37results about How to "Avoid Impedance Mismatches" patented technology

Apparatus and method to detect corrosion in metal junctions. Corroded metal junctions are usually discovered by visual inspection. The present invention detects corrosion in metal junctions when it is not visually apparent. A corroded metal junction acts as a nonlinear device. It generates harmonics and other nonlinear products (such as intermodulation) of any signals applied to the junction. The presence of relatively high level harmonics and / or intermodulation products indicates directly that corrosion has occurred. To detect corrosion in a metal junction, one couples a fundamental frequency signal (f0) into the junction and tests for harmonics of that frequency, especially the third harmonic. Harmonic frequency signals that are relatively large (i.e., above the harmonics generated by the testing system) indicate the presence of corrosion. Measurements to determine if a metal junction is corroded are performed without disturbing the junction.

An inner conductor terminal (10) is made of a metal plate and includes tubular first terminal portion (11) and second terminal portion (12) each having an opening end. A bent portion (15) links the first and second terminal portions (11, 12) and covers the respective opening ends of the first and second terminal portions (11, 12) by facing the openings. A tab (13) projects from an end of the first terminal portion (11) opposite to the opening end, and a lead (14) projects from an end part of the second terminal portion (12) opposite from the opening end. The inner conductor terminal (10) includes two side panels (16) projecting from the second terminal portion (12) to be located at both sides of the bent portion (15) and covering a clearance between the bent portion (15), the first terminal portion (11) and the second terminal portion (12) from both sides.

An optical subassembly includes: a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface; a pair of lead terminals fixed in the two respective penetration holes and passing through the pair of penetration holes; a wiring board with a pair of wiring patterns arranged on a surface; and a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns. A cross section of the pair of lead terminals on the inner surface side is larger than a cross section on the outer surface side. End faces on the inner surface side are situated within a range from +180 μm to −100 μm to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface.

A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surface with at least one chip contact thereon. The chip is accommodated inside the cavity with at least one sidewall having contact with one of the sidewalls of the cavity. The active surface of the chip and the first surface of the substrate are coplanar. The conductive trace runs from the active surface of the chip to the first surface of the substrate so that the chip contact and the substrate contact are electrically connected.

A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surface with at least one chip contact thereon. The chip is accommodated inside the cavity with at least one sidewall having contact with one of the sidewalls of the cavity. The active surface of the chip and the first surface of the substrate are coplanar. The conductive trace runs from the active surface of the chip to the first surface of the substrate so that the chip contact and the substrate contact are electrically connected.

The invention discloses a radio frequency circuit board and a manufacturing method of the radio frequency circuit board, and relates to the technical field of radio frequency modules for wireless communication, so as to reduce the debugging cycle of the radio frequency module when solving the impedance mismatch problem of the output port of the radio frequency module. The radio frequency circuit board includes: a radio frequency chip, a first transmission structure, a radio frequency module, a second transmission structure and a circuit board body. The radio frequency chip is arranged in the first area of ​​the radio frequency module, and is electrically connected with the radio frequency module through the first transmission structure. The first transmission structure transmits the radio frequency signal sent by the radio frequency chip to the radio frequency module, and its characteristic impedance meets the target impedance range. The radio frequency module is arranged in the second area of ​​the circuit board body, and is electrically connected with the circuit board body through the second transmission structure. The second transmission structure transmits the radio frequency signal to the circuit board body, and its characteristic impedance meets the target impedance range. The radio frequency circuit board provided by the invention is used for radio frequency module technology of wireless communication.

The invention discloses an intermediate-frequency modulation signal demodulation method and device. The intermediate-frequency modulation signal demodulation method comprises the steps that two signals, namely a narrow-band modulation signal and a local oscillation signal, are directly mixed through a mixing and filtering module, intermediate-frequency band-pass filtering is conducted on the mixed signals to obtain baseband signals, and the baseband signals are digitized to obtain disperse baseband signals before separation. Therefore, the inconsistency and stability problems of an analog device or the impedance mismatch problem of circuit board lines can be avoided, separating correction, interpolating operation and delayed calculation are conducted on the disperse signals through a separating correction module and an operation module. Compared with the prior art, high-precision I and Q baseband signals at the same moment can be obtained, namely the I and Q signals approach to be consistent in gain, and approach to be orthogonal in phase.

