The invention relates to an
epoxy resin composition for a
copper-clad board and an application thereof. The
epoxy resin composition comprises
flame retardant additives containing
phosphorus and
flame retardant additives containing
bromine and can be used for preparing prepreg and
copper-clad laminated boards. According to the
epoxy resin composition for the
copper-clad board and the application thereof, brominated
polystyrene,
decabromodiphenyl ethane and the like are adopted to serve as sources of the
bromine,
phosphazene,
melamine polyphosphate, aluminum
metaphosphate or
melamine cyanurate and the like serve as sources of the
phosphorus, the proportion of the
flame retardant additives containing the
phosphorus and the flame retardant additives containing the
bromine of the composition is adjusted to make the bromine content controlled between 5% and 12% and make the phosphorus content controlled between 0.2% and 1.5%, and the flame retardancy of the composition can reach grade UL94 V-0; compared with a pure-bromine flame-retardant copper-clad board, the
heat resistance is higher, and a higher CTI value can be reached; compared with a pure-phosphorus flame-retardant copper-clad board, the rate of
moisture absorption is lower, and the
adhesive property and the technological
operability which are needed for printing circuit substrates can be provided; compared with a traditional board which has a high CTI and adopts a large amount of aluminum
hydroxide, by means of the epoxy resin composition for the copper-clad board, the CTI can reach to be above 600 V by utilizing a small amount of the aluminum
hydroxide or not utilizing the aluminum
hydroxide at all.