Technology for coating conductive resin and plastics through liquid silica gel

Abstract

The invention discloses a technology for coating conductive resin and plastics through liquid silica gel. The contact parts of a plastic element and a conductive piece are bonded; a positioning hole is formed in the plastic element, a positioning plug pin is arranged on the conductive piece, the positioning plug-pin is inserted into the positioning hole to be fixed, and the processed plastic piece is placed in a die to be positioned and fixed; die assembly, injection, curing and die opening are carried out, and after forming, the die is opened and a formed product is obtained; edges are torn so as to cut off abundant edges and corners of the formed product. Through glue adhesion, the positioning hole is matched with the positioning plug pin, and stable connection of the plastic element, a silicon gel plate and the conductive piece is guaranteed. The technology can greatly reduce waste materials, precision of products is controlled easily, materials do not need to be specially processed, the production process is simplified, and accordingly the aims of reducing production cost, improving product quality and reducing labor cost are achieved.

Description

technical field [0001] The invention relates to the field of encapsulation of liquid silica gel, in particular to an encapsulation process of encapsulating conductive adhesive and plastic at the same time with liquid silica gel. Background technique [0002] There are many kinds of silica gel, but molded silica gel is usually used in the production of processed products. A vulcanizing agent is added to this type of silicone system, and the silicone material is usually placed in the cavity of a hydraulic press and molded. Therefore, the silica gel that is usually said can only be molded, but not processed by an injection molding machine. There is a type of liquid silicone that can be injection molded by an injection molding machine. Because the vulcanization speed is fast, the injection molding and vulcanization are completed together. This type of liquid silicone is liquid at room temperature. Although it is processed by an injection machine, it is not strictly speaking in...

AI Technical Summary

Problems solved by technology

However, the molded silicone vulcanization process has a long cycle, and after the silicone vulcanization is processed into products, the materials are difficult to recycle. It is precisely because of these shortcomings that the application of silicone is limited.

[0003] In the existing injection encapsulation process, due to the high temperature and high pressure of liquid silicone, it is usually used to wrap a single material; when wrapping two composite materials, due to high temperature and extrusion, the deformation temperature of different composite materials is different and affected by the liquid state. Extrusion is different, and the composite material will undergo large displacement or deformation during processing, resulting in a high defective rate

At the same time, due to the low precision of the process, the material to be wrapped and the mold cannot be tightly seamed, and glue overflow and melting will occur during injection molding, and the finished product will produce a large amount of corner waste. A large amount of labor, high production costs

Images