63results about How to "Improve perfection" patented technology

The invention relates to a method for cleaning the back surface of a tungsten plug CMP in the high-precision machining process of the surface of the tungsten plug for an integrated circuit in an ultra-large scale. A water polishing solution of an alkaline medium is utilized, and the water polishing solution comprises an activator, a chelator and a corrosion inhibitor. After an alkaline polishing process is just finished, the water polishing solution is added immediately, and a large-flow water polishing method is adopted, so that the residual polishing solution can be washed away, substances which can be cleaned easily are absorbed, the surface tension is quickly lowered, the reaction is prevented from continuing (physical adsorption state), a monomolecular passivating film is formed, and metal ions can form soluble chelates, thereby obtaining a clean and perfect polished surface. Moreover, the water polishing solution has the advantages of low cost, no pollution on the environment and no corrosion on the equipment.

The device comprises a crucible with a support, a heater and at least one heat-insulating screen, wherein, according to the invention, the heater is made of a starting flexible carbon-bearing material in the form of a cylinder whose ends are fixed between coaxially arranged rigid rings of carbon material that are connected to a power supply. And, the heater is made so that the wall thereof has its thickness determined from the relationship: delta . rho - c = 500 to 8500 J / m<2>. K, where: <> delta - heater wall thickness, m; rho - density of the material the heater is made of, kg / m<3>; and c - specific heat of the material the heater is made of (at working temperature), J / kg.K.

The invention relates to a method for cleaning a chip surface after polishing an aluminum wire in a super large scale integrated circuit, which is characterized by comprising the following steps of: preparing a water polishing liquid; weighing deionized water in weight percentage, adding 0.5-5% of surfactant, 0.1-5% of FA / O chelant type II and 0.01-5% of FA / O rust inhibitor type II while uniformly stirring, and preparing into a neutral water polishing liquid after uniform stirring; and after the chemical mechanical polishing (CMP) of the aluminum wire, immediately polishing the workpiece by using the neutral water polishing liquid in a high flow method so as to clean the surface. The invention has the advantage that water polishing is used before a polishing disk stops rotating after CMP, high flow water polishing is used to clean the chip surface, and no corrosion on equipment is produced; non-uniformly distributed polishing liquid and large particles remaining on the chip surface can be washed away quickly, so that a clean and perfect polishing surface can be obtained.

The invention discloses a laser cutting head for smoothing the burrs on the cutting surface during cutting, which comprises a mounting plate main body, a laser cutting head main body and a nozzle, a support plate is fixed on the left side of the bottom of the mounting plate main body, and the support plate A mounting hole is opened on the front side of the support plate, and a support frame is installed on the inner side wall of the support plate, and the internal thread of the mounting hole is connected with a mounting column. The laser cutting head that smoothes the burrs on the cutting surface during cutting is provided with a leveling wheel. When the entire laser cutting head moves to the right on the guide rail, it will drive the leveling wheel on the right side to move, so that the leveling wheel on the right side The flat wheel walks on the surface of the workpiece. If the level measuring wheel encounters a protruding surface when walking, the level measuring wheel will move upwards, thereby driving the main body of the laser cutting head to move upward through the fixed plate, thereby preventing the nozzle at the bottom of the main body of the laser cutting head from colliding with the The convex surfaces of the workpieces are in contact, thereby protecting the nozzle.

The invention relates to a surface cleaning method of a polished silicon substrate material, which is characterized by comprising the following concrete steps of: taking 0.5-5 parts of nonionic surfactant, 0.1-5 parts of FA / OII type chelating agent, 0.1-5 parts of FA / O II type compound corrosion inhibitor and the balance of deionized water in parts by weight, and uniformly stirring to prepare a water-soluble surface cleaning solution with the pH value of 6.5-7.6; carrying out polishing cleaning on a silicon substrate material subjected to alkaline chemical-mechanical polishing by using the cleaning solution obtained in the step 1 under the conditions of less than 4000Pa of low pressure and 400-5000ml / minute of large flow, wherein the polishing cleaning time is at least 30 seconds-3 minutes, so that the surface of the silicon substrate material is clean. The invention has the advantages that low-pressure large-flow cleaning is carried out on the silicon substrate material by immediately using the cleaning solution after the polishing process in a CMP (Chemical-Mechanical Polishing) working procedure, and a clean and perfect polished surface can be obtained.

The invention provides a door lock control system and a door lock control system control method, the door lock control system comprises a door lock actuator, a control module, a power supply module, a sound detection module, a camera module, a keyboard input module, a touch screen module, a voice module, a storage module and a clock module, the sound detection module is used for detecting sound and outputting a feedback signal to the control module, the camera module is used for obtaining an image signal and outputting the image signal to the control module, the keyboard input module is used for inputting a first cipher signal to the control module, the touch screen module is used for receiving a display signal outputted by the control module and inputting a second cipher signal to the control module, the voice module includes a first microphone and a sound production module, the first microphone is used to obtain a voice signal and store in the voice module, and the sound production module is used for receiving a voice control signal outputted by the control module and producing a sound. The door lock control system control method is conductive to saving resources and providing a user a more convenient and safer door lock.