154results about How to "Short circuit" patented technology

The battery system has a battery block 2 with a plurality of battery cells 1 that are rectangular batteries stacked with intervening insulating separators 15, and that battery block 2 is held by fastening components 3. The fastening components 3 are provided with a pair of endplates 4 disposed at the ends of the stacked battery cells 1, and metal bands 5 on both sides of the battery block 2 connected at both ends to the endplates 4. An insulating separator 15 has an insulating plate section 15X, which intervenes between adjacent battery cells 1, and insulating walls 15C, which cover both battery cell 1 side-walls, formed from plastic as a single-piece. In this battery system, insulating plate sections 15X are sandwiched between battery cells 1, and the insulating walls 15C are disposed between battery cell outer side-walls and metal bands to insulate the battery cells from the metal bands.

A confronting surface of a substrate faces a first surface of a semiconductor element. Extension layers are formed on the substrate at positions facing electrodes on the semiconductor element. A levee film is disposed on one of the confronting surface and the first surface. Openings are formed through the levee film. Connection members which is filled but is not completely filled in the openings connect the electrodes and the extension layers.

A light-emitting element has a layer including an organic material between a first electrode and a second electrode, and further has a layer including a metal oxide between the second electrode and the layer including the organic material, where these electrodes and layers are laminated so that the second electrode is formed later than the first electrode. The light-emitting element is suppressed damage caused to a layer including an organic material during deposition by sputtering and a phenomenon such as short circuit between electrodes.

The present invention relates to a pressure-sensitive adhesive tape for battery containing: a substrate and a pressure-sensitive adhesive layer laminated on at least one surface of a substrate, in which the pressure-sensitive adhesive layer is laminated on the substrate, 0.5 mm or more inside from both edges of the substrate, and in which the pressure-sensitive adhesive tape has a 180° peeling pressure-sensitive adhesive force at 23° C. being 0.1 N / 10 mm or more, and has a slippage distance after a pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape is attached to a phenolic resin plate (attaching area: 10 mm×20 mm), followed by applying a load of 500 g thereto at 40° C. for 1 hour being 0.2 mm or less.

A battery system has a battery block with a plurality of battery cells that are rectangular batteries stacked with intervening insulating separators, and that battery block is held by fastening components. The fastening components are provided with a pair of endplates disposed at the ends of the stacked battery cells, and metal bands on both sides of the battery block connected at both ends to the endplates. An insulating separator has an insulating plate section, which intervenes between adjacent battery cells, and insulating walls, which cover both battery cell side-walls, formed from plastic as a single-piece. In this battery system, insulating plate sections are sandwiched between battery cells, and the insulating walls are disposed between battery cell outer side-walls and metal bands to insulate the battery cells from the metal bands.

A control apparatus has a module having first and second module parts, which can be mechanically and electrically combined to form a combined arrangement. The first and second module parts each comprise a housing having a boundary surface opposite one another in the combined arrangement that define a boundary plane. The first and second module parts are combined by a pivoting movement about a pivot axis arranged perpendicular to the boundary plane. One of the module parts has a number of contacts comprising a first electrical contact, and the other module part has a number of mating contacts comprising a first electrical mating contact. In the combined arrangement, each electrical contact makes contact with its corresponding mating contact for electrical connection between the first and second module parts. The contacts comprise conductor tracks on a nonconductive board such that a printed circuit board is formed.

The coaxial line comprises a coaxial inner conductor and a first dielectric layer encompassing the coaxial inner conductor and which is surrounded by a coaxial outer conductor. The coplanar line comprises a second dielectric layer with a coplanar inner conductor and a first and second coplanar outer conductor applied to the front side thereof and with a metallization layer followed by a substrate carrier layer on the rear side thereof. The first and second coplanar outer conductors are separated from the coplanar inner conductor by the second dielectric layer and the coaxial inner conductor is connected to the coplanar inner conductor and the coaxial outer conductor is connected to the first and second coplanar outer conductors. When high bit rate data signals are transmitted via the connecting point of the coaxial line and the coplanar line, the capacitative power is increased and undesirable reflections occur. In order to avoid this, a recess is provided in the metallization layer, beginning at the point of connection between the coaxial line and the coplanar line and extending in an approximately symmetrical manner with respect to the coplanar inner conductor, tapering in the direction of the coplanar inner conductor as the distance from the point of connection increases.

The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.

A card manufacturing technique and the resulting card are provided. The card has a ground and / or power layer extending to the edges of a circuit board for electrostatic discharge protection but also has gaps at the edge of the ground and / or power layer to avoid short circuiting with conductive segments of another layer deformed when the card is trimmed during manufacture.

A method for fabricating a semiconductor device includes the steps of: (a) forming a first insulating film having moisture absorbency on a substrate; (b) forming a dummy contact hole and a contact hole in the first insulating film; (c) heat-treating the substrate, thereby removing water contained in the first insulating film; and (d) forming a contact and a dummy contact. The heat treatment in the step (c) removes water contained in the first insulating film through the contact hole and the dummy contact hole.

In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.

A semiconductor memory device comprises a silicon layer having a first diffused region and a second diffused region formed therein, a gate electrode formed through an insulating film on one side of the silicon layer between the first and the second diffused regions, a capacitor formed on said one side of the silicon layer and having a storage electrode connected to the first diffused region, and a bit line formed on the other side of the silicon layer and connected to the second diffused region, whereby a semiconductor memory device of SOI structure can be easily fabricated. The bit line connected to the second diffused region is formed on the other side of the semiconductor layer, whereby the bit line can be arranged without restriction by the structure, etc. of the capacitor. Short circuit between the capacitor and the bit line can be prevented.

A method for fabricating a semiconductor device includes the steps of: (a) forming a first insulating film having moisture absorbency on a substrate; (b) forming a dummy contact hole and a contact hole in the first insulating film; (c) heat-treating the substrate, thereby removing water contained in the first insulating film; and (d) forming a contact and a dummy contact. The heat treatment in the step (c) removes water contained in the first insulating film through the contact hole and the dummy contact hole.