A manufacturing method of a high-frequency LTCC circuit module substrate comprises the following steps: (1) manufacturing an insulating medium layer of the high-frequency LTCC module substrate; (2) manufacturing LTCC composite
adhesive sheets; (3) manufacturing the high-frequency LTCC circuit module substrate. The manufacturing method has the advantages as follows: the manufacturing method is suitable for
circuit design with different
signal frequencies; a
metal material with high electrical
conductivity is used as a conductor material, so that the quality factor of a circuit
system can be favorably improved and the flexibility of the
circuit design is improved; requirements on large current, high
temperature resistance can be met, and thermal design of
electronic equipment is optimized; the high-frequency LTCC circuit module substrate is high in reliability and is applicable to a severe environment, and the service life of the substrate is prolonged; adhesion between the
copper foil
layers and the insulating medium layer is facilitated, and the
adhesive property is good; the peeling strength of the high-frequency LTCC circuit module substrate is improved, and the high-frequency LTCC circuit module substrate is especially applicable to a
high heat-resistant environment; the ranges of the thicknesses of the
copper foils can be widened; the
copper foils with different thicknesses are selected according to different load current, load power as well as intercepting capabilities of the copper
layers, so that the thicknesses of the copper
layers are utilized to the maximum extent as much as possible.