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Epoxy resin copper-clad plate with high comparative tracking index suitable for PCB (Printed Circuit Board) manufacturing process and preparation method of epoxy resin copper-clad plate

A tracking index, epoxy resin technology, applied in chemical instruments and methods, synthetic resin layered products, lamination, etc., to achieve the effects of good flame retardancy, high tracking index, good toughness and peel strength

Pending Publication Date: 2022-04-12
江西省宏瑞兴科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the electrical safety of substrate materials, copper clad laminates with a high comparative tracking index have become an inevitable choice. The requirement for CTI to reach 600V has become more and more common and has become a development trend, while traditional FR-4 often only reaches 175V Left and right, can no longer meet the requirements of high CTI

Method used

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  • Epoxy resin copper-clad plate with high comparative tracking index suitable for PCB (Printed Circuit Board) manufacturing process and preparation method of epoxy resin copper-clad plate
  • Epoxy resin copper-clad plate with high comparative tracking index suitable for PCB (Printed Circuit Board) manufacturing process and preparation method of epoxy resin copper-clad plate
  • Epoxy resin copper-clad plate with high comparative tracking index suitable for PCB (Printed Circuit Board) manufacturing process and preparation method of epoxy resin copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] 1. The mass percent composition of the solids in the resin composition is 68%, and all the other are organic solvents (what this embodiment adopts is dimethylformamide), wherein, the formula of the solids is shown in the following table 1 (by weight ) as shown:

[0064] Table 1

[0065] raw material solid weight Low Bromine Specialty Epoxy Resin 58 High bromine resin 5 Dicyandiamide 1.5 Aluminum hydroxide 25 Silica powder 10 2MI 0.05

[0066] 2. Glue baking:

[0067] Prepreg gluing speed 13m / min;

[0068] 3. Prepreg control parameters:

[0069] Gel time 85 seconds;

[0070] Resin content 48.0%;

[0071] Resin fluidity 18%;

[0072] Volatile content 0.15%.

[0073] 4. Platen parameters:

[0074] Vacuum degree -0.085MPa;

[0075] Pressure 120-450psi;

[0076] Hot plate temperature 100-220℃;

[0077] Curing time >170°C for 35 minutes.

[0078] 5. The performance parameters of the substrate are shown in Table 2 be...

Embodiment 2

[0082] 1. the mass percent composition of the solids in the resin composition is 64%, and all the other are organic solvents (such as dimethylformamide), wherein, the formula of the solids is shown in the following table 3 (by weight):

[0083] table 3:

[0084] raw material solid weight Low Bromine Specialty Epoxy Resin 67 High bromine resin 3 Dicyandiamide 1.9 Aluminum hydroxide 20 Silica powder 8 2MI 0.05

[0085] 2. Glue baking:

[0086] Prepreg gluing speed 15m / min;

[0087] 3. Prepreg control parameters:

[0088] Gel time 95 seconds;

[0089] Resin content 48%;

[0090] Resin fluidity 22%;

[0091] Volatile content 0.11%.

[0092] 4. Platen parameters:

[0093] Vacuum degree -0.092MPa;

[0094] Pressure 120-500 psi;

[0095] Hot plate temperature 100-220℃;

[0096] Curing time >170°C for 36 minutes.

[0097] 5. The performance parameters of the substrate are shown in Table 4 (by weight):

[0098] Table 4

[...

Embodiment 3

[0101] 1. The mass percent composition of the solids in the resin composition is 62%, and all the other are organic solvents (such as dimethylformamide), wherein, the formula of the solids is shown in the following table 5 (by weight):

[0102] table 5

[0103] raw material solid weight Low Bromine Specialty Epoxy Resin 55 High bromine resin 9 Dicyandiamide 1.2 Aluminum hydroxide 30 Silica powder 12 2MI 0.05

[0104] 2. Glue baking:

[0105] Prepreg gluing speed 18m / min;

[0106] 3. Prepreg control parameters:

[0107] Gel time 102 seconds;

[0108] Resin content 49%;

[0109] Resin fluidity 18%;

[0110] Volatile content 0.13%.

[0111] 4. Platen parameters:

[0112] Vacuum degree -0.095MPa;

[0113] Pressure 120-500psi;

[0114] Hot plate temperature 100-220℃;

[0115] Curing time >170°C for 40 minutes.

[0116] 5. The performance parameters of the substrate are shown in Table 6:

[0117] Table 6

[0118]

[...

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Abstract

The invention discloses an epoxy resin copper-clad plate with high comparative tracking index suitable for a PCB (printed circuit board) manufacture procedure, the epoxy resin copper-clad plate is prepared from an adhesive, glass fiber cloth and copper foil, the adhesive is composed of 50-75% by weight of solid matter and the balance of organic solvent, and the glass fiber cloth and the copper foil are bonded to form the epoxy resin copper-clad plate. The solid matter is prepared from the following components in percentage by weight: 50 to 70 percent of low-bromine special epoxy resin; 2%-12% of high-bromine resin; 0.5%-5% of dicyandiamide; 0.01-1% of an epoxy resin curing accelerator; and 25%-45% of an inorganic filler. The invention also discloses a preparation method of the composition. The copper-clad laminate prepared by the invention has a high tracking index (CTI is greater than or equal to 600V), good toughness and peel strength and good flame retardance, and can be suitable for manufacturing a high-CTI printed circuit board.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to an epoxy resin copper clad laminate with a high relative tracking index suitable for PCB manufacturing process and a preparation method thereof. Background technique [0002] Social development and progress are getting faster and faster, and more and more household electrical appliances have entered ordinary households, and the rapid development of the electrical and electronic industry just meets the growing demand for electronic consumption in China. Copper clad laminates with good electrical insulation properties are required for the main substrates used in home appliances such as plasma displays, LCDs, televisions, refrigerators, and washing machines. [0003] This puts forward higher and stricter requirements for the copper clad laminate as an important substrate. The FR-4 material produced by the traditional formula has good insulation, heat resistance, di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/14B32B17/04B32B27/04B32B27/38B32B27/20B32B27/24B32B27/26B32B38/08B32B38/16B32B37/10B32B37/06B32B38/00C08L63/00C08L101/04C08K7/14C08K3/22C08K3/36C08J5/04C08J5/18
Inventor 况小军叶志
Owner 江西省宏瑞兴科技股份有限公司
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