The invention relates to a
ceramic surface modifying technology, particularly relates to a method for metalizing the surface of a
ceramic profiled bar, and specifically provides a preparation method of a
ceramic circuit board... The preparation method of the ceramic circuit board comprises the preparation steps of: (1) preparing a
ceramic substrate; (2)
engraving a required circuit pattern with
laser on the surface of the
ceramic substrate; (3) in
chemical plating, and chemically plating
copper on the
ceramic substrate obtained in the step (2) to realize bottoming; and (4) chemically plating
nickel or chemically plating gold or silver on the surface of a plated layer, so as to prevent
copper from being oxidized. According to the preparation method of the ceramic circuit board provided by the invention, a
laser engraving technology is combined with chemical
copper plating, so that the ceramic board is selectively coated with copper, and the good selectivity is achieved. By using the
laser engraving technology, the
binding force of a conductive layer with a ceramic base body is good; production equipment is cheap and easy to obtain. Furthermore, the three-dimensional ceramic circuit board can be easily produced; the circuit pattern design is very simple; and the circuit precision is high. Moreover, compared with the other technologies, the preparation method provided by the invention has the
advantage that the 'three wastes' emission in a production process is reduced.