49results about How to "Depth Precise Control" patented technology

The invention discloses low-altitude glass. The low-altitude glass is characterized in that upper glass and lower glass are convex; the welding peripheries of the upper glass and the lower glass are respectively provided with an edge sealing strip frame and an edge sealing groove; and the upper and lower glass are welded together by metal or alloy solders in a high-temperature edge sealing furnace, so that the low-altitude glass is simpler and more convenient to manufacture, and a sealing effect is ensured by the embedding combination of the edge sealing strip frame and the edge sealing groove. A manufacturing method of the low-altitude glass provided by the invention is simple in process, low in cost and high in production efficiency, can ensure reliable sealing connection and the good sealing effect, can be used for manufacturing low-altitude glass in mass by virtue of a one-step method, and not only can be used for manufacturing common low-altitude glass, but also is particularly suitable for manufacturing of tempered low-altitude glass; and the low-altitude glass manufactured by the method is high in wind pressure resistance and good in heat insulation and sound insulation.

The invention discloses a seeder depth control system. Land unevenness is collected by an ultrasonic sensor and converted into an electrical signal; the electrical signal is transmitted to a PLC to process; processing results are output an analog output module; action of an electromagnetic valve is controlled; an oil cylinder is driven to descend or ascend; a ditcher depth regulator is controlled in real time. Seeding depth can be regulated quickly and accurately. Seeding depth of a seeder can be precisely controlled effectively. Related parameters can be set in real time through an embedded integrated touch screen. The touch screen is communicated with the PLC through a communication port. Related information acquired is centrally displayed in real time. The seeder depth control system has the advantages that the quality of crop planting is guaranteed, the copying form of each component of a seeding unit of the precision seeder can be designed into independent copying, and seeding depth can be independently controlled according to surface fluctuation.

The present invention puts forward a method for roughening a surface of a semiconductor layer, comprising: forming a solid metal or alloy film on a semiconductor layer; performing annealing for preset time at a preset temperature above the melting point of the metal or alloy to enable the metal or alloy film to be liquefied into a plurality of metal or alloy liquid drops, then cooling to the temperature below the melting point of the metal or alloy to enable the plurality of metal or alloy liquid drops to be condensed into a plurality of metal or alloy island-shaped projections; etching a concave-convex structure on the top surface of the semiconductor layer by taking the plurality of metal or alloy island-shaped projections as mask layers, so as to form a roughened surface; and removing the plurality of metal or alloy island-shaped projections. The method for roughening the surface of the semiconductor layer has the advantages of good uniformity, stability and reliability. The present invention also puts forward a method for forming an LED structure with a roughened surface.

The invention belongs to the technical field of medical instruments, particularly to an acupuncture needle. The acupuncture needle comprises a needle handle, a needle body, a magnet ring, a magnetic sheet, scale marks, a fixing bolt and a screw hole, wherein the needle body is fixedly connected with the lower end of the needle handle, the other end of the needle body is a needle point, the magnet ring is provided with a first center hole, and is sleeved with the needle body in a sliding manner and fixed on the needle body; the magnetic sheet is provided with a second center hole and used for accommodating the magnet ring; the side surface of the second center hole is in smooth contact with the outer side surface of the magnet ring; the scale marks are arranged on the needle body from the needle point above, and the fixing bolt and the screw hole are formed in the magnet ring. During the use, a specific acupuncturing part can be positioned through the second center hole of the magnetic sheet, the acupuncture depth can be set according to specific treatment conditions, the magnet ring is fixed in the position of a corresponding scale mark on the needle body, then acupuncture and moxibustion can be performed, accuracy control to the acupuncture depth can be achieved, adverse effects caused by over deep needle insertion or over light needle insertion can be prevented, besides, the magnet ring and the magnetic sheet are used in the invention, so that the needle body can be magnetized, and a magnetic therapy effect can be achieved at the same time during acupuncture.

The invention discloses low-altitude glass. The low-altitude glass is characterized in that upper glass and lower glass are convex; the welding peripheries of the upper and lower glass are provided with an edge sealing strip frame and an edge sealing groove; and the upper and lower glass are welded together by glass solders in a high-temperature edge sealing furnace, so that the low-altitude glass is simpler and more convenient to manufacture, and a sealing effect is ensured by the embedding combination of the edge sealing strip frame and the edge sealing groove. A manufacturing method of the low-altitude glass provided by the invention is simple in process, low in cost and high in production efficiency, can ensure reliable sealing connection and the good sealing effect, can be used for manufacturing low-altitude glass in mass by virtue of a one-step method, and not only can be used for manufacturing common low-altitude glass, but also is particularly suitable for manufacturing of tempered low-altitude glass; and the low-altitude glass manufactured by the method is high in wind pressure resistance and good in heat insulation and sound insulation.

