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Epoxy resin adhesive with high comparative tracking index and preparation method thereof

A tracking index, epoxy resin technology, applied in epoxy resin glue, polymer adhesive additives, non-polymer adhesive additives and other directions, can solve problems such as difficulty in meeting

Pending Publication Date: 2021-04-09
江西省宏瑞兴科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional FR-4 copper clad laminates will be difficult to meet this development demand, and copper clad laminates with high comparative tracking index (CTI) must be produced

Method used

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  • Epoxy resin adhesive with high comparative tracking index and preparation method thereof
  • Epoxy resin adhesive with high comparative tracking index and preparation method thereof
  • Epoxy resin adhesive with high comparative tracking index and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] 1. the mass percent composition of the solids in the resin composition is 69%, and all the other are organic solvents (such as dimethylformamide), wherein, the formula of the solids is shown in the following table 1 (by weight);

[0043] Table 1

[0044]

[0045] 2. Glue baking:

[0046] The prepreg gluing speed is 12m / min.

[0047] 3. Prepreg control parameters:

[0048] The gel time is 90 seconds; the resin content is 48.1%;

[0049] Resin fluidity is 19%; volatile matter is 0.18%;

[0050] 4. Platen parameters:

[0051] The vacuum degree is -0.088MPa; the pressure is 120-500psi;

[0052] The hot plate temperature is 100-220°C; the curing time is >170°C for 30 minutes.

[0053] 5. The performance parameters of the substrate are shown in Table 2:

[0054] Table 2

[0055] project Test Results Glass transition temperature (DSC), °C 141 Copper Foil Peel Strength(1oz),lb / in 9.3 T260(TMA),min 20 Flame retardant (UL-94, rating) ...

Embodiment 2

[0057] 1. the mass percent composition of the solids in the resin composition is 65%, and all the other are organic solvents (such as dimethylformamide), wherein, the formula of the solids is shown in the following table 3 (by weight);

[0058] table 3

[0059]

[0060] 2. Glue baking:

[0061] The prepreg gluing speed is 14m / min.

[0062] 3. Prepreg control parameters:

[0063] The gel time is 93 seconds; the resin content is 49%;

[0064] Resin fluidity is 18%; volatile matter is 0.15%;

[0065] 4. Platen parameters:

[0066] The vacuum is -0.090MPa; the pressure is 120-500psi;

[0067] The hot plate temperature is 100-220°C; the curing time is >170°C for 30 minutes.

[0068] 5. The performance parameters of the substrate are shown in Table 4:

[0069] Table 4

[0070] project Test Results Glass transition temperature (DSC), °C 143 Copper Foil Peel Strength(1oz),lb / in 9.1 T260(TMA),min 22 Flame retardant (UL-94, rating) V-0 CT...

Embodiment 3

[0072] 1. the mass percent composition of the solids in the resin composition is 63%, and all the other are organic solvents (such as dimethylformamide), wherein, the formula of the solids is shown in the following table 5 (by weight):

[0073] table 5

[0074]

[0075] 2. Glue baking:

[0076] The prepreg gluing speed is 15m / min.

[0077] 3. Prepreg control parameters:

[0078] The gel time is 96 seconds; the resin content is 49.5%;

[0079] Resin fluidity is 17%; volatile matter is 0.16%;

[0080] 4. Platen parameters:

[0081] The vacuum is -0.085MPa; the pressure is 120-500psi;

[0082] The hot plate temperature is 100-220°C; the curing time is >170°C for 30 minutes.

[0083] 5. The performance parameters of the substrate are shown in Table 6:

[0084] project Test Results Glass transition temperature (DSC), °C 139 Copper Foil Peel Strength(1oz),lb / in 9.8 T260(TMA),min 18 Flame retardant (UL-94, rating) V-0 CTI(V) >600 ...

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Abstract

The invention discloses an epoxy resin adhesive with high comparative tracking index, which is characterized in that the percentages of the solid weights of the components (without a solvent) with respect to the total solid weight of the composition are as follows: 32%-70% of bisphenol A brominated epoxy resin; 5%-20% of basic epoxy resin; 0.5%-5% of dicyandiamide; 0.01-1% of an epoxy resin curing accelerator; and 15%-40% of inorganic filler. The invention also discloses a preparation method of the epoxy resin adhesive. A copper-clad plate prepared from the resin adhesive provided by the invention has a high tracking index (CTI is greater than or equal to 600V), and also has good toughness and peel strength and good flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of new materials, and relates to a high tracking index epoxy resin adhesive for making copper-clad laminates and a preparation method thereof. Background technique [0002] Copper clad laminate is the basic electronic material of the printed circuit industry. With the rapid development of the electronic industry, electronic and electrical products have penetrated into every corner of modern informationization, and are widely used in information, communication, military, aerospace, instrumentation, power supply and automotive electrical appliances. In other aspects, with the development trend of electronic products to light, thin, short, small and high-speed digital signal processing, the printed circuit board is promoted to develop in the direction of high density, multi-layer and thin. The copper clad laminates of important substrates put forward higher and stricter requirements, and the adhesive as the cor...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J11/08C08G59/40
CPCC09J163/00C09J11/04C09J11/08C08G59/4021C08L2205/025C08K2003/2227C08K2003/3045C08L63/00C08K3/22C08K3/36C08K3/30
Inventor 况小军叶志
Owner 江西省宏瑞兴科技股份有限公司
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