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In the present invention, Ar gas for plasma generation is supplied to a plasma generation region and butyne gas having a multiple bond is supplied to a film formation region at a substrate side as source gas, inside of a process vessel in an insulating film forming apparatus. A microwave is supplied inside of the process vessel from a radial line slot antenna under a state in which a bias voltage is not applied to a substrate W. A plasma is thereby generated in the plasma generation region, the butyne gas in the film formation region is activated by the plasma, and an insulating film of amorphous carbon is formed on the substrate.

A memory device comprising a first electrode having a top side, a second electrode having a top side and an insulating member between the first electrode and the second electrode. The insulating member has a thickness between the first and second electrodes near the top side of the first electrode and the top side of the second electrode. A bridge of memory material crosses the insulating member, and defines an inter-electrode path between the first and second electrodes across the insulating member. An array of such memory cells is provided. In the array, a plurality of electrode members and insulating members therebetween comprise an electrode layer on an integrated circuit. The bridges of memory material have sub-lithographic dimensions.

A method for manufacturing a memory device comprises forming an electrode layer on a substrate which comprises circuitry made using front-end-of-line procedures. The electrode layer includes a first electrode and a second electrode, and an insulating member between the first and second electrodes for each phase change memory cell to be formed. A bridge of memory material is formed on the top surface of the electrode layer across the insulating member for each memory cell to be formed. An access structure over the electrode layer is made by forming a patterned conductive layer over said bridge, and forming a contact between said first electrode and said patterned conductive layer.

A programmable resistor memory, such as a phase change memory, with a memory element comprising narrow vertical side wall active pins is described. The side wall active pins comprise a programmable resistive material, such as a phase change material. In a first aspect of the invention, a method of forming a memory cell is described which comprises forming a stack comprising a first electrode having a principal surface with a perimeter, an insulating layer overlying a portion of the principal surface of the first electrode, and a second electrode vertically separated from the first electrode and overlying the insulating layer. Side walls on the insulating layer and on the second electrode are positioned over the principle surface of the first electrode with a lateral offset from the perimeter of the first electrode.

An object of one embodiment of the present invention is to provide a semiconductor device with a novel structure in which stored data can be stored even when power is not supplied in a data storing time and there is no limitation on the number of times of writing. The semiconductor device includes a first transistor which includes a first channel formation region using a semiconductor material other than an oxide semiconductor, a second transistor which includes a second channel formation region using an oxide semiconductor material, and a capacitor. One of a second source electrode and a second drain electrode of the second transistor is electrically connected to one electrode of the capacitor.

A memory device comprising a first electrode having a top side, a second electrode having a top side and an insulating member between the first electrode and the second electrode. The insulating member has a thickness between the first and second electrodes near the top side of the first electrode and the top side of the second electrode. A bridge of memory material crosses the insulating member, and defines an inter-electrode path between the first and second electrodes across the insulating member. An array of such memory cells is provided. The bridge comprises an active layer of memory material on the first side having at least two solid phases and a blanket of thermal insulating material overlying the memory material having thermal conductivity less than that of an overlying electrically insulating layer.

An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having higher carrier concentration than the semiconductor layer is provided intentionally between the source and drain electrode layers and the semiconductor layer, whereby an ohmic contact is formed.

In a power factor corrected AC-to-DC power supply system, a DC-to-DC power converter is coupled to the output of an AC-to-DC power converter in order to produce a regulated DC output signal from a rectified AC input signal. The AC-to-DC power converter and the DC-to-DC power converter each includes a switch for controlling the operation of their respective power converter. The AC-to-DC converter includes an inductor. The system provides power factor correction for minimizing harmonic distortion by including a controller that receives the regulated DC output voltage as a feedback signal, and in response, produces a series of drive pulses having predetermined constant duty cycle. These pulses are simultaneously fed to each switch, to operate the respective converters alternately between ON and OFF states. When the AC-to-DC converter is driven by a fixed duty cycle of the series of pulses, power factor correction is improved since the current flowing through the inductor is substantially proportional to the waveform of the rectified AC input signal. By preselecting the value of the inductor, the AC-to-DC converter is operable in a discontinuous mode when the instantaneous rectified AC input signal is low and in a continuous mode when the instantaneous rectified AC input signal is high.

A network storage device. In one embodiment, the network storage device of the present invention uses solid-state non-volatile memory (e.g., flash-memory) as a storage medium, and has at least one interface configured for coupling to a computer network. The network storage device of the present invention is accessible to client(s) and/or server(s) of the computer network, and uses solid-state non-volatile memory to store data received therefrom. The network storage device may also be configured to include a memory for caching data to be written to the solid-state non-volatile memory. In order to provide additional storage, the network storage device may also include a peripheral interface or another network interface for coupling to a mass storage device (e.g., a RAID system), and/or another network interface for coupling to a network of mass storage devices. The network storage device may be a stand-alone unit, or may be implemented as part of a network server, or as part of a mass storage device.

An organic photoelectric conversion device comprising; a lower electrode; an organic layer; and an upper electrode provided in this order, in which at least one of the lower electrode and the upper electrode is a transparent electrode and an electron is collected in a side of one of the lower electrode and the upper electrode and a hole is collected in a side of other of the lower electrode and the upper electrode so as to read out photocurrent, wherein the electrode in the side of collecting an electron is the transparent electrode and has a word function of 4.5 eV or less.