The invention provides an ion implantation doped HfO2 based preparation process of an HfO2 MIFS ferroelectric gate. The preparation process comprises the steps of firstly, cleaning a P-Si or n-Si substrate by a standard cleaning process to remove particles and other pollutants on a Si surface, afterwards depositing an appropriate thickness of HfO2 on a silicon wafer, and performing annealing; secondly, doping HfO2 by an ion implanter, and annealing the doped HfO2; thirdly, depositing a top electrode on the doped HfO2, namely halfnium oxide ferroelectric thin film, and performing rapid thermal treatment on the electrode; and finally, etching an MFIS multi-layer thin film structure to form an MFIS array unit which is matched with the sizes of a source, a drain and a channel by a reactive ion etching method. By the preparation process, the doping concentration of the HfO2 ferroelectric gate thin film can be accurately controlled, and the preparation process is a mature operation process for preparing the thin film relatively simple to prepare and with lower preparation temperature.

The invention relates to a method for machining a deep groove. The method specifically comprises the following steps: establishing a deep groove machining device comprising a pedestal, a power part, a cutting part, a deep microadusting part, and the like; clamping a machining workpiece on the deep groove machining device; adjusting the position of a groove joint on the workpiece to be machined; machining the first groove joint of a first deep groove by a cutting method; after cutting to be tested is finished, using a deep microadusting part for microadjustment and position limit according to actual machining depth; carrying out cutting again till the machining of the first groove joint is finished; rotating and adjusting a rotary disc, so that the rotary disc is rotated for certain angle; carrying out the cutting machining from the second groove joint to the final groove joint sequentially; after the groove joints of two sides of all the deep grooves are totally machined, detaching the workpiece to be machined; cutting off groove bottom between the groove joints of two sides of all the deep grooves; and completing the machining of all the deep grooves. The method has a simple manufacturing process, simple equipment, low energy consumption and prominent manufacturing cost advantage; and the production efficiency can reach as high as 4 to 5 times of that of the prior machining method.

Provided are a paddy field environmental monitoring sampler and sampling method. The paddy field environmental monitoring sampler comprises a scale guide pipe, a pipe seat, a sealing piston, a gripping handle and a gear rack linkage device. The gear rack linkage device comprises a movable wrench, a gear rack, a shifting sheet reset spring and a movable shifting sheet. A pipe seat gear rack hole is formed in the middle of the pipe seat, the pipe seat is connected with the gripping handle through a screw, and the gripping handle is formed by shearing and bending an iron sheet. The shifting sheet reset spring is arrange at the left end in the gripping handle, the right end of the shifting sheet reset spring is connected with the movable shifting sheet, a shifting sheet gear rack hole is formed in the middle of the movable shifting sheet, a shifting sheet tongue is arranged on the lower portion of the movable shifting sheet, the section of the movable wrench is in a U shape, a wrench pin is arranged at the top of the movable wrench, and the left end of the wrench pin abuts against the shifting sheet tongue.

The invention discloses a U-shaped double-wall socket and spigot type pipe joint and an installing method thereof. The U-shaped double-wall socket and spigot type pipe joint comprises a socket end anda spigot end. The socket end and the spigot end are used for being connected with the head and the tail of a common pipe section correspondingly to form a unit pipe section. The socket end is provided with a U-shaped slot formed by double layers of pipe walls. The spigot end is formed by a single layer of threadless round pipe wall. A buckle is arranged between the socket end and the spigot end.When pipe sections are connected in a sleeved mode, one spigot end is inserted in the corresponding U-shaped slot and is connected with the corresponding socket end through the corresponding buckle. The deficiency of a traditional plastic pipeline socket and spigot type joint is overcome, the anti-seismic effect is good, vertical rigidity is high, leakproofness is good, and installation is convenient and fast.

