66results about How to "Reduce electrical connections" patented technology

First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

The laser diode of the present invention is mounted on the heat sink made of insulating material such as aluminum nitride (AlN). On the heat sink, a metal film, evaporated gold film, is provided and the laser diode is mounted on the heat sink such that the anode electrode of the laser diode faces and is in contact with the metal film. The heat sink is mounted on the grounded metal member, thus the metal member, the heat sink and the metal film forms an capacitor. The bias for the laser diode is provided via the metal film, thereby stabilizing the bias supply even when the operational frequency for the laser diode is over 10 Gbps.

The invention discloses a water level control device of a humidifier and the humidifier applying the same. The water level control device comprises a water tank and a base of the humidifier, wherein a steam generating chamber is arranged in the base; a drain hole is formed in the water tank, and a drain valve is arranged in the drain hole; the water level control device in sleeved connection with the drain valve is arranged in the steam generating chamber, the water level control device comprises a limiting hood opened in the peripheral wall, a water outlet is formed in the top of the limiting hood, and a floating block is arranged in the limiting hood; a leak hole plug is arranged at the water outlet, and the bottom of the leak hole plug is a part in contact with the floating block; the floating block shifts up and down in the limiting hood along with change of the water level; when the floating block is in contact with the drain hole plug, the water outlet is plugged to stop draining; otherwise, the floating block is separated from the leak hole plug, and the water outlet is opened to supplement water. The water control device disclosed by the invention is simple in structure and small in occupied space, is immediately triggered to control water supplementation for the steam generating chamber, and is electric energy-saving, and the condition that the humidifier is likely to overflow or dry out is effectively avoided, so that a user can use the humidifier safely.

There is provided a downsized electrical connection box in which the reliability of the mechanical connection between blocks provided in the electrical connection box is improved. The electrical connection box 1 includes a plurality of electric components, a first block 3 mounted with the electric components and a second block mounted with the electric components. The first block 3 includes a tubular-shaped first member32, 33 projecting towards the second block 5. The second block 5 includes a second member 52, 53 arranged to be slidably inserted into the first member. The first and the second blocks 3, 5 are coupled to each other by slidably inserting the second member 52, 53 into the first member 32, 33. At least one electric component 8 of the plurality of electric components is received inside the first and the second members 32, 52, 33, 53.

A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An encapsulation body encapsulates the chip and conductive bumps while exposing ends of the conductive bumps. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the exposed ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings for exposing predetermined portions of the conductive traces. The exposed portions of the conductive traces are connected to a plurality of solder balls respectively. The conductive bumps on the bond pads of the chip allow easy positional recognition of the bond pads, making the conductive traces well electrically connected to the bond pads through the conductive bumps and assuring the quality and reliability of the semiconductor package.

A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

An electric contact of a socket for an electrical part is disposed between a first electrical part and a second electrical part so as to electrically connect the first and second electrical parts, and includes: a first electrical part side contact member contacting the first electrical part; a second electrical part side contact member contacting the second electrical part, the coil spring including a first spring portion abutting against the first electrical part side contact member and a second spring portion abutting against the second electrical part side contact member. When the first electrical part contacts the first electrical part side contact member, an axis of the first spring portion inclines with respect to an axis of the second spring portion, and then, a portion of the first electrical part side contact member on a side contacting the first electrical part is transversely moved.