FCM packaging chip machine manufacturing method, packaging chip machine and camera module product

Abstract

The invention provides an FCM packaging chip machine manufacturing method, a packaging chip machine and a camera. A small-sized camera which is provided with an FCM and does not need a circuit board comprises a lens, a base and the FCM, the FCM mainly utilizes a camera module packaging sheet (Flip Chip Module for short) which is manufactured by combining an FPC-free circuit board lead bracket and an advanced semiconductor packaging technology (Flip Chip), and the FCM is a packaging sheet module integrating an optical filter, an image chip, a driving / storage chip, an electronic component and a connector into a whole). According to the scheme, a circuit board is not needed to serve as a connection bridge any more, meanwhile, most precise assembly procedures are saved, and equipment and manpower cost investment is reduced. Moreover, the accumulated tolerance of the simplified assembly process is also reduced, the offset and inclination can be better controlled, and the product yield is improved.

Description

technical field [0001] The invention relates to the field of electronic product accessories, in particular to a small camera and a method for manufacturing the camera packaging sheet. Background technique [0002] Such as figure 1 and figure 2 as shown, figure 1 : The COB camera in the prior art, the names of the components in the figure are as follows: gold wire 11, electronic components 12 such as capacitors and resistors, circuit board 13, lens 14, base 15, optical filter 16, chip 17, connector 18; figure 2 : the CSP camera in the prior art, the part names in the figure are as follows: electronic components 22, circuit board 23, connector 24, lens 25, base 26, chip 27 such as tin ball 21, electric capacity, resistance. [0003] The main features of the conventional COB / CSP small camera module are: use the nickel-palladium-gold circuit board (FPCB) as the substrate, first use the SMT process to mount the components such as resistors, capacitors, connectors, drive / stor...

AI Technical Summary

Problems solved by technology

[0010] The flatness of the FPC material SMT cannot be controlled after the furnace, which eventually leads to poor module tilt and low yield

[0011] The use of FPC circuit boards requires the use of a large number of high-density gold wires as electrical connection carriers, resulting in high product costs

[0012] The gold wire connection method is very fragile, the production process is difficult to control, and it is easy to cause poor electrical performance, which eventually leads to a decline in product reliability

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