A first transistor including a channel formation region, a first gate insulating layer, a first gate electrode, and a first source electrode and a first drain electrode; a second transistor including an oxide semiconductor layer, a second source electrode and a second drain electrode, a second gate insulating layer, and a second gate electrode; and a capacitor including one of the second source electrode and the second drain electrode, the second gate insulating layer, and an electrode provided to overlap with one of the second source electrode and the second drain electrode over the second gate insulating layer are provided. The first gate electrode and one of the second source electrode and the second drain electrode are electrically connected to each other.

Provided are a transistor which has electrical characteristics requisite for its purpose and uses an oxide semiconductor layer and a semiconductor device including the transistor. In the bottom-gate transistor in which at least a gate electrode layer, a gate insulating film, and the semiconductor layer are stacked in this order, an oxide semiconductor stacked layer including at least two oxide semiconductor layers whose energy gaps are different from each other is used as the semiconductor layer. Oxygen and/or a dopant may be added to the oxide semiconductor stacked layer.

A synchronized control method for a three-phase three-level boost-type rectifier with reduced input current ripple and balanced output voltages is disclosed. The proposed control allows simplifying the control circuit as much as possible without compromising the rectifier performance. In fact, besides simplicity, the control method featured synchronized command signals to de switching devices, minimized input current ripple, full controllability of the output voltage, dynamic balance of the output center point, constant switching frequency, simplified design of EMC filters, good transient and steady state performance, and low cost. The invention described first the most important configurations that the three-phase three-level boost-type rectifier may assume and studied the converter's operation. The concept involved for output voltage, input current, neutral point balance and control system design was presented.

To improve productivity of a transistor that includes an oxide semiconductor and has good electrical characteristics. In a top-gate transistor including a gate insulating film and a gate electrode over an oxide semiconductor film, a metal film is formed over the oxide semiconductor film, oxygen is added to the metal film to form a metal oxide film, and the metal oxide film is used as a gate insulating film. After an oxide insulating film is formed over the oxide semiconductor film, a metal film may be formed over the oxide insulating film. Oxygen is added to the metal film to form a metal oxide film and added also to the oxide semiconductor film or the oxide insulating film.

The semiconductor device includes a source line, a bit line, a first signal line, a second signal line, a word line, memory cells connected in parallel between the source line and the bit line, a first driver circuit electrically connected to the source line and the bit line, a second driver circuit electrically connected to the first signal line, a third driver circuit electrically connected to the second signal line, and a fourth driver circuit electrically connected to the word line. The memory cell includes a first transistor including a first gate electrode, a first source electrode, and a first drain electrode, a second transistor including a second gate electrode, a second source electrode, and a second drain electrode, and a capacitor. The second transistor includes an oxide semiconductor material.

A high-frequency circuit for wireless communications selectively using a first frequency band and a second frequency band lower than the first frequency band, comprising an antenna terminal; first and second transmission terminals to which transmitting signals in the first and second frequency bands are input; first and second receiving terminals from which received signals in the first and second frequency bands are output; a diplexer circuit for branching a first-frequency-band-signal path and a second-frequency-band-signal path; a switch circuit for switching a path for a transmitting signal and a path for a received signal; a low-noise amplifier circuit disposed between the switch circuit and the second receiving terminal for amplifying a received signal in the second frequency band; and first and second filter circuits disposed between the antenna terminal and the low-noise amplifier circuit in this order from the antenna terminal, both filter circuits passing a received signal in the second frequency band but blocking a frequency band lower than the second frequency band, and the band blocked by the first filter circuit being lower than the band blocked by the second filter circuit.

An object is to provide a semiconductor device including a thin film transistor with excellent electrical characteristics and high reliability and a method for manufacturing the semiconductor device with high mass productivity. A main point is to form a low-resistance oxide semiconductor layer as a source or drain region after forming a drain or source electrode layer over a gate insulating layer and to form an oxide semiconductor film thereover as a semiconductor layer. It is preferable that an oxygen-excess oxide semiconductor layer be used as a semiconductor layer and an oxygen-deficient oxide semiconductor layer be used as a source region and a drain region.

An object of the present invention is to provide a semiconductor device having a novel structure in which in a data storing time, stored data can be stored even when power is not supplied, and there is no limitation on the number of writing. A semiconductor device includes a first transistor including a first source electrode and a first drain electrode; a first channel formation region for which an oxide semiconductor material is used and to which the first source electrode and the first drain electrode are electrically connected; a first gate insulating layer over the first channel formation region; and a first gate electrode over the first gate insulating layer. One of the first source electrode and the first drain electrode of the first transistor and one electrode of a capacitor are electrically connected to each other.

An object of the present invention to provide a highly reliable semiconductor device. Another object is to provide a manufacturing method of a highly reliable semiconductor device. Still another object is to provide a semiconductor device having low power consumption. Yet another object is to provide a manufacturing method of a semiconductor device having low power consumption. Furthermore, another object is to provide a semiconductor device which can be manufactured with high mass productivity. Another object is to provide a manufacturing method of a semiconductor device which can be manufactured with high mass productivity. An impurity remaining in an oxide semiconductor layer is removed so that the oxide semiconductor layer is purified to have an extremely high purity. Specifically, after adding a halogen element into the oxide semiconductor layer, heat treatment is performed to remove an impurity from the oxide semiconductor layer. The halogen element is preferably fluorine.