not shown), and dipping them in a high-purity ethanol solution for 2 seconds before or after heat treatment at a predetermined temperature shown in Table 1. Welding strips.

[0062] Examples 1 to 20 and Comparative Examples 1 to 5 of the present invention thus obtained were ultrasonically welded to an Al plate (thickness 5 mm) with a purity of 99.99% by mass under the following number and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
crystal sizeaaaaaaaaaa
surface roughnessaaaaaaaaaa
crystal sizeaaaaaaaaaa
Login to View More

Abstract

[Problem] To provide a bonding ribbon which can be evenly bonded to the whole bonding surface every time even when used for bonding tens of thousands of times, thereby attaining stabler bond strength and which undergoes no breakage when looped. [Solution] The ribbon for ultrasonic bonding comprises an aluminum-based alloy having a purity of 99 mass% or higher, and has an ultrathin tape structure formed by multistage wiredrawing and subsequent rolling. The ribbon has a cross-section that has an average crystal grain diameter of 5-200 [mu]m, and has been mirror-finished to a surface roughness of Rz<=2 [mu]m. The ribbon has been treated by immersion in or with an atmosphere of a water-soluble hydrocarbon, alcohol, ketone, or ether solvent which has a higher vapor pressure than water.

Description

technical field [0001] The present invention relates to an aluminum ribbon used for connecting a semiconductor element and a lead portion on a substrate side by ultrasonic welding in an electronic component or a semiconductor package. Background technique [0002] In the manufacture of semiconductor devices, in order to electrically connect the connection electrodes (pads) provided on the semiconductor chip and the external lead-out terminals (leads) provided in the semiconductor package, strip-shaped conductor wires with approximately rectangular cross-sections are widely used. body (hereinafter referred to as "ribbon") welding method. [0003] This method applies the ultrasonic lead wire welding method using the conductive lead wire of aluminum. By applying load and ultrasonic vibration on the aluminum strip, the oxide film of about 1 nanometer (nm) naturally formed on the surface of the aluminum strip is destroyed, and the aluminum (Al ) and other metal atoms are exposed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L2224/43847H01L2224/85205H01L2224/45124H01L24/45H01L2924/01082H01L24/43H01L2924/01004H01L2924/01049H01L2924/01079H01L2924/01038H01L2224/84205H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01029H01L2924/0106H01L2924/0102H01L2924/01057H01L2924/01058H01L2924/01012H01L2224/45014H01L2924/01013H01L24/84H01L2924/01015H01L2924/00014H01L2224/45015H01L2224/43848Y10T428/12993H01L2924/01202H01L2924/01028H01L2924/01014H01L2924/01003H01L2924/01039H01L2924/01083H01L2924/013H01L2924/00H01L2224/48H01L2924/12H01L2924/14H01L2924/00013H01L2924/206
Inventor 三上道孝菊地照夫中岛伸一郎平田勇一中村政晴木村启裕
Owner TANAKA DENSHI KOGYO KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products