Embedded sensing chip encapsulation structure with vertical through hole and manufacturing method thereof

Abstract

The invention discloses an embedded sensing chip encapsulation structure with a vertical through hole and a manufacturing method of the embedded sensing chip encapsulation structure and belongs to the fields of integrated circuit encapsulation technologies, sensor technologies and the like. The manufacturing method comprises the steps that dielectric coating is performed on a complete sensor chip; wiring is performed on the surface of a dielectric, and the interior of the dielectric is drilled to be filled with conductive materials; a bonding pad on the surface of the sensor chip is led to a metal soldered ball on the reverse of the dielectric material and is interconnected with the outside through the metal soldered ball. According to the encapsulation structure, wiring is performed on the surface and the interior of the dielectric material, the operations like step etching on the sensor chip itself are avoided, and secondary encapsulation of surface-mounted glass, sapphire and other elements of the sensor chip is facilitated. Besides, through the structure, the cost is lowered, and the encapsulation yield and the reliability of products are improved.

Description

technical field [0001] The invention relates to technologies such as microelectronic package technology, sensor technology and chip interconnection. Background technique [0002] With the continuous improvement of the intelligence of terminal products, various sensor chips emerge in endlessly. Sensor chips have expanded the application fields of smart phones, tablet computers and other products. For example, the emergence of fingerprint recognition chips has greatly improved the security of the above products. [0003] For the sensor chip, its biggest feature is that there is a sensing area on the surface of the chip, which interacts with the external stimulus to be recognized to generate electrical signals that the chip can recognize and process. The distance between this area and external stimuli should be as short as possible so that the generated signal can be detected. In many current chip technologies, the chip pads are generally located on the same surface. If the c...

AI Technical Summary

Problems solved by technology

The bonding pad of the sensor chip is located below the slope where the silicon substrate is located, avoiding the influence of the bonding wire on the distance between the sensing area and the outside of the package. However, similarly, manufacturing steps, thinning, and metal wiring on the silicon substrate High cost, low yield rate, and long-term reliability risks of products

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