60results about How to "Reduce wiring density" patented technology

A ball grid array packaged semiconductor device mounted on a mounting board and including pads formed within a package and are connected to signal lines of a bare chip by bonding wires. There are formed first vias extending from the respective pads to a bottom surface of a package, and second vias extending from the same respective pads to a top surface of the package to form continuous vias. This makes it possible to connect the mounting boards to the top and bottom surfaces of the package, thereby enabling reduction of the wiring density of wiring patterns on the mounting boards, and thereby facilitating routing of the wiring patterns on the mounting boards. The semiconductor device is capable of reducing wiring density of the wiring pattern on the mounting board.

A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion.

The invention relates to an in-cell touch liquid crystal display (LCD). The LCD comprises a first substrate and a second substrate, wherein the first substrate comprises a plurality of touch sensing modules; each touch sensing module comprises a touch data reading line, a touch reading transistor and a contact electrode; the second substrate comprises a plurality of convex block structures; and each convex block structure has a conductive surface and is arranged opposite to one contact electrode. During use, when the convex block structures are contacted with one or certain contact electrodes, the touch reading transistors connected with the contact electrodes contacted with the convex block structures transfer signals to the touch data reading lines, and an external driving control module determines the touch positions according to the positions of the scanning lines and the touch data reading lines.

Quad-state logic elements and quad-state memory elements are used to reduce the wiring density of integrated circuits. The resulting reduction in wiring interconnects between memories and logic elements results in higher speed, higher density, and lower power integrated circuit designs.

In a memory cell area of a semiconductor device, first, second, and third inter-layer insulating films respectively cover a cell transistor, a bit wiring line, and a capacitor which are connected to each other. In an adjacent peripheral circuit area, a peripheral-circuit transistor is covered with the first inter-layer insulating film, a first-layer wiring line connected to the peripheral-circuit transistor is provided on the first inter-layer insulating film and covered with the second inter-layer insulating film, and a second-layer wiring line is provided on the third inter-layer insulating film. In the memory cell area, a landing pad is provided on the second inter-layer insulating film and between the capacitor and a contact plug for connecting the capacitor to the cell transistor. An assist wiring line connected to the first-layer wiring line is provided on the main surface of the second inter-layer insulating film, on which the landing pad is provided.

A built-in electronic component-mounted wiring board includes an electronic component having a connecting terminal and being mounted on a support; an insulating layer provided on the support so as to cover at least a portion of the electronic component; an opening provided in the insulating layer so as to expose the connecting terminal of the electronic component; and a connecting portion provided in the opening.

Provided is an optical module in which wiring density may be reduced to ensure isolation between lines to reduce crosstalk. A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connected to an electric terminal, which are facing each other through the dielectric layer; and a second pattern facing portion including a second ground conductor pattern and a second wiring pattern electrically connected to the electric terminal, which are facing each other through the dielectric layer, the second pattern facing portion facing the first pattern facing portion, in which when the dielectric layer is bent along a portion between the first pattern facing portion and the second pattern facing portion, at least one of the first ground conductor pattern and the second ground conductor pattern is located between the first wiring pattern and the second wiring pattern.

An ink-jet recording apparatus includes a recording head which jets inks, and a cable which is connected to the recording head and which is provided with a driving circuit for applying a driving voltage of the recording head. The recording head is formed with nozzle arrays for jetting an ink of a dark color and an ink of a light color respectively. The nozzle array, which jets the ink of the dark color, is disposed farther from the driving circuit than the nozzle array which jets the ink of the light color. The nozzle array, which jets the ink of the dark color, is hardly affected by the heat from the driving circuit. Therefore, the deterioration of the recording quality, which would be otherwise caused by the disturbance of ink discharge from nozzles, is suppressed.

The invention relates to a manufacturing method for a printed circuit board, wherein manufacturing of a multi-layer high-density interconnected printed circuit board can be realized by using the one-time compressing method. The method comprises the following steps that: first daughter boards and second daughter boards are manufactured; the plurality of first daughter boards and daughter boards are superposed together and heating and pressurizing are carried out, and thus the first daughter boards and the second daughter boards are bonded together to form a multi-layer and multi-stage printed circuit board; conventional processes like mechanical drilling, hole metallization, and electroplating and the like are carried out on the multi-layer printed circuit board so as to complete the manufacturing of the printed circuit board. According to the invention, expansion and shrinkage as well as deformation of materials during the manufacturing process can be effectively controlled, thereby effectively improving alignment precision between the holes and between the hole and the graph; and the safe distances between the holes and between the hole and the graph are reduced from 20 mil to 8mil, thereby effectively improving the wiring density of the printed circuit board. Moreover, under the circumstances that the investment of the PCB manufacturer equipment is not increased, the yield of the high-density interconnected printed circuit board can be substantially improved and the manufacturing period of the product can be shortened.