Display panel and package method thereof

A technology for display panels and packaging methods, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve problems such as overflow of filling glue, collapse of sealing glue, short pre-curing time of sealing glue, etc.

Active Publication Date: 2019-02-05
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention provides a display panel and its packaging method to solve the problem that in the current Dam&Filler packaging technology, the pre-curing time of the sealing glue is short, and the filling glue is pre-cured at the same time, so when the panels are pressed together, the sealing glue is very likely to be damaged. Filler collapsing and filling glue overflow phenomenon, which leads to packaging failure

Method used

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  • Display panel and package method thereof
  • Display panel and package method thereof
  • Display panel and package method thereof

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Embodiment 1

[0038] refer to figure 1 , shows a flow chart of steps of a display panel packaging method according to Embodiment 1 of the present invention.

[0039] The display panel packaging method of the embodiment of the present invention includes the following steps:

[0040] Step 101: forming a frame-shaped sealant on the cover substrate.

[0041] In the embodiment of the present invention, figure 2 It shows a schematic cross-sectional view of a packaging cover after forming a frame sealant, as shown in figure 2 As shown, first a cover substrate 10 may be provided, usually a glass substrate, and then a frame-shaped sealant 20 is formed on the cover substrate 10 . image 3 It shows a top view of the packaging cover plate after the frame sealant is formed, refer to image 3 The cover substrate area surrounded by the sealant 20 corresponds to the AA area (Active Area, effective display area) 01 in the display panel.

[0042] In a preferred embodiment, the material of the frame se...

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Abstract

The present invention provides a display panel and a package method thereof, and relates to the technical field of package. The method comprises the steps of: forming a frame-type box sealing glue ona cover plate substrate; forming filling glue on the cover plate substrate encircled by the box sealing glue; performing solidification of a mask to perform pre-solidification processing of the box sealing glue and obtain a package cover plate; laminating the display substrate and the package cover plate; performing secondary solidification processing of the box sealing glue; and performing presetsolidification processing for the filling glue to complete package. In the embodiment of the invention, the mask is solidified to separately perform pre-solidification processing for the box sealingglue, and at the same time, the filling glue cannot be subjected to pre-solidification processing to separately increase the solidification degree of the box sealing glue and improve the liquidity ofthe filling glue in the follow-up craft process so as to avoid the phenomenon that the box sealing glue can be collapsed by the filling glue and the filling glue is filled when the panel is laminated.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a display panel and a packaging method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices have been widely used in the field of display technology due to their advantages such as self-illumination, high contrast, thin thickness, wide viewing angle, low power consumption, and fast response. [0003] With the development and mass production of OLED devices, the corresponding packaging technology has also developed. In practical applications, top-emitting OLED display panels can usually be packaged with Dam&Filler (sealant and filler) packaging technology. [0004] However, in the current Dam&Filler packaging technology, while pre-curing the frame sealant with ultraviolet light, the filler will also be pre-cured for the same length of time. In order to ensure the fluidity of the filler, the pre-cure The time is usually...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/84H10K71/00
Inventor 贾文斌高昕伟李朋孙力
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
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