45results about How to "Hinders fabrication" patented technology

A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

Provided are methods for fabricating fluid separation devices with precisely-sized, shaped microscopic capillaries that can separate one immiscible fluid from another on the basis of different separation characteristics. In particular, the method comprises the steps of fabricating a first set of capillaries having a first separation characteristic and a second set of capillaries having a second separation characteristic, incorporating one end of all of the capillaries into an inlet face, incorporating the second end of the first set of capillaries into a first outlet face, and incorporating the second end of the second set of capillaries into a second outlet face. Preferably, the first set of capillaries is hydrophillic and the second set of capillaries is hydrophobic.

A substantially transparent touch sensor panel having co-planar single-layer touch sensors and traces fabricated on a single side of a substrate for detecting single or multi-touch events. The touch sensor elements can be fabricated in columns and rows, with each sensor element in a row adjacent to a sensor element in a column. By using a board as the dielectric to connect traces from multiple sensor elements in each row, rather than using a dielectric layer on the substrate upon which the sensor elements and traces are formed, the sensor elements and traces on the substrate can be formed by simply patterning a single layer of conductive material on the substrate, which can simplify the manufacturing process of the substrate from a complexity and cost perspective.

A device for estimating machining dimensions of a machine tool which employs tool members each being rotatably driven by a driving unit includes: a vibration sensor; a characteristics extracting unit for extracting amounts of characteristics from an output of the vibration sensor; a neural network for classifying the amounts of characteristics into categories; and a conversion unit. Amounts of characteristics of generated output by racing the tool member are used for training the neural network, and inputted again to the trained competitive learning neural network to excite neurons so that the relationships between Euclidean distances and machining dimensions of workpieces are registered in the conversion unit. The Euclidean distances are obtained between weight vectors of the excited neurons and respective corresponding training samples, and the machining dimensions are obtained when the workpieces are machined by the tool members at the same condition as the respective corresponding training samples are obtained.