30results about How to "Prevent glue overflow" patented technology

A display panel comprises a first substrate, a second substrate, a Polaroid and a glue frame. The first substrate is opposite to the second substrate which is between the first substrate and the Polaroid. The Polaroid is provided with a plurality of holes and the glue frame is disposed on the Polaroid. The glue frame is provided with a plurality of projections corresponding to the holes and disposed in the holes respectively. According to the invention, the stability of the glue frame on the Polaroid is improved in a cover substrate fit process because the projections of the glue frame are disposed in the holes of the Polaroid and the glue frame will not collapse because of press during fit of cover substrates. The adhesiveness of the glue frame is increased, so that glue between the cover substrates and the Polaroid can be limited in the glue frame effectively and glue overflow is prevented.

The invention relates to a glue overflow-preventing device, comprising a frame body and at least one glue-solidifying member, wherein the frame body is provided with a side wall arranged along a closed trajectory, and the side wall is provided with at least one notch. The glue-solidifying member is arranged on the external surface of the side wall. The glue overflow-preventing device can improve the condition of glue overflow. Besides, the invention also provides a baseplate-laminating method using the glue overflow-preventing device.

A manufacturing method of an injection molded part comprises the following steps that an injection mold is provided and comprises an upper mold and a lower mold, the upper mold is provided with a first mold hole, the lower mold is provided with at least one locating column and at least one second mold hole, each second mold hole is arranged around the corresponding locating column, and each secondmold hole is provided with a bottom face; at least one embedded nut is provided, and each embedded nut comprises a body, a locating cap arranged at one end of the body and a through hole penetratingthe body and the locating cap; each embedded nut is arranged in the corresponding second mold hole, the locating columns of the lower mold are arranged in the through holes of the embedded nuts in a penetrating manner, and the locating caps of the embedded nuts abut against the bottom faces; and plastic is injected into the injection mold so as to form plastic parts combined to the embedded nuts.In addition, the invention provides the injection molded part.

The invention relates to the technical field of printed circuit boards, in particular to a strippable blue glue plug hole jig and a strippable blue glue plug hole method. In the present invention, by setting a compressed air box and an air guide plate, compressed air is input into the compressed air box so that the air of a certain pressure is output from the compressed air box and introduced into the through hole of the PCB production board through the air guide hole of the air guide plate, and the silk screen can When stripping the blue glue, the peelable blue glue flowing to the bottom of the through hole is resisted upward by the compressed air, and the balance of gravity and resistance can prevent the peelable blue glue from flowing out of the through hole. At the same time, the air guide mesh backing plate stacked between the air guide plate and the compressed air box can be used to balance and stabilize the airflow entering the air guide plate, so that the airflow finally entering the through holes of the PCB production board is stable. , so that the surface of the peelable blue glue filled at the opening of the through hole is smooth.

The invention provides a method for laminating a cover film in a soft board. The method includes a first step of providing a soft copper clad substrate and the cover film, a welding disc is formed on the soft copper clad substrate, and a window is arranged on the cover film, a second step of enabling the cover film to be covered on the surface of the soft copper clad substrate, and enabling the welding disc to be exposed out of the window, a third step of forming a glue blocking layer corresponding to the window after the cover film is covered on the surface of the soft copper clad substrate, and a fourth step of laminating the soft copper clad substrate and the cover film after the glue blocking layer is formed. The glue blocking layer has good elastic deformation capacity under a high temperature and high pressure environment, can fully fill the window in the laminating process, and avoids glue leakage, so the method improves signal transmission capacity of a follow-up formed printed circuit board (PCB) soft board.

The invention relates to a glue overflow-preventing device, comprising a frame body and at least one glue-solidifying member, wherein the frame body is provided with a side wall arranged along a closed trajectory, and the side wall is provided with at least one notch. The glue-solidifying member is arranged on the external surface of the side wall. The glue overflow-preventing device can improve the condition of glue overflow. Besides, the invention also provides a baseplate-laminating method using the glue overflow-preventing device.

The invention discloses a substrate adhesion method, which is applied to adhesion of two substrates. The substrate adhesion method comprises the following steps of: providing an adhesive-overflowing resistant device, wherein the adhesive-overflowing resistant device comprises a frame body and at least one colloid solidification piece, the frame body is provided with a sidewall which is arranged along a closed track, the sidewall is provided with at least one notch, and the colloid solidification piece is arranged on an outer surface of the sidewall; placing the substrates in the frame body and coating a colloid between the substrates; pressing the substrates; and solidifying the colloid by the at least one colloid solidification piece. In the adhesive-overflowing resistant device, the colloid can be overflowed only from the notch on the sidewall of the frame body, so that the situation of adhesive overflowing can be improved. Moreover, the colloid solidification piece which is arranged on the outer surface of the sidewall can solidify the colloid on edges of the substrates after the substrates are pressed, so that the situation of adhesive overflowing after the substrates are taken out can be prevented. Furthermore, the adhesive-overflowing resistant device is used in the substrate adhesion method, so that the situation of the adhesive overflowing can be improved.

The invention discloses a method for making a highly weather-resistant and fragile label material, which includes the following steps: Q1: Select a non-corona-treated PET substrate with a thickness of 36 μm to 100 μm, and apply a weather-resistant coating on the surface of the PET substrate to obtain Composite film A and winding; Q2: Coating the color layer paint on the weather-resistant layer surface of composite film A to prepare composite film B and winding; Q3: Forming a covering layer on the surface of the color layer of composite film B to obtain a composite film C and rewinding; Q4: Coating the pressure-sensitive adhesive layer coating on the grid-shaped release paper or release film to obtain the composite film D; The sensitive adhesive layer is compounded to produce a highly weather-resistant and fragile label material. Through the above steps, the present invention can finally produce a highly weather-resistant and fragile label material, which has excellent chemical stability and physical properties, and meets high weather-resistant grade and fragile requirements, and has broad market prospects.

The invention discloses a chip LED and a manufacturing method thereof. The chip LED comprises a substrate and an LED chip. The substrate comprises a body, a front circuit layer on the upper surface of the body, a back circuit layer on the lower surface of the body, conducing vias on the body, and connecting circuit layers, wherein the connecting circuit layers used for electrically connecting the front circuit layer and the back circuit layer are arranged in the conducting vias. The LED chip is mounted on the front circuit layer by die bonding and wire bonding. The conducting vias are filled with rosin. The manufacturing method includes the sequential steps of substrate manufacturing, rosin filling, die bonding and wire bonding, baking, and cutting. By the use of the chip LED and the manufacturing method thereof, excessive glue can be avoided in compression molding process and product quality can be improved.

A display panel comprises a first substrate, a second substrate, a Polaroid and a glue frame. The first substrate is opposite to the second substrate which is between the first substrate and the Polaroid. The Polaroid is provided with a plurality of holes and the glue frame is disposed on the Polaroid. The glue frame is provided with a plurality of projections corresponding to the holes and disposed in the holes respectively. According to the invention, the stability of the glue frame on the Polaroid is improved in a cover substrate fit process because the projections of the glue frame are disposed in the holes of the Polaroid and the glue frame will not collapse because of press during fit of cover substrates. The adhesiveness of the glue frame is increased, so that glue between the cover substrates and the Polaroid can be limited in the glue frame effectively and glue overflow is prevented.