45results about How to "Hinders fabrication" patented technology

An oscillator circuit is provided that is preferably a crystal oscillator, where voltage placed across the crystal is regulated. The regulated voltage or amplitude of the cyclical signal across the crystal is monitored and maintained through a regulation circuit that measures a peak voltage across the crystal. Once the peak voltage exceeds a predetermined setpoint value, then a controller within the regulation circuit will reduce a biasing current through an amplifying transistor within the amplifier coupled across the crystal input and output nodes. By regulating the biasing current, gain from the amplifier is also regulated so that unwanted non-linearities and harmonic distortion is not induced within the crystal to cause frequency distortion and unwanted modes of oscillation within the crystal. The amplifier is preferably symmetrical in that the amplifier sources and sinks equal current to reduce unwanted peaks at the negative or positive half cycles of the sinusoidal signal.

A liquid recovery system is used by an immersion exposure apparatus. The liquid recovery system is provided with a first opening; a gap portion that is provided so that a liquid on an object that opposes the first opening can flow into the gap portion through the first opening; a liquid recovery part that suctions, through a porous member, at least part of the liquid that flows into the gap portion; and a second opening that is different from the first opening. The gap portion is open to the atmosphere through the second opening.

A liquid recovery system is used by an immersion exposure apparatus. The liquid recovery system is provided with: a first opening; a gap portion that is provided so that a liquid on an object that opposes the first opening can flow into the gap portion through the first opening; a liquid recovery part that suctions, through a porous member, at least part of the liquid that flows into the gap portion; and a second opening that is different from the first opening. The gap portion is open to the atmosphere through the second opening.

A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

A ceramic matrix composite material is disclosed having non-oxide ceramic fibers, which are formed in a complex fiber architecture by conventional textile processes; a thin mechanically weak interphase material, which is coated on the fibers; and a non-oxide or oxide ceramic matrix, which is formed within the interstices of the interphase-coated fiber architecture. During composite fabrication or post treatment, the interphase is allowed to debond from the matrix while still adhering to the fibers, thereby providing enhanced oxidative durability and damage tolerance to the fibers and the composite material.

A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic components embedded therein and one surface of each carrier board has a plurality of electrode plates. The two carrier boards are laminated with the dielectric constant material layer interposed between them. The electrode plates on the surfaces of the carrier boards are opposite to each other across the high dielectric constant material layer to constitute a capacitor array. Therefore, the capacitor assembly for design of electronic devices is provided.

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Provided are methods for fabricating fluid separation devices with precisely-sized, shaped microscopic capillaries that can separate one immiscible fluid from another on the basis of different separation characteristics. In particular, the method comprises the steps of fabricating a first set of capillaries having a first separation characteristic and a second set of capillaries having a second separation characteristic, incorporating one end of all of the capillaries into an inlet face, incorporating the second end of the first set of capillaries into a first outlet face, and incorporating the second end of the second set of capillaries into a second outlet face. Preferably, the first set of capillaries is hydrophillic and the second set of capillaries is hydrophobic.

A substantially transparent touch sensor panel having co-planar single-layer touch sensors and traces fabricated on a single side of a substrate for detecting single or multi-touch events. The touch sensor elements can be fabricated in columns and rows, with each sensor element in a row adjacent to a sensor element in a column. By using a board as the dielectric to connect traces from multiple sensor elements in each row, rather than using a dielectric layer on the substrate upon which the sensor elements and traces are formed, the sensor elements and traces on the substrate can be formed by simply patterning a single layer of conductive material on the substrate, which can simplify the manufacturing process of the substrate from a complexity and cost perspective.

Silicon-on-insulator (SOI) structures with silicon layers less than 20 nm thick are used to form extremely thin silicon-on-insulator (ETSOI) semiconductor devices. ETSOI devices are manufactured using a thin tungsten backgate encapsulated by thin nitride layers to prevent metal oxidation, the tungsten backgate being characterized by its low resistivity. The structure further includes at least one FET having a gate stack formed by a high-K metal gate and a tungsten region superimposed thereon, the footprint of the gate stack utilizing the thin SOI layer as a channel. The SOI structure thus formed controls the Vt variation from the thin SOI thickness and dopants therein. The ETSOI high-K metal backgate fully depleted device in conjunction with the thin BOX provides an excellent short channel control and significantly lowers the drain induced bias and sub-threshold swings. The present structure supports the evidence of the stability of the wafer having a tungsten film during thermal processing, and especially during STI and contact formation.

The present disclosure relates to a method of cutting a flexible display device, capable of preventing a generation of a defect at the time of cutting the flexible display device, the method including providing a glass mother substrate having a flexible substrate attached thereon and an insulating layer formed on the flexible substrate; melting the flexible substrate and the insulating layer on the mother substrate by irradiating with a first laser beam; and cutting the mother substrate exposed by the irradiation of the first laser beam using a cutting device.

A method for forming a parylene film is provided, which includes following steps. Providing a chemical vapor deposition apparatus including a buffer chamber having first and second valves and a rotative carrying apparatus, an evaporator connected with the second valve, a pyrolysis chamber connected with the evaporator, and a deposition chamber connected with the pyrolysis chamber. Placing a parylene material in the rotative carrying apparatus of the buffer chamber through the first valve. Turning off the first and second valves and balancing a pressure in the buffer chamber and a pressure in the evaporator. Turning on the second valve and delivering the parylene material into the evaporator. Evaporating the parylene material in the evaporator to form a parylene gas. Pyrolyzing the parylene gas in the pyrolysis chamber to form a parylene monomer. Delivering the parylene monomer to the deposition chamber for deposition so as to form a parylene film.

A device for estimating machining dimensions of a machine tool which employs tool members each being rotatably driven by a driving unit includes: a vibration sensor; a characteristics extracting unit for extracting amounts of characteristics from an output of the vibration sensor; a neural network for classifying the amounts of characteristics into categories; and a conversion unit. Amounts of characteristics of generated output by racing the tool member are used for training the neural network, and inputted again to the trained competitive learning neural network to excite neurons so that the relationships between Euclidean distances and machining dimensions of workpieces are registered in the conversion unit. The Euclidean distances are obtained between weight vectors of the excited neurons and respective corresponding training samples, and the machining dimensions are obtained when the workpieces are machined by the tool members at the same condition as the respective corresponding training samples are obtained.