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Chip positioning device and chip positioning method

A technology of positioning device and positioning method, which is applied in fixed capacitor parts, fixed capacitor dielectric, capacitor manufacturing, etc., can solve the problems of wrong chip positioning and low sealing efficiency of chips, etc.

Active Publication Date: 2018-03-09
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the terminal board, the problem of wrong orientation of the chip is prone to occur, so that the terminal electrodes are mistakenly formed on the two opposite short sides of the chip, so the flip-chip Type multilayer ceramic capacitors have low chip termination efficiency

Method used

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  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method

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Embodiment Construction

[0035] The chip positioning device and the chip positioning method used for the terminal sealing positioning of the chip of the flip-chip multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings and specific embodiments.

[0036] to combine figure 2 , the surface formed by the length (L) and width (W) of the chip 200 of the flip-chip multilayer ceramic capacitor is the main surface, and the surface formed by the length (L) and thickness (T) of the chip 200 is the short side, and the surface of the chip 200 The surfaces formed by width (W) and thickness (T) are long sides. Terminal electrodes of the flip-chip multilayer ceramic capacitor are formed on opposite long sides of the chip 200 .

[0037] to combine Figure 3 ~ Figure 4 , the chip positioning device of an embodiment used for the termination positioning of the chip 200 of the flip-chip multilayer ceramic capacitor includes: a first guide plate 10 , a ...

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Abstract

The present invention discloses a chip positioning device and method. The chip positioning device used for blocking positioning of chips of an inverse multilayer ceramic capacitor comprises: a plurality of first guide plates of first through holes uniformly arranged, wherein the length of the first through hole matches the width of the chip; a plurality of second guide plates of second through holes uniformly arranged, wherein the number and the distribution positions of the second through holes match the first through hole, and the length of each second through hole is equal to the length of each first through hole; a plurality of fixed plates of third through holes uniformly arranged, wherein the number and the distribution positions of the third through holes match the number and the distribution positions of the second through holes, the length of each third through hole is equal to the length of each second through hole, and the width of each third through hole matches with the thickness of the chip. The chip positioning device and method are able to ensure the correct positioning orientation when the chips of the inverse multilayer ceramic capacitor are blocked, improve the blocking end efficiency and facilitate the operation.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a chip positioning device and a chip positioning method for end-sealing positioning of chips of flip-chip multilayer ceramic capacitors. Background technique [0002] Flip-chip multilayer ceramic capacitors are a kind of specially designed multilayer ceramic capacitors. The specifications include 0204, 0306, 0508, 0612, etc. The difference from conventional multilayer ceramic capacitors is that the length and width of the capacitor chip are reversed. For example, the flip-chip multilayer ceramic capacitor corresponding to the 0402 specification (0.04 inches in length and 0.02 inches in width) of a conventional multilayer ceramic capacitor is the 0204 specification (0.02 inches in length and 0.04 inches in width). The flip-chip multilayer ceramic capacitor has a greatly reduced aspect ratio compared with conventional products, so the equivalent series inductance is greatly red...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G13/00H01G4/30H01G4/12
CPCH01G4/12H01G4/30H01G13/00
Inventor 卓金丽陆亨廖庆文安可荣
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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