531results about How to "Leakage current" patented technology

A method of forming a metal nitride film using chemical vapor deposition (CVD), and a method of forming a metal contact and a semiconductor capacitor of a semiconductor device using the same, are provided. The method of forming a metal nitride film using chemical vapor deposition (CVD) in which a metal source and a nitrogen source are used as a precursor, includes the steps of inserting a semiconductor substrate into a deposition chamber, flowing the metal source into the deposition chamber, removing the metal source remaining in the deposition chamber by cutting off the inflow of the metal source and flowing a purge gas into the deposition chamber, cutting off the purge gas and flowing the nitrogen source into the deposition chamber to react with the metal source adsorbed on the semiconductor substrate, and removing the nitrogen source remaining in the deposition chamber by cutting off the inflow of the nitrogen source and flowing the purge gas into the deposition chamber. Accordingly, the metal nitride film having low resistivity and a low content of Cl even with excellent step coverage can be formed at a temperature of 500° C. or lower, and a semiconductor capacitor having excellent leakage current characteristics can be manufactured. Also, a deposition speed, approximately 20 A / cycle, is suitable for mass production.

A first doped layer of a conductivity type opposite to that of source / drain regions is formed in a semiconductor substrate under a gate electrode. A second doped layer of the conductivity type opposite to that of the source / drain regions is formed in the semiconductor substrate below the first doped layer. The first doped layer has a first peak in dopant concentration distribution in the depth direction. The first peak is located at a position shallower than the junction depth of the source / drain regions. The second doped layer has a second peak in dopant concentration distribution in the depth direction. The second peak is located at a position deeper than the first peak and shallower than the junction depth of the source / drain regions. The dopant concentration at the first peak is higher than that at the second peak.

A linear light-emitting diode (LED)-based solid-state device comprising at least two shock protection switches, at least one each at the two ends of the device, fully protects a person from possible electric shock during re-lamping with LED lamps.

A multiphase DC-DC converter architecture, in which respectively different channels have different operational performance parameters. These different parameters are selected so as to enable the converter to achieve an extended range of high efficiency. The converter contains a combination of one or more fast response time-based converter channels, and one or more highly efficient converter channels in respectively different phases thereof and combines the outputs of all the channels. The efficiency of the asymmetric multiphase converter is higher at light loads (up to approximately 12 amps), enabling it to offer longer battery life in applications that spend most of their operating time in the leakage mode, as noted above.

The method of controlling a resistance of a variable resistive element comprises a forming step for shifting the variable resistive element from an initial state after the production to a variable resistance state capable of a stable mono-polar switching action where a variable resistive characteristic of the variable resistive element is turned to a program resistive characteristic by applying a program voltage pulse to the variable resistive element for first pulse application time and to an erase resistive characteristic by applying an erase voltage pulse equal in polarity to the program voltage pulse to the variable resistive element for second pulse application time longer than the first pulse application time, wherein one or more forming voltage pulses equal in polarity to the program voltage pulse is applied to the variable resistive element for third pulse application time longer than the second pulse application time.

A switching device includes a substrate; a first electrode formed over the substrate; a second electrode formed over the first electrode; a switching medium disposed between the first and second electrode; and a nonlinear element disposed between the first and second electrodes and electrically coupled in series to the first electrode and the switching medium. The nonlinear element is configured to change from a first resistance state to a second resistance state on application of a voltage greater than a threshold.