The invention relates to the technical field of varnished wire processing and forming equipment, in particular to a continuous paint scraping production line which comprises a first base and a conveying pipeline, and the conveying pipeline is arranged on the first base in the length direction of the first base. The scraping mechanism comprises a second base, a scraping assembly and a first abutting piece, the second base is arranged on the first base, the scraping assembly is rotationally arranged in the second base, and the first abutting piece is elastically connected with the scraping assembly; the traction mechanism is arranged at one end of the first base in the length direction of the first base. The linkage mechanism is arranged in the first groove, and the traction mechanism drivesthe scraping mechanism to perform intermittent paint scraping on the enameled wire through the linkage mechanism; according to the production line, while the traction mechanism clamps the enameled wire and pulls the enameled wire forward, the linkage mechanism drives the scraping mechanism to scrape paint on the enameled wire, and when the traction mechanism loosens the enameled wire, the scraping mechanism does not scrape paint on the enameled wire, so that intermittent paint scraping of the enameled wire is realized, and the length of a scraped area is fixed.

The invention provides a semiconductor layer surface roughening method. The semiconductor layer surface roughening method comprises steps: a semiconductor layer is provided, and the semiconductor layer is a nitride semiconductor layer; a solid metal or alloy film is formed on the semiconductor layer; annealing is carried out for preset time at a preset temperature higher than the melting point of the metal or the alloy thus the metal or alloy film is liquefied into a plurality of metal or alloy liquid drops, then the temperature is lowered to a temperature lower than the melting point of the metal or the alloy, thus the plurality of metal or alloy liquid drops are condensed into a plurality of metal or alloy island-shaped projections; the plurality of metal or alloy island-shaped projections are employed as a mask layer, and a concave-convex structure is etched on the layer top surface of the semiconductor and a roughed surface is formed; the plurality of metal or alloy island-shaped projections are removed. The semiconductor layer surface roughening method is advantageous in that the uniformity is good, and the method is stable and reliable. The invention also provides a formation method for an LED structure with a roughened surface.

The invention relates to low vacuum glass. The low vacuum glass is characterized in that each of upper glass and lower glass is convex glass, an edge sealing strip frame is arranged at the welded periphery of the upper glass, an edge sealing groove is formed at the welded periphery of the lower glass, and the upper glass and the lower glass are welded together by utilizing glass solder in a high-temperature edge sealing furnace; and the manufacturing of the low vacuum glass is simpler and more convenient, and the matching of the edge sealing strip frame and the edge sealing groove can ensure a good sealing effect. The method has the advantages of simpleness in manufacturing process, low cost, high production efficiency, reliability in sealing and connecting and good sealing effect; the one-step large-batch preparation of the low vacuum glass can be realized by utilizing the technology, and the manufactured low vacuum glass is strong in resistance to wind pressure and good in heat insulation and sound insulation; and the method can be used for manufacturing the ordinary low vacuum glass and is particularly suitable for manufacturing tempered low vacuum glass.

The invention discloses low-altitude glass. The low-altitude glass is characterized in that upper glass and lower glass are convex; the welding periphery of the upper glass is provided with an edge sealing strip frame, and the welding periphery of the lower glass is provided with an edge sealing groove; and the upper and lower glass are welded together by metal or alloy solders in a microwave oven, so that the low-altitude glass is simpler and more convenient to manufacture, and a sealing effect is ensured by the embedding combination of the edge sealing strip frame and the edge sealing groove. A manufacturing method of the low-altitude glass provided by the invention is simple in process, low in cost and high in production efficiency, can ensure reliable sealing connection and the good sealing effect, can be used for manufacturing low-altitude glass in mass by virtue of a one-step method, and not only can be used for manufacturing common low-altitude glass, but also is particularly suitable for manufacturing of tempered low-altitude glass; and the low-altitude glass manufactured by the method is high in wind pressure resistance and good in heat insulation and sound insulation.

The invention discloses a super-junction device. A P type semiconductor thin layer is divided into two layers; one layer at the bottom is formed by a P type ion implantation zone; and the other layer at the top is formed by P type silicon filling a deep trench. The depth of the whole P type thin layer is decided by the longitudinal distance between the bottom surface of the bottom layer and the top surface of the top layer, thereby eliminating the influence on the depth of the P type thin layer by the depth change of the deep trench, realizing precise controlling of the depth of the P type thin layer and improving uniformity of the depth, and enhancing the breakdown voltage of the device. The depth changing range of the deep trench is determined by the depth the P type ion implantation zone of the bottom layer, thereby substantially expanding the process window of the deep trench, reducing the complexity of the process and the process cost, and meeting the requirement of continuous improvement of the carrier concentration of the P type semiconductor thin layer and the N type semiconductor thin layer. The N type epitaxial layer with high concentration can be used and a super-junction device with lower-ratio on resistance can be obtained. In addition, the invention also discloses a manufacturing method of the super-junction device.

