The present invention provides a thermosetting resin composition superior with respect to all characteristics of
dielectric characteristics,
heat resistance,
moisture resistance,
electrolytic corrosion resistance, adhesiveness with a
copper foil,
chemical resistance and
flame retardancy using a
halogen-free
flame retardant, its use, and for example, a prepreg, laminated board and printed wiring board. The present invention relates to: (1) a resin thermosetting resin composition comprising: (A) a
phenol-modified
cyanate ester
oligomer obtained by reacting a
cyanate compound (a) containing two or more cyanato groups in a single molecule, and (b) a
phenol compound represented by the formula (I) and / or formula (II), such that a blending
equivalence ratio of hydroxyl group (b) / cyanato group (a) is within a range of 0.01 to 0.3, and the
monomer conversation rate of
cyanate compound (a) containing two or more cyanato groups in a single molecule is 20 to 70%, (B) an
epoxy resin containing two or more
epoxy groups in a single molecule, and (C) at least one member selected from a
metal salt of a di-substituted phosphinic acid and a
phosphazene compound as a
flame retardant; (2) a thermosetting resin composition comprising: components (A), (B), (C), (D) a
silicone polymer containing at least one member of
siloxane unit selected from a tri-functional
siloxane unit represented by the formula: RSiO3 / 2 (wherein, R represents an
organic group, and the R groups in the
silicone polymer may be mutually the same or different) and a
tetra-functional
siloxane unit represented by the formula: SiO4 / 2, having a
degree of polymerization of 7,000 or less, and having one or more functional groups on its terminals that react with hydroxyl groups, and (E) an organic filler; and, a prepreg obtained by using the same, and a
metal-clad laminated board and printed wiring board obtained by using the same.