The present invention provides a power divider combiner, feed network and electric adjustable antenna, including: a power divider circuit and a combiner circuit; the power divider circuit includes a power divider circuit main body and multiple power divider circuit branches, and the power divider circuit main body includes At both ends, each branch of the power dividing circuit is respectively connected to the first end of the main body of the power dividing circuit; The two combined circuit branches correspond to different frequency bands; each combined circuit branch is composed of multiple microstrip lines with different widths. The power divider combiner, feed network and electric adjustment antenna provided by the present invention, when the signal is transmitted through the divider of the combiner circuit, impedance matching is performed with each microstrip line in the divider of the combiner circuit, and the power divider combiner The impedance of the device is kept within the deviation range of the standard impedance, so that the phenomenon of impedance mismatch can be avoided, the fluctuation of the standing wave ratio in the branch of the combining circuit can be reduced, and the stability of signal transmission can be improved.

A driving circuit used in a transmission line includes an operational amplifier and an output circuit. The operational amplifier is used for receiving a voltage signal to generate an output. The output circuit is coupled to the operational amplifier and used for receiving the output of the operational amplifier and determining current(s) passing through the output circuit to generate an output signal of the driving signal so as to adjust the output impedance of the driving circuit to match the transmission line; the output impedance of driving circuit is adjustable and determined by the current(s) passing through the output circuit.

The present invention provides a borehole ultrasonic piezoelectric transducer and a borehole ultrasonic logging instrument, wherein the borehole ultrasonic piezoelectric transducer includes a casing, and the casing is provided with a positive electrical connector and a negative electrical connector; The piezoelectric composite sheet arranged in the housing, the two ends of the piezoelectric composite sheet are respectively provided with a metal positive electrode and a metal negative electrode, the metal positive electrode is connected to the positive electrical connector, and the metal negative electrode Connect the negative electrode connector; the matching layer group arranged on the metal positive electrode side of the piezoelectric composite sheet; the backing damping block arranged on the metal negative electrode side of the piezoelectric composite sheet, the back The lining damping block absorbs the ultrasonic energy radiated backward by the piezoelectric composite sheet. The borehole ultrasonic logging tool includes the borehole ultrasonic piezoelectric transducer. The invention reduces the acoustic impedance of the vibrating chip by the piezoelectric composite material, and solves the impedance mismatch between the downhole transducer and the propagation medium with a multi-layer matching layer structure.

A display panel including a pixel array substrate, an opposite substrate, and a display media is provided. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units, and a gate driving circuit. The gate driving circuit including a plurality of first signal lines, a plurality of second signal lines, a plurality of dummy signal lines, and a plurality of contact structures is disposed in a peripheral region of the substrate. Each of the second signal lines is electrically connected to one corresponding first signal line. Each of the dummy signal lines is electrically connected to one corresponding second signal line via one corresponding contact structure. Each of the first signal lines is electrically connected to the corresponding second signal line via one corresponding contact structure.

According to embodiments of the present invention, an image display apparatus comprises: a display panel including a panel substrate, and an electrode structure and an insulating structure stacked onthe panel substrate; a touch sensing structure disposed on the display panel; and an antenna electrode layer disposed on the display panel at the same level as the sensing structure and at least partially overlapping the electrode structure of the display panel in a thickness direction. Therefore, a thin and highly reliable image display apparatus can be implemented by disposing the antenna electrode layer in consideration of electrode structures of the display panel and the touch sensing structure.

The invention discloses a radio frequency circuit board and a manufacturing method thereof, relates to the technical field of wireless communication radio frequency modules, and aims to reduce the debugging period of the radio frequency module while solving the problem of impedance mismatch of an output port of the radio frequency module. The radio frequency circuit board comprises a radio frequency chip, a first transmission structure, a radio frequency module, a second transmission structure and a circuit board body. The radio frequency chip is arranged in the first area of the radio frequency module and electrically connected with the radio frequency module through the first transmission structure; and the first transmission structure transmits a radio frequency signal sent by the radio frequency chip to the radio frequency module, and the characteristic impedance of the radio frequency chip meets the target impedance range. The radio frequency module is arranged in the second area of the circuit board body and electrically connected with the circuit board body through the second transmission structure; and the second transmission structure transmits the radio frequency signal to the circuit board body, and the characteristic impedance of the radio frequency module meets the target impedance range. The radio frequency circuit board provided by the invention is used for a wireless communication radio frequency module technology.

