The invention discloses an embedded sensing
chip encapsulation structure with a vertical through hole and a manufacturing method of the embedded sensing
chip encapsulation structure and belongs to the fields of
integrated circuit encapsulation technologies, sensor technologies and the like. The manufacturing method comprises the steps that
dielectric coating is performed on a complete sensor
chip; wiring is performed on the surface of a
dielectric, and the interior of the
dielectric is drilled to be filled with
conductive materials; a bonding pad on the surface of the sensor chip is led to a
metal soldered ball on the reverse of the dielectric material and is interconnected with the outside through the
metal soldered ball. According to the encapsulation structure, wiring is performed on the surface and the interior of the dielectric material, the operations like step
etching on the sensor chip itself are avoided, and secondary encapsulation of surface-mounted glass,
sapphire and other elements of the sensor chip is facilitated. Besides, through the structure, the cost is lowered, and the encapsulation yield and the reliability of products are improved.