37results about How to "High end-capping efficiency" patented technology

The invention provides an alkoxy-terminated 107 adhesive and a preparation method thereof. The terminal group of the 107 adhesive is terminated by R'aSiOR''(4-a). The preparation method comprises the following steps: (1) adding dihydroxy polydimethylsiloxane and dimethyl dichlorosilane into a reaction kettle, reacting at 8-15 DEG C, and adding an acid-binding agent; (2) after the reaction in the step (1) finishes, continuing adding the R'aSiOR''(4-a), reacting at 60-80 DEG C, and after the reaction finishes, continuing heating to 90-110 DEG C, thereby preparing the product alkoxy-terminated 107 adhesive. When the alkoxy-terminated 107 adhesive is tested by a conventional detection method, the result proves that the termination reaction achieves favorable effect, has the advantages of mild conditions and high termination efficiency and can implement continuous production.

The invention relates to a preparation method of a hydrolysis-resistant PBT polyester resin. Firstly, terephthalic acid, 1,4-butanediol, an organic titanate compound and magnesium phosphate are mixed to form a slurry, which is subjected to an esterification reaction to obtain Prepolymer, and then carry out melt polycondensation reaction to obtain PBT polyester resin base sheet, and finally mix PBT polyester resin base sheet with end-capping modifier and organic phosphate compound in a twin-screw extruder to obtain hydrolysis-resistant PBT Polyester resin; in terms of mass fraction, the addition ratio of each substance required in the mixing preparation process is: 97-99 parts of PBT polyester resin substrate, 0.5-1 part of end-capping modifier, 0.01-1 part of organic phosphate compound 1 part; the end-cap modifier is a hyperbranched polyester with terminal hydroxyl numbers of 6-100 and branch units comprising 2,2-dimethylolpropionic acid. The preparation method of the invention is simple, and the prepared hydrolysis-resistant PBT polyester resin has excellent comprehensive properties.

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end encapsulation positioning of the chips of inverted type multi-layer ceramic capacitors. The chip positioning device includes a first guide plate with a plurality of uniformly-arranged first through holes, a second guide plate with a plurality of uniformly-arranged second through holes, and a positioning plate with a plurality of uniformly-arranged third through holes; the length and width of the first through holes are matched with the length and thickness of the chips; the number and distribution positions of the second through holes are matched with the number and distribution positions of the first through holes; the width of the second through holes is equal to the width of the first through holes; the depth of the second through holes is larger than the width of the chips; the number and the distribution positions of the third through holes are matched with the number and the distribution positions of the second through holes; and the width of the third through holes is equal to the width of the second through holes. With the chip positioning device and the chip positioning method adopted, the orientation of the positioning of the chips of the inverted type multi-layer ceramic capacitors in end encapsulation can be ensured, end encapsulation efficiency can be improved, and operation is convenient.