The invention provides a sensor packaging structure and a packaging method, and belongs to the technical field of semiconductors. The sensor packaging structure comprises: a substrate, wherein a sensing chip is arranged on the surface of the substrate, the working area of the sensing chip faces one side far away from the substrate, the circuit of the sensing chip is connected with the circuit of the substrate through a binding wire, a first accommodating groove is formed in the plate surface of a packaging cover plate, the first accommodating groove is filled with an insulating colloid, the packaging cover plate is arranged on the side, provided with the sensing chip, of the substrate in a covering mode, the binding wire is contained in the first accommodating groove so as to be embedded with the insulating colloid, the insulating colloid is used for bonding the packaging cover plate to the substrate, a second accommodating groove is formed in the side, close to the sensing chip, of the packaging cover plate, and the sensing chip is contained in the second accommodating groove. The invention aims to provide the sensor packaging structure and the packaging method, so that the binding wire connected between the sensing chip and the substrate can be well arranged and protected, the yield of the packaging structure is improved, and the packaging cost is reduced.