The invention discloses a transplanting device for double-ridge green Chinese onions. The transplanting device comprises a bottom plate, wherein a seat is arranged on the upper surface of the left end of the bottom plate, two transplanting mechanisms are arranged on the right side of the seat, each transplanting mechanism comprises a sliding cylinder, a fixing plate, a first electric telescopic rod, a first connecting rod, a second connecting rod and a duckbill, and two grooving devices are arranged on the right side of each sliding cylinder; each grooving device comprises a grooving cutter, a vertical rod and a threaded sleeve, a cushioning mechanism is arranged below the seat and comprises a fixing frame, a first spring and a second baffle, and buffering devices are fixedly connected to the lower surface of the bottom plate in a bilateral symmetry mode; and each buffering device comprises a buffering frame, a sliding block, a first sliding groove, a first sliding block, a second spring, a first supporting rod, a second supporting rod, a third spring, a fixing block, a sliding rod, a second sliding block, a fourth spring, a third supporting rod, a fifth spring, a second sliding groove and a third sliding block. The transplanting device is novel in structure, convenient to operate and good in transplanting effect, and the working efficiency is improved.

The invention provides a punching machine capable of automatically controlling punching depth. The punching machine comprises a base, a motor and a control device, a power output shaft of the motor is connected with an inner cooling joint, the inner cooling joint is connected with a hollow drill bit, a support is mounted on the base, a lifting air cylinder is disposed on the support, the lifting air cylinder is connected with the control device, the motor is fixedly connected with the support, a working table is disposed on the base, and a clamping mechanism is disposed on the working table. The punching machine capable of automatically controlling punching depth has the advantages that the lifting air cylinder is disposed on the support, the control device is connected with the lifting air cylinder, the height of the lifting air cylinder is controlled through the control device, thereby, the punching depth of the hollow drill bit is controlled, the punching depth is accurately controlled, the inner cooling joint is arranged and provided with a water inlet and a water outlet, tap water can flow in the hollow drill bit so as to cool the hollow drill bit, abrasion of the drill bit is reduced, and the service life of the drill bit is prolonged.

The invention provides a device for simulating the walls and the bottom of towing tanks, which belongs to the technical field of tank test. The device mainly comprises a tank wall support frame, a tank wall simulation apparatus and a tank bottom simulation apparatus. The tank wall support frame is directly fixed on the tank wall. The tank wall simulation apparatus is fixed on the tank wall supportframe by an aluminum profile and a right angle connector. The bottom of the tank wall simulation apparatus is arranged with the tank bottom simulation apparatus, and is composed of a tank bottom apparatus and a lifting apparatus. The upper end of the lifting apparatus is connected with the tank wall support frame, and the lower end is connected with the tank bottom apparatus. The device for simulating the walls and the bottoms of towing tanks is mainly used for simulating the walls and the bottoms of tanks such as towing tanks and deepwater tanks, and is convenient for shallow water tests andblocking tests of structures on the basis of existing tank laboratories. The device has the advantages of fast installation speed, simple operation, good stability, various functions, low cost and the like, which effectively expands the test functions of existing tanks, and makes tanks develop in the direction of functional diversities.

A ground subsidence monitoring device for subway tunnel construction comprises a support, and a driving-in and pulling-out assembly installed on the support and carrying out driving-in and pulling-outin a rotating mode. Through the driving-in and pulling-out assembly, a monitoring assembly can be rapidly inserted into a required depth, the depth of the monitoring assembly can be accurately controlled, and the practicability of the equipment is improved. The ground subsidence situation can be known by observing the positions of a first sliding rod and a device on the first sliding rod. Becauseof the action amplification effect of a large gear and a small gear, the upward moving height of a second rack is larger, and the ground subsidence situation can be better reflected.

