Display device, display system and manufacturing method

Abstract

The invention discloses a display device, display system and manufacturing method. The display device comprises a display panel and a chip on film, wherein the chip on film comprises a driving chip, afirst electrode array, a second electrode array and a plurality of leads, the driving chip is provided with a plurality of chip pins; a plurality of chip pins are respectively led out by electrodes in the first electrode array; a second electrode array is used for providing a plurality of signal channels between the driving chip and the display panel; and the plurality of leads are respectively used for connecting the effective pins in the plurality of chip pins to the corresponding signal channels, so that the effective pins are electrically connected with the corresponding driving terminalson the display panel, when the plurality of chip pins comprise at least one idle pin and at least one effective pin, the leads, the effective pins and the driving terminals are the same in number. The chip of the display device comprises at least one idle pin, and the wiring density of the lead is reduced, so that the short circuit and electric leakage risks of the display device caused by overlarge wiring density are reduced, and the problem of increased coupling capacitance is avoided.

Description

Technical field [0001] The present invention relates to the field of display technology, and more specifically, to a display device, a display system and a manufacturing method. Background technique [0002] Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) display devices have the advantages of stable picture, vivid image, elimination of radiation, space saving and energy saving, occupying the most important part of the flat display field. leading position. The display panel of the above-mentioned display device is provided with multiple scan lines and data lines, and the scan lines or data lines extend to the edge of the display panel to form leads for connecting with the driving chip. Due to the large number of scan lines and data lines, it is difficult to process with traditional soldering processes. Therefore, the chip on film (COF) packaging process is generally used to connect the display panel and the driving chip. [0003] The flip chip packaging proce...

AI Technical Summary

Problems solved by technology

[0007] However, with the continuous improvement of the resolution of the display panel, there are more and more I / O ports of the driving chip, and the density is increasing, while the first electrode on the driving chip and the second electrode on the base film in the prior art One-to-one correspondence, the wiring density of the first electrode and the second electrode is too large, which is prone to short circuit, leakage, circuit misconnection of the display device caused by insufficient process precision, or increased coupling capacitance due to excessive line density

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