A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts / centimeter (MV / cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5 / centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.