The invention discloses a dielectric resonator antenna module and a communication terminal. The dielectric resonator antenna module comprises a dielectric resonator, a plastic clamp and a PCB. The plastic clamp is used for clamping the dielectric resonator, and the dielectric resonator penetrates through the plastic clamp; the plastic clamp is fixed on one side of the PCB; one side of the PCB is completely attached to one side of the dielectric resonator; and according to the antenna module, the clamp is introduced, and the dielectric resonator is fixed on the PCB through the clamp, so that the dielectric resonator and the PCB are completely attached; the mode is different from an existing integration mode of the dielectric resonator and the PCB, and gaps caused by uncontrollable factors such as glue or welding tin materials between the dielectric resonator and the PCB are avoided, so that impedance mismatch can be prevented and the reliability of the antenna can be improved in a millimeter wave frequency band, and meanwhile, the clamp is made of a plastic material and can also expand the bandwidth of the antenna.

The invention discloses an electro optical phase modulator with a frequency state feedback function. The modulator comprises a power extraction unit, a power detection unit, a feedback signal generation unit and an electro optical phase modulation crystal, wherein the electro optical phase modulation crystal modulates the phase of an input light beam; the power extraction unit extracts a power signal and a drive signal in the drive signal output from a modulation signal source and the power signal of an interference signal of a reflection signal obtained by reflecting the drive signal through the electro optical phase modulation crystal; the power detection unit converts the power signal into an electric signal; the feedback signal generation unit generates feedback information according to the electric signal and feeds the feedback information back to the modulation signal source; and the modulation signal source regulates the drive signal according to a feedback signal so as to keep the frequency value of the drive signal close to the resonance frequency of the phase modulator.

The invention relates to the field of radio frequency and microwave measurement, and discloses a test fixture to solve the technical problems in the prior art that the test fixture either easily causes damage to the device under test or has a narrow test bandwidth. The test fixture includes: a first test circuit , the first Stan transformation gradient microstrip line, the second Stan transformation gradient microstrip line and the second test circuit, wherein the first test circuit comprises a first 90° hybrid bridge and a second 90° hybrid bridge, and the second test circuit Contains the third 90° hybrid bridge and the fourth 90° hybrid bridge, the four 90° hybrid bridges can not only play the role of RF open circuit, so as to prevent impedance mismatch, but at the same time, the four 90° hybrid bridges and the two The Stein transform gradient microstrip line can also expand the radio frequency bandwidth, thereby achieving the technical effect of improving the radio frequency test bandwidth while ensuring the safety of the device under test.

The invention discloses a low-power multi-load wireless powered adaptive DC voltage stabilizing system which comprises an adjustable high-frequency power supply system, an energy emission main resonator, a wireless power supply coil array, an adjustable high-frequency compensation capacitor, a multi-energy conversion type DC stabilizing system, a voltage acquisition feedback module and a multi-load array, wherein the multi-energy conversion type DC stabilizing system supplies energy to the load through an energy conversion mode of electromagnetic energy-magnetic potential energy-mechanical energy-electric energy. The low-power multi-load wireless powered adaptive DC voltage stabilizing system solves the problems that a low-power load node is unstable in power supply voltage and is limited in the power supply mode, particularly solves the problems that the sensor node or implantable equipment of human body and the like under an Internet of things system are difficult in power supply and troublesome in battery replacement; the system is stable in power supply performance, has no characteristics of virtual-high voltage turn-off and over-current conduction in a conventional rectification and voltage-stabilizing system, and is high in anti-interference ability.

A semiconductor package substrate including a substrate body having a front surface configured for mounting a semiconductor chip on the front surface and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body.