470results about How to "Small resistance" patented technology

A thermal interface material (40) includes a macromolecular material (32), and a plurality of carbon nanotubes (22) embedded in the macromolecular material uniformly. The thermal interface material includes a first surface (42) and an opposite second surface (44). Each carbon nanotube is open at both ends thereof, and extends from the first surface to the second surface of the thermal interface material. A method for manufacturing the thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material to obtain the thermal interface material with the carbon nanotubes secured therein.

A battery module is provided which includes multiple rechargeable batteries coupled together. The battery module includes multiple prismatic cell cases having short lateral walls and long lateral walls arranged side by side. Adjacent short lateral walls are integral with each other. The battery module includes holes extending through the short lateral walls of the cell cases at upper edge portions. The battery module also includes a pair of frame fittings that have base ends and protruding portions in each of the cell cases for connecting two adjacent cell cases. The protruding portions of the pair of frame fittings extend into the through holes in the upper edge portions of the short lateral walls of the cell cases from both sides and are welded together. Positive and negative electrode collector plates in the cell cases are respectively attached to the base ends of the frame fittings. End frame fittings that have base ends and protruding portions for cell cases are located at both outer ends of the rechargeable battery for connecting the cell cases to outside terminals. Connection terminals that have protruding portions are connected to the end frame fittings at both outer ends of the rechargeable battery.

A camber angle applying device is controlled to adjust the camber angle of wheels to a predetermined value. Therefore, the characteristics (or a high gripping property) of a high gripping force and the characteristic (or a low rolling resistance) of a small rolling resistance can be separately used as the performance of the wheels. By utilizing the high gripping property of the wheels, therefore, a vehicle is enabled to reduce its energy consumption, while retaining its running characteristics (such as a turning performance, an accelerating performance or a braking performance), by utilizing the rolling resistance of the wheels. Moreover, the camber angle applying device is controlled to reduce the rolling resistance of the wheels, so that the energy loss to occur in the wheels during running can be reduced to further reduce the energy consumption of the vehicle.

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars. A conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to, and extending parallel the first conductive pillars.

A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

A liquid separation device is provided, and is capable of suppressing the lowering of filtration function due to an increase in flow channel resistance of permeated liquid which results in a separation membrane falling in a groove of a permeated liquid flow channel material along with accompanied breakage of the separation membrane surface. A permeated liquid flow channel material is disposed on the back side of a separation membrane composed of a sheet-like material having a linear groove and a linear crest alternately arrayed on one surface or both surfaces, wherein a groove width of the linear groove in the sheet-like material is 10 to 200 μm, and a ratio of the groove width of the linear groove to the pitch of the linear groove is 0.45 or more.

A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.

A display device having extremely short writing time to a pixel such as the liquid crystal display device of a dot sequential drive method using a single-crystal silicon transistor as a switching element is provided in which in the case where a display area is divided into two or more areas, the degradation of picture quality is prevented to perform a high definition display. In a display device of a matrix drive method in which gate lines X in the row direction and data lines Y in the column direction are arranged in matrix shape and a pixel P is arranged at the intersection of the gate line and the data line, a display area is divided into two or more areas 1A and 1B which are driven independently from each other; wiring layout of signal lines 8A and 8B which transfer display data d to each of the areas 1A and 1B is approximately symmetrical with a division boundary line of those areas positioned in between; and control unit 12 which makes a control to perform writing of the display data at least to the pixels P next to each other with the division boundary line positioned in between at approximately the same timing.

A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars. A conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to, and extending parallel the first conductive pillars.

A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.