Fingerprint sensor package module made and process for making fingerprint sensor package module

Abstract

The invention discloses a fingerprint sensor package module made and a process for making the fingerprint sensor package module. The fingerprint sensor package module includes a substrate, a fingerprint sensing chip, a plurality of metal wires, and an insulating package. The substrate comprises a mounting surface and a plurality of circuit contacts arranged on the mounting surface. Wherein the fingerprint sensing chip is arranged on the mounting surface of the substrate, the fingerprint sensing chip is provided with a first surface back to the mounting surface, a sensing area located on the first surface and a plurality of electrical contacts arranged on the first surface and adjacent to the periphery of the sensing area, and the distance between the electrical contacts and the sensing area is smaller than 300 microns. The metal wire is bridged between the circuit contact and the electrical contact. The insulating package covers the mounting surface of the substrate, the fingerprint sensing chip and the metal wire, and an open groove for exposing the sensing area is formed in the insulating package. Therefore, the size of the fingerprint sensing chip is not too large, and the sizeof the f fingerprint sensor package module is reduced.

Description

technical field [0001] The invention relates to a fingerprint sensing packaging module, in particular to a fingerprint sensing packaging module and a manufacturing method thereof. Background technique [0002] Generally, after the important components are installed in the fingerprint sensing packaging module, the protective structure is usually made by sealing the glue. However, during the sealing process, the sealing material is easy to contaminate the sensing area of ​​the fingerprint sensing chip due to the overflow problem. The situation will affect the sensitivity of the fingerprint sensing chip and affect the process yield. [0003] In addition, because the fingerprint sensing package module is often used in various electronic devices such as mobile phones and laptops, and because the space for installing various modules in general electronic devices is very limited, reducing the volume of the fingerprint sensing package module is the design priority. An important sub...

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Problems solved by technology

[0002] Generally, after the important components are installed in the fingerprint sensing packaging module, the protective structure is usually made by sealing the glue. However, during the sealing process, the sealing material is easy to contaminate the sensing area of ​​the fingerprint sensing chip due to the overflow problem. The situation will cause the sensitivity of the fingerprint sensor chip to be affected and affect the process yield

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