The invention relates to a method for enhancing the ohmic contact of a gallium oxide semiconductor device. The method comprises the following steps of defining a pattern of which an ohmic contact region needing to be enhanced on the upper surface of a gallium oxide substrate by adopting a photoetching process, exposing the region, and shielding the residual region by using a photoresist; injectingthe doping ions into the upper surface of the substrate; removing the photoresist on the upper surface of the gallium oxide substrate; performing heat treatment; defining and forming a pattern of a metal electrode region by adopting the photoetching process, exposing the region, and shielding other regions by using the photoresist; forming a metal electrode on the upper surface of the gallium oxide substrate; removing the photoresist on the upper surface of the gallium oxide substrate; carrying out the fast annealing treatment. According to the method for enhancing the ohmic contact of the gallium oxide semiconductor device, the doping range, the concentration and the depth of the ohmic contact region can be accurately controlled, the preparation process is simple, the ohmic contact of the gallium oxide semiconductor device can be effectively enhanced in combination with thermal annealing treatment after injection, and the gallium oxide semiconductor device with good ohmic contact isformed.

The invention discloses exposed-aggregate concrete and a construction method thereof, and relates to the technical field of concrete construction. The exposed-aggregate concrete is prepared from the following exposed-aggregate concrete raw materials in parts by weight: 250-300 parts of cement, 1100-1200 parts of coarse aggregate, 750-850 parts of fine aggregate, 80-120 parts of mineral powder, 8-12 parts of a water reducing agent and 140-180 parts of water. Raw materials of the exposed-aggregate concrete further comprise an exposed-aggregate agent, and the exposed-aggregate agent is prepared from the following raw materials in parts by weight: 0.04 to 0.08 part of glucose, 0.025 to 0.045 part of sodium hexametaphosphate, 0.001 to 0.005 part of amantadine hydrochloride and 0.35 to 0.45 partof dissolving water. The exposed-aggregate concrete has the advantages of good retarding effect and good environmental protection performance. The construction method of the exposed-aggregate concrete comprises the following steps of exposed-aggregate agent preparation, concrete preparation, pavement pouring, pavement maintenance and the like. The construction method of the exposed-aggregate concrete has the advantage that the retarding effect of the product is conveniently improved.

The invention discloses a full-automatic drinking water pipe assembling machine and a drinking water pipe assembling method. At the present stage, most nipple-type drinking water pipes are still assembled manually, the labor intensity is high, and the labor efficiency is low. The full-automatic drinking water pipe assembling machine disclosed by the invention comprises a drinking water pipe feeding device, a drilling and tightening device and a drinking water device feeding device; the drinking water pipe feeding device, the drilling and tightening device and a finished product automatic discharging device are sequentially connected end to end; the drinking water device feeding device is arranged at the side part of the drilling and tightening device; the drilling and tightening device comprises a drilling and tightening rack, a drinking water pipe pulling mechanism, a drinking water pipe transition mechanism, a tightening mechanism and a drilling mechanism; the drinking water pipe pulling mechanism is mounted at the top of the drilling and tightening rack; the drilling mechanism and the tightening mechanism are both located below the drinking water pipe pulling mechanism. The full-automatic drinking water pipe assembling machine can realize the nipple-type drinking water pipe feeding, drilling, drinking water device feeding and discharging in a full-automatic mode, and can adapt to drinking water pipes with different drinking water device intervals and different lengths.

The invention discloses a quick soil taking device for civil engineering, and relates to the technical field of civil engineering. The quick soil taking device comprises a supporting plate; four positioning frames are arranged on the upper surface of the supporting plate, and sliding devices are arranged on the upper surfaces of the positioning frames; and the top ends of the sliding devices are fixedly connected with the lower surface of a pressing plate. According to the quick soil taking device for civil engineering, through mutual cooperation among a first sliding rod, a jacking block, a contact block, a second sliding rod, positioning teeth, the positioning frames, a spiral blade and a driving motor, at the moment, the positioning teeth can move into soil, and thus the device can be positioned; at the moment, an electric hydraulic rod can be controlled to extend to drive a collecting cavity and the spiral blade to move downwards to the appropriate depth; at the moment, the drivingmotor can be controlled to work to take the soil; and in the using process of the device, the positioning frames do not need to be manually moved to the deep position of the soil to take out the soil, meanwhile the downward moving depth of the collecting cavity can be accurately controlled, and thus the soil taking process is more accurate and quicker.

