Self-alignment integrated package method of high-density three-dimensional lamination layer
An integrated packaging and self-alignment technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of poor thermal matching of circuit boards, high packaging costs, solder joint fatigue, etc., and reduce alignment Difficulty, small alignment difficulty, and the effect of reducing the failure rate
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[0031] refer to Figure 1-Figure 5 . According to the present invention, the packaging structure is composed of three parts: a multilayer substrate, a boss on the periphery of the substrate, and micro BGA solder balls. The lower surface of the top substrate 1, the upper and lower surfaces of the middle substrate 2 and the upper surface of the bottom substrate 3 There are a large number of pads 4 for soldering micro BGA solder balls. The lower surface of the top substrate 1, the upper and lower surfaces of the intermediate substrate 2 and the upper surface of the bottom substrate 3 are evenly distributed with a large number of micro BGA ball pads 4 for soldering micro BGA solder balls, and the micro BGA solder balls are attached to the intermediate layer The upper surface of the substrate 2 and the bottom substrate 3, the micro BGA ball pads 4 on the upper surface of the intermediate substrate 2 correspond to the micro BGA ball pads 4 on the lower surface of the top substrate ...
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