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Chip positioning device and chip positioning method

A technology of positioning device and positioning method, which is applied in the directions of packaging capacitor devices, fixed capacitor dielectrics, fixed capacitor components, etc., can solve the problems of wrong chip positioning and orientation, low chip end sealing efficiency, etc.

Active Publication Date: 2016-09-07
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the terminal board, the problem of wrong orientation of the chip is prone to occur, so that the terminal electrodes are mistakenly formed on the two opposite short sides of the chip, so the flip-chip Type multilayer ceramic capacitors have low chip termination efficiency

Method used

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  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method

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Embodiment Construction

[0040] The chip positioning device and the chip positioning method used for the end-sealing positioning of the chip of the flip-chip multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings and specific embodiments.

[0041] combine figure 2 , the surface formed by the length (L) and width (W) of the chip 200 of the flip-chip multilayer ceramic capacitor is the main surface, and the surface formed by the length (L) and thickness (T) of the chip 200 is the short side, and the surface of the chip 200 The surfaces formed by width (W) and thickness (T) are long sides. Terminal electrodes of the flip-chip multilayer ceramic capacitor are formed on opposite long sides of the chip 200 .

[0042] combine Figure 3 ~ Figure 4 , the chip positioning device of an embodiment used for the termination positioning of the chip 200 of the flip-chip multilayer ceramic capacitor includes: a first guide plate 10 , a second guid...

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Abstract

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end packaging positioning of chips of an inversion-type multilayer ceramic capacitor. The chip positioning device comprises a first guide plate provided with a plurality of uniformly-arranged first through holes, wherein the length of each first through hole is matched with the width of each chip; a second guide plate provided with a plurality of uniformly-arranged second through holes, wherein the number and distribution positions of the second through holes are matched with those of the first through holes, the length of each second through hole is equal to that of each first through hole, and the width of each second through hole is matched with the thickness of the chip; and a positioning plate provided with a plurality of uniformly-arranged third through holes, wherein the number and distribution positions of the third through holes are matched with those of the second through holes, the length and width of each third through hole are equal to the length and width of each second through hole. The chip positioning device and the chip positioning method can ensure correct positioning orientation of the chips of the inversion-type multilayer ceramic capacitor during end packaging, can improve end packaging efficiency and is convenient to operate.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a chip positioning device and a chip positioning method for end-sealing positioning of chips of flip-chip multilayer ceramic capacitors. Background technique [0002] Flip-chip multilayer ceramic capacitors are a kind of specially designed multilayer ceramic capacitors. The specifications include 0204, 0306, 0508, 0612, etc. The difference from conventional multilayer ceramic capacitors is that the length and width of the capacitor chip are reversed. For example, the flip-chip multilayer ceramic capacitor corresponding to the 0402 specification (0.04 inches in length and 0.02 inches in width) of a conventional multilayer ceramic capacitor is the 0204 specification (0.02 inches in length and 0.04 inches in width). The flip-chip multilayer ceramic capacitor has a greatly reduced aspect ratio compared with conventional products, so the equivalent series inductance is greatly red...

Claims

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Application Information

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IPC IPC(8): H01G2/10H01G13/00H01G4/12H01G4/30
CPCH01G2/10H01G4/12H01G4/30H01G13/003
Inventor 陆亨安可荣卓金丽廖庆文
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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