The invention provides a micro-nano structure curing method, which comprises the following steps: placing a developed
wafer with a micro-nano pattern structure in a deionized water solution, and replacing a developing solution on the
wafer with deionized water; placing the replaced
wafer on a slide holder in a
microwave drying chamber, and starting a vacuum adsorption device so as to fix the waferon the slide holder; starting a
microwave power source, completely applying
microwave power into the microwave
drying chamber through a microwave
coupling matcher, and performing microwave
drying curing on the micro-nano pattern structure on the wafer; and after the
microwave power source is started for a period of time, starting the
vacuum pump set connected with the microwave drying chamber, sothat the
water vapor in the chamber is discharged out of the chamber until solidification is completed, and finally moving out the wafer. According to the micro-nano solidification method,
moisture on the wafer can be effectively and thoroughly removed, then the micro-nano structures are dried and solidified, and collapse of the micro-nano structures cannot be caused in the solidification process.