The invention discloses low-altitude glass. The low-altitude glass is characterized in that upper glass and lower glass are convex; the welding periphery of the upper glass is provided with an edge sealing strip frame, and the welding periphery of the lower glass is provided with an edge sealing groove; and the upper and lower glass are welded together by metal or alloy solders in a high-temperature edge sealing furnace, so that the low-altitude glass is simpler and more convenient to manufacture, and a sealing effect is ensured by the embedding combination of the edge sealing strip frame and the edge sealing groove. A manufacturing method of the low-altitude glass provided by the invention is simple in process, low in cost and high in production efficiency, can ensure reliable sealing connection and the good sealing effect, can be used for manufacturing low-altitude glass in mass by virtue of a one-step method, and not only can be used for manufacturing common low-altitude glass, but also is particularly suitable for manufacturing of tempered low-altitude glass.

The invention provides an automatic thoracentesis suction device which comprises a puncture needle. The automatic thoracentesis suction device is characterized in that a liquid-column pressure suction device is connected onto the puncture needle, is arranged vertically and is lower than the puncture needle. The automatic thoracentesis suction device has the advantages that the automatic thoracentesis suction device can be operated easily and conveniently and is convenient and sanitary, labor is saved, fatigue of operators is prevented owing to the fact that hydrops are automatically sucked under the negative pressure, the hydrops can be prevented from being contaminated, environments can be prevented from being polluted by the hydrops, and patients are prevented from being accidentally injured.

The invention relates to the technical field of building construction, in particular to a punching device and a punching method for foundation horizontal bar planting. The punching device comprises an adjustable base support, a sliding frame and a stroke control mechanism, wherein height of the adjustable base support can be adjusted, and the adjustable base support can be used for being placed on the ground or a surface of a building foundation; the sliding frame is installed on the adjustable base support in a sliding mode, and a handheld electric drill is detachably connected with the sliding frame; and the stroke control mechanism is connected with the adjustable base support and the sliding frame, and the stroke control mechanism is used for controlling a moving distance of the sliding frame relative to the adjustable base support. The punching method comprises the steps that S1, height and levelness of the adjustable base support are adjusted; S2, the handheld electric drill is installed; S3, the handheld electric drill is started; and S4, a driving push rod pushes the handheld electric drill to accurately drill holes. According to the invention, the operation efficiency can be improved, the safety risk is reduced, the punching depth is accurately controlled, and the construction quality is guaranteed.

The invention discloses a heat treatment method for an 18CrNi4A steel spiral bevel gear. The heat treatment method comprises the following steps that (1) copper plating protection is carried out on parts, except a tooth part, of a workpiece; (2) first carburizing treatment is carried out on the workpiece; (3) copper is removed from the whole workpiece, and then copper plating protection is carried out on other parts of the workpiece except the tooth part and the outer circle; (4) the workpiece is subjected to second carburizing treatment; and (5) quenching is carried out on the workpiece, then subzero treatment is carried out on the workpiece, and then tempering treatment is carried out. According to the method, the process control problem of different carburizing depths of different parts in the prior art is solved, the problem of low precision of two-time carburizing depth control is solved, a two-time carburizing superposition technology is adopted, and quenching-subzero treatment-tempering treatment is performed after carburizing, so that different requirements of different parts of the workpiece on the carburizing depths can be met, the carburizing depth of each part can be accurately controlled, and the performance requirement of the carburized workpiece can be ensured.

The invention discloses a soil sampler and a soil sampling method, and relates to the technical field of soil research. The soil sampler comprises a cutting ring and a loop bar, the cutting ring is fixedly connected to the lower end of the loop bar, and the cutting ring and / or the loop bar are / is provided with scales; the device further comprises a power assisting assembly, the power assisting assembly comprises an upper clamping plate, a lower clamping plate and a linear driving mechanism, the upper clamping plate is detachably connected with the sleeve rod, the lower clamping plate is detachably connected with the cutting ring, and the linear driving mechanism is located between the upper clamping plate and the lower clamping plate. And the upper clamping plate and the lower clamping plate are driven by the linear driving mechanism to be relatively far away from or close to each other, so that the depth of the cutting ring inserted into the soil can be accurately controlled, and the soil structure and nutrient measurement accuracy is improved. The soil sampling method is based on the soil sampler, the depth of the cutting ring inserted into the soil can be accurately controlled, and meanwhile, the soil sample in the cutting ring can be taken out under the condition that the soil structure is prevented from being damaged.