Heat dissipation type packaging structure and forming method thereof

A packaging structure and heat dissipation technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of chip damage, chip micro-cracks, etc., to improve the stability and prevent the overflow of glue.

Active Publication Date: 2022-07-29
WEIHAI HONGLIN ELECTRIC POWER TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when steps are set around the chip, it is easy to cause micro-cracks in the chip, which will cause damage to the chip.

Method used

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  • Heat dissipation type packaging structure and forming method thereof
  • Heat dissipation type packaging structure and forming method thereof
  • Heat dissipation type packaging structure and forming method thereof

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Embodiment Construction

[0018] In order to better understand the technical solutions of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0019] It should be understood that the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] see Figure 1 to Figure 4 . It should be noted that the diagrams provided in this embodiment are only to illustrate the basic concept of the present invention in a schematic way, so the diagrams only show the components related to the present invention rather than the number, shape and the number of components in the actual implementation. For dimension drawing, the type, quantity and proportion of each component can be changed at wi...

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Abstract

The invention relates to a heat dissipation type packaging structure and a forming method thereof, and relates to the field of semiconductor packaging, and the method comprises the steps: installing a plurality of semiconductor tube cores on a circuit substrate in an inverted manner, and forming a step part, a first annular groove and a second annular groove in a first surface of a heat dissipation plate, the first annular groove is located between the step part and the second annular groove, the heat dissipation plate is bonded on a plurality of semiconductor tube cores through a heat conduction bonding layer, a separation film is arranged on the first surface of the heat dissipation plate in a pressing mode, and the separation film is directly attached to the bottom faces and the side faces of the continuous steps. The separation film covers the top end of the first annular groove and the top end of the second annular groove, a molding compound is injected between the separation film and the circuit substrate, and the molding compound supports the separation film, so that the molding compound fills the step part. The heat dissipation performance of the chip can be improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a heat dissipation type packaging structure and a method for forming the same. Background technique [0002] In the existing chip packaging structure, in order to ensure high heat dissipation of the chip, so as to facilitate the normal operation of the chip and prolong the service life of the chip, the surface of the chip is usually exposed to facilitate the heat dissipation of the chip. In the existing package structure that needs to expose the chip, steps are usually set directly around the chip, so as to prevent the surface of the chip from overflowing in the subsequent packaging process. However, when steps are arranged around the chip, it is easy to cause micro-cracks in the chip, thereby causing damage to the chip. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a heat dissipation package structure and a method for forming the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/31
CPCH01L23/367H01L23/3121
Inventor 贾海峰徐扬丁青成王文霞宋夫玉张士明宋华栋李其峰
Owner WEIHAI HONGLIN ELECTRIC POWER TECH CO LTD
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